Patents by Inventor Hirohisa Ohno

Hirohisa Ohno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220170062
    Abstract: An RNA capping method including a step of reacting a compound (1) represented by the following general formula (1) with an RNA in the presence of a Vaccinia virus capping enzyme (Rb1 represents an oxo group, an alkoxy group, or a halogen atom; Rb2 is either absent or represents an alkyl group; Rb3 represents an amino group or a hydrogen atom; Rb4 is either absent or represents a hydrogen atom or an alkyl group; Rr1 represents a hydroxy group, an alkoxy group having 1 to 3 carbon atoms, an amino group, an azide group, —OR1C?CH, or —R2R3; Rr2 represents a hydrogen atom, a hydroxy group, a halogen atom, an alkoxy group, an amino group, an azide group, —OR1C?CH, or —R2R3; and A1 represents an oxygen atom or a sulfur atom).
    Type: Application
    Filed: April 2, 2020
    Publication date: June 2, 2022
    Inventors: Hirohide SAITO, Hirohisa OHNO, Sae AKAMINE
  • Patent number: 8366454
    Abstract: In an electrical component socket, an electrical component can be removed easily even if a fixed contact potion bites into an electrical component terminal. In the electrical component socket (11), a floating plate (14) to accommodate an IC package (12) is provided in a socket body to be able to move up and down, and is biased upward by a biasing member. In a movable contact piece (15b) of a contact pin (15), a pressing projecting piece (15m) is formed. In the floating plate (14), a pressed part (14m) to be pressed by the pressing projecting piece (15m) is formed. When the movable contact piece (15b) is elastically deformed in an opening direction and a movable contact part (15g) separates from an IC lead (12b), the floating plate (14) rises upward by the biasing member, and the IC lead (12b) separates from a fixed contact part (15d).
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: February 5, 2013
    Assignee: Enplas Corporation
    Inventor: Hirohisa Ohno
  • Publication number: 20110159714
    Abstract: In an electrical component socket, an electrical component can be removed easily even if a fixed contact potion bites into an electrical component terminal. In the electrical component socket (11), a floating plate (14) to accommodate an IC package (12) is provided in a socket body to be able to move up and down, and is biased upward by a biasing member. In a movable contact piece (15b) of a contact pin (15), a pressing projecting piece (15m) is formed. In the floating plate (14), a pressed part (14m) to be pressed by the pressing projecting piece (15m) is formed. When the movable contact piece (15b) is elastically deformed in an opening direction and a movable contact part (15g) separates from an IC lead (12b), the floating plate (14) rises upward by means of the biasing member, and the IC lead (12b) separates from a fixed contact part (15d).
    Type: Application
    Filed: December 22, 2010
    Publication date: June 30, 2011
    Inventor: Hirohisa OHNO