Abstract: The disclosure provides a pharmaceutical composition containing an anti-IgE antibody that suppresses the production of allergen-specific IgE antibodies and methods of use thereof.

Abstract: The disclosure provides a pharmaceutical composition containing an anti-IgE antibody that suppresses the production of allergen-specific IgE antibodies and methods of use thereof.

Abstract: Provided is a joined body including a piezoelectric substrate and a polycrystalline spinel substrate provided on one main surface of the piezoelectric substrate, wherein a ratio T1/T2 between T1 and T2 is 0.1 or less, where the T1 represents an average thickness of the piezoelectric substrate and the T2 represents an average thickness of the polycrystalline spinel substrate, and the polycrystalline spinel substrate has a TTV of 1.5 ?m or less in a main surface which contacts the piezoelectric substrate.

Abstract: Provided is a joined body including a piezoelectric substrate and a polycrystalline spinel substrate provided on one main surface of the piezoelectric substrate, wherein the polycrystalline spinel substrate has a porosity of 0.005% or more and 0.6% or less.

Abstract: The present invention provides an egg allergy prevention method to be carried out with respect to a human infant, including: a first administration period (first administration step) in which to administer, to an infant, heated egg white protein in an amount of 10 mg to 20 mg per day; and a second administration period (second administration step) which is a period after the first administration period and in which to administer, to the infant, the heated egg white protein in an amount of 65 mg to 90 mg per day.

Abstract: A printed circuit board according to one embodiment of the present invention is a printed circuit board including a plate-shaped or a sheet-shaped insulating material having a penetrating hole, and a metal plating layer layered on both surfaces of the insulating material and an inner peripheral surface of the insulating material, wherein an inner diameter of the penetrating hole monotonically decreases from a top surface of the insulating material toward a back surface, and wherein the inner diameter of the penetrating hole at a center in a thickness direction of the insulating material is smaller than an average of an opening diameter on the top side and an opening diameter on the back side.

Abstract: A printed wiring board includes an insulator having a first surface, and a second surface opposite to the first surface, a through-hole penetrating from the first surface to the second surface, and a metal plated layer formed on the first and second surfaces of the insulator, and on an inner peripheral surface of the through-hole, wherein an inside diameter of the through-hole gradually decreases from the first surface toward the second surface of the insulator. An average diameter of the through-hole is 20 ?m or greater and 35 ?m or less at the first surface, and is 3 ?m or greater and 15 ?m or less at the second surface, and an average thickness of the metal plated layer formed on the first and second surfaces is 8 ?m or greater and 12 ?m or less.

Abstract: A printed wiring board includes an insulator having a first surface, and a second surface opposite to the first surface, and including a through-hole penetrating from the first surface to the second surface, and a metal plated layer formed on the first surface and the second surface of the insulator, and on an inner peripheral surface of the through-hole, wherein an inside diameter of the through-hole gradually decreases from the first surface toward the second surface of the insulator, an average diameter of the through-hole at the first surface of the insulator is 20 ?m or greater and 35 ?m or less, the average diameter of the through-hole at the second surface of the insulator is 3 ?m or greater and 15 ?m or less, and an average thickness of the metal plated layer formed on the first surface and the second surface of the insulator is 8 ?m or greater and 12 ?m or less.

Abstract: To provide an industrial method for producing a 5-alkynyl pyridine compound at a high yield. A method for producing a compound represented by the formula (3), which comprises reacting a 5-chloropyridine compound represented by the formula (1) and an alkyne compound represented by the formula (2) by using sodium carbonate or sodium hydrogen carbonate in the presence of a palladium catalyst having phosphine ligands: (in the formula (2), R is a hydrogen atom, a C1-C6 alkyl or a C3-C7 cycloalkyl).

Abstract: The disclosure provides a pharmaceutical composition containing an anti-IgE antibody that suppresses the production of allergen-specific IgE antibodies and methods of use thereof

Abstract: A printed circuit board according to one embodiment of the present invention is a printed circuit board including a plate-shaped or a sheet-shaped insulating material having a penetrating hole, and a metal plating layer layered on both surfaces of the insulating material and an inner peripheral surface of the insulating material, wherein an inner diameter of the penetrating hole monotonically decreases from a top surface of the insulating material toward a back surface, and wherein the inner diameter of the penetrating hole at a center in a thickness direction of the insulating material is smaller than an average of an opening diameter on the top side and an opening diameter on the back side.

Abstract: A flexible printed circuit board according to an aspect of the present invention includes a base film having insulating properties and a conductive pattern laminated to one surface side of the base film. The conductive pattern forms part of a circuit and includes at least one fuse portion having a cross section smaller than the other part. The flexible printed circuit board includes at least one opening passing through front and rear surfaces on at least one of the right and left sides of the fuse portion in a two-dimensional view.

Abstract: To provide an industrial method for producing a 5-alkynyl pyridine compound at a high yield. A method for producing a compound represented by the formula (3), which comprises reacting a 5-chloropyridine compound represented by the formula (1) and an alkyne compound represented by the formula (2) by using sodium carbonate or sodium hydrogen carbonate in the presence of a palladium catalyst having phosphine ligands: (in the formula (2), R is a hydrogen atom, a C1-C6 alkyl or a C3-C7 cycloalkyl).

Abstract: A battery wiring module includes bus bars and a flexible wiring board having wires connected to the respective bus bars. The flexible wiring board has a body portion and extensions extending from the body portion toward the respective bus bars. Each of the extensions supports one of the wires and has an end section where a pad is arranged, that is part of each of the wires. Each of the bus bars has at least one cutout portion, and the pad is arranged on each of the bus bars such that the pad overlaps at least part of at least one cutout portion. The pad and the at least part of the at least one cutout portion are connected to each other with solder.

Abstract: A flexible printed circuit board according to an aspect of the present invention includes a base film having insulating properties and a conductive pattern laminated to one surface side of the base film. The conductive pattern forms part of a circuit and includes at least one fuse portion having a cross section smaller than the other part. The conductive pattern has a pair of measurement pad portions configured to enable measurement of a potential difference between two points in the vicinity of both ends of the fuse portion.

Abstract: The present invention provides an egg allergy prevention method to be carried out with respect to a human infant, including: a first administration period (first administration step) in which to administer, to an infant, heated egg white protein in an amount of 10 mg to 20 mg per day; and a second administration period (second administration step) which is a period after the first administration period and in which to administer, to the infant, the heated egg white protein in an amount of 65 mg to 90 mg per day.

Abstract: A heat dissipation circuit board includes a printed circuit board including an insulating film and a conductive pattern that is formed on a front-surface side of the insulating film and includes at least one land part and a wiring part connected to the at least one land part; and at least one electronic component mounted on a front-surface side of the at least one land part. In the heat dissipation circuit board, the printed circuit board includes a recess on a side opposite to a side on which the at least one electronic component is mounted, the recess being in at least a portion of a projection region of the at least one land part, the recess extending to the conductive pattern, and includes a thermally conductive adhesive layer filling the recess.

Abstract: A flexible printed circuit board according to an aspect of the present invention includes a base film having insulating properties and a conductive pattern laminated to one surface side of the base film. The conductive pattern forms part of a circuit and includes at least one fuse portion having a cross section smaller than the other part. The flexible printed circuit board includes at least one opening passing through front and rear surfaces on at least one of the right and left sides of the fuse portion in a two-dimensional view.

Abstract: A battery wiring module includes bus bars and a flexible wiring board having wires connected to the respective bus bars. The flexible wiring board has a body portion and extensions extending from the body portion toward the respective bus bars. Each of the extensions supports one of the wires and has an end section where a pad is arranged, that is part of each of the wires. Each of the bus bars has at least one cutout portion, and the pad is arranged on each of the bus bars such that the pad overlaps at least part of at least one cutout portion. The pad and the at least part of the at least one cutout portion are connected to each other with solder.

Abstract: An LED module according to the present invention is an LED module including a plurality of light-emitting diodes, wherein the plural light-emitting diodes are disposed only on a lateral surface of a right cone, a right pyramid, a truncated right cone, or a truncated right pyramid; the lateral surface has an inclination angle of 55° or more and 82° or less with respect to a bottom surface; the plural light-emitting diodes have light-emitting surfaces substantially parallel to the lateral surface; and angles formed between projection lines of lines normal to light-emitting surfaces of adjacent light-emitting diodes or adjacent ones of grouped light-emitting diodes, the projection lines being drawn on the bottom surface, are all equal to each other and are 72° or less.