Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

Abstract: Computer-aided method and apparatus for defining surfaces of a three-dimensional object on the basis of a three-dimensional wire-frame model, wherein a plurality of pairs of edges selected from edges which constitute the three-dimensional wire-frame model are sequentially pointed, each pointed pair consisting of two edges lying on the same plane, and a group of candidate edges is determined, the group consisting of the currently pointed pair of edges and at least one edge lying on the same plane as the edges of the currently pointed pair, so that those candidate edges of the determined group which cooperate to define a closed loop are determined as a set of closed-loop defining edges, and a surface of the three-dimensional object is defined on the basis of the set of closed-loop defining edges.

Abstract: A spot welding method and apparatus having electrode tips one of which is driven by a servo motor. In the method and apparatus, it is determined whether or not an abnormal condition occurs. The abnormal condition includes (a) squeezing some obstacle between the electrode tip and a workpiece, (b) a temperature adhesion of the electrode tips with the workpiece, (c) uneven pressurizing of the workpiece by the electrode tips, (d) a weld nugget dispersion, and (e) a too large electric resistance between the electrode tips and the workpiece. When such abnormal condition is detected, some counter measure is taken to prevent or decrease the abnormal condition.

Abstract: A method for separating a temperature-adhered electrode tip from a workpiece wherein the electrode tip is biased in a direction away from the workpiece and a separation force is imposed on the electrode tip while the biasing force is being imposed so that a defect is not caused in the workpiece when the electrode tip or the workpiece is moved relative to the other during and/or after separation. An apparatus wherein a condenser battery is disposed in an electrical circuit including a welding gun servo motor. An apparatus wherein an electrode tip rotating device is installed in the welding gun.