Abstract: A plurality of wafers each having a conductive film on each face thereof are housed in slots of a cassette, and a potential of “H” level is applied from a control box to each wafer via an electrode. A conductive suction part of a vacuum pincette is connected to a grounding potential. A LED corresponding to the wafer to be operated on is lit up by a specification from a computer so that an operator operates on the wafer specified by the computer using the vacuum pincette. The control box detects the potential of each electrode and decides as to whether a given wafer is correctly operated on or not. In the case of erroneous operation, such an erroneous operation is displayed by means of a buzzer, and an overall result of operation is stored in the computer.

Abstract: A plurality of wafers 1 each having a conductive film on each face thereof are housed in each slot 11 of a cassette 10, and a potential of “H” level is applied from a control box 30 to each wafer 1 via each electrode 13. A conductive suction part 21 of a vacuum pincette 20 is connected to a grounding potential. An LED 13 corresponding to the wafer 1 to be operated is lit up by a specification from a computer 40 so that an operator operates the wafer 1 specified by the computer 40 using the vacuum pincette 20. The control box 30 detects the potential of each electrode 13 and decides as to whether a given wafer 1 is correctly operated or not. In the case of erroneous operation, such an erroneous operation is displayed by means of the buzzer 34, and an overall result of operation is stored in the computer 40.