Patents by Inventor Hirohito KAKIZOE

Hirohito KAKIZOE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible wiring board and use thereof
    Patent number: 10208159
    Abstract: Provided is a flexible wiring board having high durability. The present invention provides a flexible wiring board including a flexible substrate and a conductive film formed on the flexible substrate. The conductive film contains a conductive powder and a curd product of a heat curable resin. The conductive film has pencil hardness of at least 2H, based on a pencil scratch hardness test in accordance with JIS K5600 5-4 (1999). The conductive film has adhesiveness of at least 95/100 by a 100 squares cross-cut test in accordance with JIS K5400 (1990).
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: February 19, 2019
    Assignee: NORITAKE CO., LIMITED
    Inventors: Shuhei Fukaya, Hirohito Kakizoe, Tatsuya Baba, Terusada Sugiura, Yasushi Yoshino
  • FLEXIBLE WIRING BOARD AND USE THEREOF
    Publication number: 20160295686
    Abstract: Provided is a flexible wiring board having high durability. The present invention provides a flexible wiring board including a flexible substrate and a conductive film formed on the flexible substrate. The conductive film contains a conductive powder and a curd product of a heat curable resin. The conductive film has pencil hardness of at least 2H, based on a pencil scratch hardness test in accordance with JIS K5600 5-4 (1999). The conductive film has adhesiveness of at least 95/100 by a 100 squares cross-cut test in accordance with JIS K5400 (1990).
    Type: Application
    Filed: March 22, 2016
    Publication date: October 6, 2016
    Applicant: NORITAKE CO., LIMITED
    Inventors: Shuhei FUKAYA, Hirohito KAKIZOE, Tatsuya BABA, Terusada SUGIURA, Yasushi YOSHINO