Patents by Inventor Hirohito Miyazaki
Hirohito Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8600616Abstract: An in-vehicle instrument control device, that controls a power source of a plurality of in-vehicle instruments operated by power from the power source provided in a vehicle, includes a plurality of operation units to operate the respective in-vehicle instruments; and a plurality of power source control units that are each provided between the operation unit and the power source, and the in-vehicle instrument, and each supply the power from the power source to the in-vehicle instrument when a predetermined operation signal is inputted from the operation unit.Type: GrantFiled: March 15, 2012Date of Patent: December 3, 2013Assignee: Omron Automotive Electronics Co., Ltd.Inventors: Takashi Aragai, Yusuke Ukai, Hirohito Miyazaki
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Publication number: 20130215549Abstract: Power consumption of a relay that switches electric connection between a power supply and a load of a vehicle is suppressed. When receiving a disconnection instruction signal from a control circuit, a disconnection circuit transmits a disconnection signal to a coil of a keep relay, and brings a movable contact into contact with a contact to electrically disconnect the power supply from the load. When receiving a connection instruction signal from the control circuit, a connection circuit transmits a connection signal to a coil of the keep relay, and brings the movable contact into contact with a contact to electrically connect the power supply to the load. An automatic stopping circuit stops the connection signal output from the connection circuit using a voltage or a current supplied from the keep relay to the load. For example, the present invention can be applied to a power-supply control device for the vehicle.Type: ApplicationFiled: February 20, 2013Publication date: August 22, 2013Inventors: Takashi Aragai, Yusuke Ukai, Hirohito Miyazaki
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Publication number: 20130214592Abstract: An electric power is surely supplied to a load even if an abnormality is generated in a switching control circuit, which controls a switching part that switches electric connection between a power supply and the load of a vehicle. The switching control circuit controls a state of a contact of a keep relay that switches the electric connection between the power supply and the load. A monitor circuit monitors existence or non-existence of the abnormality of the switching control circuit. When detecting the abnormality of the switching control circuit, the monitor circuit transmits a reset signal in order to reset a state of the switching control circuit. When receiving the reset signal from the monitor circuit, an abnormal-time connection circuit transmits a connection signal to a coil of the keep relay to bring a movable contact into contact with a contact. For example, the present invention can be applied to a power-supply control device for the vehicle.Type: ApplicationFiled: February 20, 2013Publication date: August 22, 2013Inventors: Takashi Aragai, Yusuke Ukai, Hirohito Miyazaki
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Publication number: 20120245794Abstract: A power source control device provided in a vehicle including a plurality of power supply devices that supply power from a power source to respective corresponding loads includes a total current detecting unit that detects a total current value, which is a summation of load current values, based on the load current values that are supplied from the power supply devices to the loads and are detected in the respective power supply devices; and a power supply control unit that selects the load to which the supply of the power is to be stopped, based on a predetermined priority so that the total current value becomes equal to or lower than a predetermined total current threshold when the total current value exceeds the total current threshold, and notifies the power supply device corresponding to the selected load of the stop of the power supply.Type: ApplicationFiled: March 22, 2012Publication date: September 27, 2012Applicant: OMRON AUTOMOTIVE ELECTRONICS CO., LTD.Inventors: Takashi Aragai, Yusuke Ukai, Hirohito Miyazaki
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Publication number: 20120235472Abstract: Power to a load may be continued even if abnormality occurs in a load current value supplied to the relevant load of a vehicle. Load control units supply power from a battery to corresponding loads, respectively, and detect load current values. A power source management unit detects a total current value, based on the load current values detected by the load control units. Where the load control unit in which the load current value exceeds a load current threshold is present, when the total current value exceeds a total current threshold, the power source management unit causes the supply of the power from the relevant load control unit to the load to be stopped. When the total current value is equal to or lower than the total current threshold, the power source management unit continues the supply of the power from the relevant load control unit to the load.Type: ApplicationFiled: March 15, 2012Publication date: September 20, 2012Applicant: OMRON AUTOMOTIVE ELECTRONICS CO., LTD.Inventors: Takashi Aragai, Yusuke Ukai, Hirohito Miyazaki
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Publication number: 20120239249Abstract: An in-vehicle instrument control device, that controls a power source of a plurality of in-vehicle instruments operated by power from the power source provided in a vehicle, includes a plurality of operation units to operate the respective in-vehicle instruments; and a plurality of power source control units that are each provided between the operation unit and the power source, and the in-vehicle instrument, and each supply the power from the power source to the in-vehicle instrument when a predetermined operation signal is inputted from the operation unit.Type: ApplicationFiled: March 15, 2012Publication date: September 20, 2012Applicant: Omron Automotive Electronics Co., Ltd.Inventors: Takashi Aragai, Yusuke Ukai, Hirohito Miyazaki
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Patent number: 7915076Abstract: A hybrid module includes a silicon substrate having a plurality of part mounting openings formed therein, the plurality of part mounting openings composed of through holes, a plurality of mounted parts that are mounted in the part mounting openings such that input/output portion forming surfaces are substantially flush with a first main surface of the silicon substrate, a sealing layer that is formed of a sealing material filled into the part mounting openings and covers the mounted parts, with the input/output portion forming surfaces exposed from the first main surface of the silicon substrate, to fix the mounted parts in the part mounting openings, and a wiring layer that is formed on the first main surface of the silicon substrate, and has a wiring pattern connected to input/output portions that are provided on the input/output portion forming surfaces of the mounted parts exposed from the first main surface.Type: GrantFiled: March 19, 2008Date of Patent: March 29, 2011Assignee: Sony CorporationInventors: Tsuyoshi Ogawa, Hirokazu Nakayama, Hirohito Miyazaki, Namiko Takeshima
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Publication number: 20100244560Abstract: A vehicle power supply system has a power supply unit for supplying power to each unit of a vehicle, a plurality of actuation units actuated by the power from the power supply unit, an operation unit arranged for each of the plurality of actuation units, and operated when actuating the corresponding actuation unit, and a control unit for performing a control of starting supply of power from the power supply unit to each of the plurality of actuation units according to the operation of the corresponding operation unit when an actuation condition of the actuation unit corresponding to the operation unit is satisfied.Type: ApplicationFiled: February 26, 2010Publication date: September 30, 2010Applicant: OMRON CORPORATIONInventors: Yoshihiro Sato, Kenichi Kessoku, Hirohito Miyazaki
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Patent number: 7633243Abstract: In a headlamp luminance controlling device, a CPU 21 first decides a luminance factor D based on a state of each switch 10 to switch 12 and a signal from a sensor 13. The CPU 21 determines an initial value of a PWM duty ratio S from the luminance factor D with a load current Ap as a default value (rated current A0). The CPU 21 starts the initial driving of a headlamp HL using the duty ratio S. The CPU 21 then determines the luminance factor D based on the state of each switch 10 to switch 12 and the signal from the sensor 13. Next, the CPU 21 determines the PWM duty ratio S based on the luminance factor D and the load current Ap detected by the headlamp current detector 23. The CPU 21 drives the headlamp HL using the PWM duty ratio S.Type: GrantFiled: October 23, 2007Date of Patent: December 15, 2009Assignees: OMRON Corporation, Honda Motor Co., Ltd.Inventors: Kazuhiko Sato, Hirohito Miyazaki, Izumi Yamada, Akihiro Kakamu, Masaru Ishizaki
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Publication number: 20080182366Abstract: A hybrid module includes a silicon substrate having a plurality of part mounting openings formed therein, the plurality of part mounting openings composed of through holes, a plurality of mounted parts that are mounted in the part mounting openings such that input/output portion forming surfaces are substantially flush with a first main surface of the silicon substrate, a sealing layer that is formed of a sealing material filled into the part mounting openings and covers the mounted parts, with the input/output portion forming surfaces exposed from the first main surface of the silicon substrate, to fix the mounted parts in the part mounting openings, and a wiring layer that is formed on the first main surface of the silicon substrate, and has a wiring pattern connected to input/output portions that are provided on the input/output portion forming surfaces of the mounted parts exposed from the first main surface.Type: ApplicationFiled: March 19, 2008Publication date: July 31, 2008Inventors: Tsuyoshi Ogawa, Hirokazu Nakayama, Hirohito Miyazaki, Namiko Takeshima
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Publication number: 20080106204Abstract: In a headlamp luminance controlling device, a CPU 21 first decides a luminance factor D based on a state of each switch 10 to switch 12 and a signal from a sensor 13. The CPU 21 determines an initial value of a PWM duty ratio S from the luminance factor D with a load current Ap as a default value (rated current A0). The CPU 21 starts the initial driving of a headlamp HL using the duty ratio S. The CPU 21 then determines the luminance factor D based on the state of each switch 10 to switch 12 and the signal from the sensor 13. Next, the CPU 21 determines the PWM duty ratio S based on the luminance factor D and the load current Ap detected by the headlamp current detector 23. The CPU 21 drives the headlamp HL using the PWM duty ratio S.Type: ApplicationFiled: October 23, 2007Publication date: May 8, 2008Applicants: OMRON CORPORATION, HONDA MOTOR CO., LTD.Inventors: Kazuhiko Sato, Hirohito Miyazaki, Izumi Yamada, Akihiro Kakamu, Masaru Ishizaki
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Publication number: 20070080458Abstract: A hybrid module includes a silicon substrate having a plurality of part mounting openings formed therein, the plurality of part mounting openings composed of through holes, a plurality of mounted parts that are mounted in the part mounting openings such that input/output portion forming surfaces are substantially flush with a first main surface of the silicon substrate, a sealing layer that is formed of a sealing material filled into the part mounting openings and covers the mounted parts, with the input/output portion forming surfaces exposed from the first main surface of the silicon substrate, to fix the mounted parts in the part mounting openings, and a wiring layer that is formed on the first main surface of the silicon substrate, and has a wiring pattern connected to input/output portions that are provided on the input/output portion forming surfaces of the mounted parts exposed from the first main surface.Type: ApplicationFiled: September 27, 2006Publication date: April 12, 2007Inventors: Tsuyoshi Ogawa, Hirokazu Nakayama, Hirohito Miyazaki, Namiko Takeshima
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Publication number: 20070040281Abstract: To provide a semiconductor device configured that a micro device having a device substrate, a function element provided on the device substrate and having an oscillator or a movable part, first lands provided on a surface of the device substrate by being arranged on its outer circumference portion of the function element, and bumps provided to the first lands is mounted on the circuit board having second lands formed to correspond to the bumps, from the bump formation surface side, so that the bumps and the second lands are electrically connected; on which a sealing resin layer is formed to go round the outer circumference portion of the function element to fix connection portions of the bumps and the second lands, and to seal a clearance between the device substrate and the circuit board; and a cavity portion is formed between the function element and the circuit board.Type: ApplicationFiled: August 18, 2006Publication date: February 22, 2007Inventors: Hirokazu Nakayama, Akihiko Okubora, Yoichi Oya, Hirohito Miyazaki, Kris Baert, Ingrid De Wolf, Piet De Moor, Eric Beyne
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Patent number: 7075237Abstract: In an illumination control apparatus which drives headlamps in a PWM mode and automatically lights them at low power in a vehicle when the DRL executing condition is held, failure in a PWM-drive switching device and break failure in the lamp are detected as well as the arrangement of control units is optimized and meeting models is facilitated. A relay which switches between lamps and a power source, a CPU which is connected to a CAN and drive-controls the relay for manual lighting, and an integrator circuit which integrates voltage of drive side terminals of the lamps are disposed in a main control unit. An FET which switches between the lamps and the power source, a CPU which drive-controls the FET for automatic lighting, and a power source connecting resister having a resistance value greater enough than that of the lamp that drive side terminals of the lamps are connected to the power source through an ignition switch contact of the vehicle are disposed in a DRL control unit.Type: GrantFiled: April 13, 2005Date of Patent: July 11, 2006Assignees: Omron Corporation, Honda Motor Co., Ltd.Inventors: Kazuhiko Sato, Hirohito Miyazaki, Masaru Ishizaki
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Publication number: 20050225266Abstract: In an illumination control apparatus which drives headlamps in a PWM mode and automatically lights them at low power in a vehicle when the DRL executing condition is held, failure in a PWM-drive switching device and break failure in the lamp are detected as well as the arrangement of control units is optimized and meeting models is facilitated. A relay which switches between lamps and a power source, a CPU which is connected to a CAN and drive-controls the relay for manual lighting, and an integrator circuit which integrates voltage of drive side terminals of the lamps are disposed in a main control unit. An FET which switches between the lamps and the power source, a CPU which drive-controls the FET for automatic lighting, and a power source connecting resister having a resistance value greater enough than that of the lamp that drive side terminals of the lamps are connected to the power source through an ignition switch contact of the vehicle are disposed in a DRL control unit.Type: ApplicationFiled: April 13, 2005Publication date: October 13, 2005Applicants: OMRON Corporation, Honda Motor Co., Ltd.Inventors: Kazuhiko Sato, Hirohito Miyazaki, Masaru Ishizaki
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Publication number: 20020170171Abstract: A multilayer printed circuit board comprises core substrates, each having conductor patterns. The core substrates are laminated such that the conductor patterns of adjacent core substrates face each other. At least one insulating layer is provided between the core substrates to insulate the conductor patterns from each other. At least one connection lies between the core substrates, the connection connecting the conductor patterns with each other. The connection comprises an alloy comprising a first metal having a melting point below the heat resistant temperature of the core substrates and a second metal having a melting point above the heat resistant temperature. The connection is formed by thermal compression bonding of a bump of the first metal formed on a conductor pattern of one of the adjacent core substrates to a bump of the second metal formed on a conductor pattern of the other core substrate.Type: ApplicationFiled: April 26, 2002Publication date: November 21, 2002Inventors: Hirohito Miyazaki, Yoshio Watanabe, Nobuyuki Yasuda