Abstract: An object to be achieved by the present invention is to provide a bonding element in which copper fine particles are used as a bonding element of a semiconductor device component and a crack, peeling, or the like is not caused in a semiconductor device during an operation under a high-temperature condition of 200° C. or higher. The object is achieved by providing a copper fine particle sintered body for bonding a semiconductor device component, in which when a Vickers hardness of the copper fine particle sintered body at 150° C. is set as Hvb and a Vickers hardness of the same copper fine particle sintered body at 25° C. is set as Hva, a value of (Hvb/Hva)×100 (%) is 5% or more and 20% or less.