Patents by Inventor Hirohito Ohashi

Hirohito Ohashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and manufacturing method of them
    Patent number: 7323788
    Abstract: A semiconductor device which can meet the requirement for a further increase in pins, which multi-functionalization and faster operation would entail is to be provided. Bonding pads and bonding pads are arranged in a zigzag pattern in a direction along an outer circumference of a main surface of a chip. To focus on power supply-line bonding pads among all the bonding pads, an odd number of bonding pads are to be arranged in a direction of the outer circumference of the main surface between adjoining bonding pads. A greater width is secured for the power supply-line bonding pads than for other bonding pads, and a diameter of wires to be connected to the power supply-line bonding pads is set greater than that of other wires.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: January 29, 2008
    Assignee: Renesas Technology Corp.
    Inventors: Yoshinori Miyaki, Kazunari Suzuki, Hirohito Ohashi
  • Semiconductor device and manufacturing method of them
    Publication number: 20070170601
    Abstract: A semiconductor device which can meet the requirement for a further increase in pins, which multi-functionalization and faster operation would entail is to be provided. Bonding pads and bonding pads are arranged in a zigzag pattern in a direction along an outer circumference of a main surface of a chip. To focus on power supply-line bonding pads among all the bonding pads, an odd number of bonding pads are to be arranged in a direction of the outer circumference of the main surface between adjoining bonding pads. A greater width is secured for the power supply-line bonding pads than for other bonding pads, and a diameter of wires to be connected to the power supply-line bonding pads is set greater than that of other wires.
    Type: Application
    Filed: March 29, 2007
    Publication date: July 26, 2007
    Inventors: Yoshinori Miyaki, Kazunari Suzuki, Hirohito Ohashi
  • Semiconductor device and manufacturing method of them
    Patent number: 7211903
    Abstract: A semiconductor device which can meet the requirement for a further increase in pins, which multi-functionalization and faster operation would entail is to be provided. Bonding pads and bonding pads are arranged in a zigzag pattern in a direction along an outer circumference of a main surface of a chip. To focus on power supply-line bonding pads among all the bonding pads, an odd number of bonding pads are to be arranged in a direction of the outer circumference of the main surface between adjoining bonding pads. A greater width is secured for the power supply-line bonding pads than for other bonding pads, and a diameter of wires to be connected to the power supply-line bonding pads is set greater than that of other wires.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: May 1, 2007
    Assignee: Renesas Technology Corp.
    Inventors: Yoshinori Miyaki, Kazunari Suzuki, Hirohito Ohashi
  • Semiconductor device and manufacturing method of them
    Publication number: 20050162880
    Abstract: A semiconductor device which can meet the requirement for a further increase in pins, which multi-functionalization and faster operation would entail is to be provided. Bonding pads and bonding pads are arranged in a zigzag pattern in a direction along an outer circumference of a main surface of a chip. To focus on power supply-line bonding pads among all the bonding pads, an odd number of bonding pads are to be arranged in a direction of the outer circumference of the main surface between adjoining bonding pads. A greater width is secured for the power supply-line bonding pads than for other bonding pads, and a diameter of wires to be connected to the power supply-line bonding pads is set greater than that of other wires.
    Type: Application
    Filed: December 7, 2004
    Publication date: July 28, 2005
    Inventors: Yoshinori Miyaki, Kazunari Suzuki, Hirohito Ohashi