Patents by Inventor Hirohito Takemura

Hirohito Takemura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper alloy wire, and insulated electric wires and multiple core parallel bonded wires made of the same
    Patent number: 5106701
    Abstract: A copper alloy wire has a composition composed of no less than 0.01% by weight of Ag and balance Cu and unavoidable impurities. The copper alloy wire has been prepared by drawing a wire stock having the composition at a reduction ratio of no lower than 40% and subjecting the wire stock to heat treatment for half annealing to have a tensile strength of no lower than 27 kg.multidot.f/mm.sup.2 and an elongateion of 5%. An insulated elecric wire includes the copper alloy wire as a conductor and an insulation layer covering the wire. Also, a multiple core parallel bonded wire includes two or more such insulated electric wires bonded parallel to each other.
    Type: Grant
    Filed: January 25, 1991
    Date of Patent: April 21, 1992
    Assignee: Fujikura Ltd.
    Inventors: Akihito Kurosaka, Sueji Chabata, Haruo Tominaga, Kenichi Miyauchi, Michio Koike, Takashi Nishida, Hirohito Takemura, Toshihito Watanabe, Kazumichi Kasai, Takao Tsuboi