Patents by Inventor Hiroichi Ukei

Hiroichi Ukei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10816164
    Abstract: A lamp reflector (10a) includes a mirror surface (11) and a laminate (12a). The mirror surface (11) is a surface for reflecting light from a light source (30) to guide the light in a predetermined direction. The laminate (12a) covers at least a part of the mirror surface (11) to absorb an electromagnetic wave having a specific frequency of 20 GHz to 90 GHz. The laminate (12a) allows the light from the light source (30) to transmit therethrough toward the mirror surface (11).
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: October 27, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hiroichi Ukei, Takehiro Ui, Ryosuke Aoki, Hironobu Machinaga, Kazuto Yamagata, Yuuki Takeda
  • Publication number: 20200214181
    Abstract: An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrically conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrically conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) is a layer that includes tin oxide or titanium oxide as a main component or a layer that is made of indium tin oxide including 40 weight % or more of tin oxide.
    Type: Application
    Filed: March 27, 2018
    Publication date: July 2, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuto Yamagata, Hironobu Machinaga, Yuuki Takeda, Hiroichi Ukei, Takehiro Ui
  • Publication number: 20200207059
    Abstract: An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrically conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrically conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) has a sheet resistance of 200 to 600?/?. When the resistive layer (20) is subjected to an immersion treatment in which the resistive layer (20) is immersed in a 5 weight % aqueous solution of NaOH for 5 minutes, an absolute value of a difference between a sheet resistance of the resistive layer (20) before the immersion treatment and a sheet resistance of the resistive layer (20) after the immersion treatment is less than 100?/?.
    Type: Application
    Filed: March 27, 2018
    Publication date: July 2, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuto Yamagata, Hironobu Machinaga, Eri Ueda, Hiroichi Ukei, Takehiro Ui
  • Patent number: 10701848
    Abstract: For the purpose of providing an electromagnetic wave absorber capable of holding excellent performance over a long period of time, the electromagnetic wave absorber includes: a dielectric layer B including a polymer film and having a first surface and a second surface; a resistive layer A formed on the first surface of the dielectric layer Band containing indium tin oxide as a main component; and an electrically conductive layer C formed on the second surface of the dielectric layer B and having a sheet resistance lower than that of the resistive layer A, wherein the indium tin oxide in the resistive layer A contains 20 to 40 wt. % of tin oxide based on the total weight of the indium tin oxide.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: June 30, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kazuto Yamagata, Hironobu Machinaga, Takehiro Ui, Hiroichi Ukei, Yuya Kitagawa, Kazuaki Sasa
  • Publication number: 20200178426
    Abstract: An electromagnetic wave absorber includes an electromagnetic wave-absorbing layer (10) and an adhesive layer (20). The adhesive layer (20) is disposed on at least one surface of the electromagnetic wave-absorbing layer (10). The electromagnetic wave absorber is capable of being adhered to a surface having a step in such a manner that the adhesive layer (20) is in contact with the surface. The adhesive layer (20) has a thickness equal to or greater than a reference height determined by subtracting 0.1 mm from the height of the step. In the electromagnetic wave absorber, a return loss ?R defined by ?R=Rt?Rr is 15 dB or more. Rt is a reflection amount of a 76-GHz electromagnetic wave and is measured for a reference specimen. Rr is a reflection amount of a 76-GHz electromagnetic wave and is measured for a specimen obtained by adhering the electromagnetic wave absorber.
    Type: Application
    Filed: June 12, 2018
    Publication date: June 4, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takehiro Ui, Hiroichi Ukei
  • Publication number: 20200161771
    Abstract: An electromagnetic wave absorber (1a) includes a first layer (10) and an electrically conductive layer (20). The first layer (10) is a dielectric layer or a magnetic layer. The electrically conductive layer (20) is provided on at least one surface of the first layer. A product of a Young's modulus of the first layer (10) and a thickness of the first layer (10) is 0.1 to 1000 MPa · mm. The first layer (10) has a relative permittivity of 1 to 10.
    Type: Application
    Filed: January 23, 2018
    Publication date: May 21, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroichi Ukei, Takehiro Ui, Hironobu Machinaga, Kazuto Yamagata, Yuuki Takeda
  • Publication number: 20200128705
    Abstract: An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrical conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrical conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) includes indium oxide as a main component, has a polycrystalline structure, and has a sheet resistance of 260 to 500?/? and a specific resistance of 5×10?4 ?·cm or more.
    Type: Application
    Filed: March 27, 2018
    Publication date: April 23, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuto Yamagata, Hironobu Machinaga, Yuuki Takeda, Eri Ueda, Hiroichi Ukei, Takehiro Ui
  • Publication number: 20200116332
    Abstract: A lamp reflector (10a) includes a mirror surface (11) and a laminate (12a). The mirror surface (11) is a surface for reflecting light from a light source (30) to guide the light in a predetermined direction. The laminate (12a) covers at least a part of the mirror surface (11) to absorb an electromagnetic wave having a specific frequency of 20 GHz to 90 GHz. The laminate (12a) allows the light from the light source (30) to transmit therethrough toward the mirror surface (11).
    Type: Application
    Filed: June 12, 2018
    Publication date: April 16, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroichi Ukei, Takehiro Ui, Ryosuke Aoki, Hironobu Machinaga, Kazuto Yamagata, Yuuki Takeda
  • Patent number: 10512200
    Abstract: An electromagnetic wave absorber (1a) includes: a first layer (10a) being a dielectric layer or a magnetic layer; and a conductive layer (20a) provided on at least one surface of the first layer (10a). The conductive layer (20a) has a sheet resistance of 100?/? or less after the electromagnetic wave absorber (1a) is exposed to an environment having a temperature of 85° C. and a relative humidity of 85% for 1000 hours. The electromagnetic wave absorber (1a) has a flexural rigidity of 7000 MPa·mm4 or less.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: December 17, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hironobu Machinaga, Hiroichi Ukei, Takehiro Ui, Kazuto Yamagata, Yuuki Takeda
  • Publication number: 20190380232
    Abstract: An electromagnetic wave absorber (1a) includes: a first layer (10a) being a dielectric layer or a magnetic layer; and a conductive layer (20a) provided on at least one surface of the first layer (10a). The conductive layer (20a) has a sheet resistance of 100?/? or less after the electromagnetic wave absorber (1a) is exposed to an environment having a temperature of 85° C. and a relative humidity of 85% for 1000 hours. The electromagnetic wave absorber (1a) has a flexural rigidity of 7000 MPa·mm4 or less.
    Type: Application
    Filed: December 11, 2017
    Publication date: December 12, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hironobu Machinaga, Hiroichi Ukei, Takehiro Ui, Kazuto Yamagata, Yuuki Takeda
  • Publication number: 20180332742
    Abstract: For the purpose of providing an electromagnetic wave absorber capable of holding excellent performance over a long period of time, the electromagnetic wave absorber includes: a dielectric layer B including a polymer film and having a first surface and a second surface; a resistive layer A formed on the first surface of the dielectric layer Band containing indium tin oxide as a main component; and an electrically conductive layer C formed on the second surface of the dielectric layer B and having a sheet resistance lower than that of the resistive layer A, wherein the indium tin oxide in the resistive layer A contains 20 to 40 wt. % of tin oxide based on the total weight of the indium tin oxide.
    Type: Application
    Filed: December 14, 2016
    Publication date: November 15, 2018
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuto Yamagata, Hironobu Machinaga, Takehiro Ui, Hiroichi Ukei, Yuya Kitagawa, Kazuaki Sasa
  • Publication number: 20180319138
    Abstract: For the purpose of providing an electromagnetic wave absorber usable for radar having a high revolution and sufficiently adaptable to a plurality of radars different in frequency, the bandwidth of a frequency band in which an electromagnetic wave absorption amount is not less than 20 dB is not less than 2 GHz, within a frequency band of 60 to 90 GHz.
    Type: Application
    Filed: December 14, 2016
    Publication date: November 8, 2018
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroichi Ukei, Takehiro Ui, Kazuto Yamagata, Yuki Takeda, Hironobu Machinaga, Yuya Kitagawa, Kazuaki Sasa
  • Publication number: 20160303821
    Abstract: The present invention provides an electrically insulating resin composition comprising a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, wherein the proportion of the polyamide resin is 1 to 45% by mass. The present invention also provides a laminate sheet obtained by bonding a plurality of sheet materials with a resin composition layer interposed therebetween, wherein the resin composition layer comprises a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, and the proportion of the polyamide resin is 1 to 45% by mass.
    Type: Application
    Filed: June 24, 2016
    Publication date: October 20, 2016
    Applicants: NITTO SHINKO CORPORATION, NITTO DENKO CORPORATION
    Inventors: Yasuyuki KIHARA, Akira TAMAI, Hiroichi UKEI, Tomoyuki KASAGI, Mizuki YAMAMOTO
  • Publication number: 20140048309
    Abstract: The present invention aims to provide a three-dimensionally shaped electrically insulating product having excellent formability in the process of three-dimensional formation and electrical insulation properties that are suppressed from deteriorating. Provided is a three-dimensionally shaped electrically insulating product formed by subjecting a sheet material having electrical insulation properties at least to a bending process, in which the sheet material includes a resin layer in the form of a sheet containing a thermoplastic resin having nitrogen or sulfur in a molecule and a protective layer in the form of a sheet disposed on each of both sides of the resin layer.
    Type: Application
    Filed: April 11, 2012
    Publication date: February 20, 2014
    Applicants: NITTO SHINKO CORPORATION, NITTO DENKO CORPORATION
    Inventors: Yasuyuki Kihara, Noburo Tambo, Hiroyuki Makida, Akira Tamai, Hiroichi Ukei, Tomoyuki Kasagi, Yoshiko Kira
  • Publication number: 20130309481
    Abstract: Provided are: an electrically insulating resin sheet for motors, which is used for achieving the insulation between coil wires or between a coil wire and an iron core in a motor, and which has high heat resistance, high electrical insulation performance and a high insulation breakdown voltage; and a process for producing the electrically insulating resin sheet. The electrically insulating resin sheet for motors, which is provided with a porous resin layer comprising a thermoplastic resin, is characterized in that the resin sheet has a relative permittivity of 2.0 or less at 1 GHz. It is preferred that the porous resin layer has an average cell diameter of 5.0 ?m or less and contains cells in such an amount that the porosity is 30% or more.
    Type: Application
    Filed: February 2, 2012
    Publication date: November 21, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tomoyuki Kasagi, Hiroichi Ukei, Yoshiko Kira, Takeshi Sutou, Keiko Akiyama, Shinpei Yakuwa, Hiroko Ikenaga
  • Publication number: 20130209741
    Abstract: The present invention relates to a porous resin sheet which is a single-layer porous resin sheet including a thermoplastic resin, in which the porous resin sheet has a thickness of 1.0 mm or more, a dielectric constant at 1 GHz of 2.00 or less, a dielectric loss tangent of 0.0050 or less, and an elastic modulus of 200 MPa or more. Also, the present invention relates to a method for producing the porous resin sheet, the method including: a gas impregnation step of impregnating a thermoplastic resin composition containing at least a thermoplastic resin with a non-reactive gas under pressure; and after the gas impregnation step, a foaming step of reducing the pressure to foam the thermoplastic resin composition.
    Type: Application
    Filed: September 8, 2011
    Publication date: August 15, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tomoyuki Kasagi, Takeshi Sutou, Hiroichi Ukei
  • Patent number: 8486505
    Abstract: A release liner formed of a polypropylene resin sheet that can be highly recyclable and that can provide an excellent performance in a wide range of operating temperature is provided. A release-lined pressure-sensitive adhesive (PSA) sheet constituted with the release liner is also provided. A release-lined PSA sheet 1 according to the present invention comprises a PSA sheet 20 having a support 22 and a PSA layer 24; and a release liner 10 placed on the PSA layer 24. The release liner 10 has a layered configuration formed of a layer A 12 formed of a polypropylene resin composition containing a nucleating agent; and a layer B 14 formed of a polypropylene resin composition containing no nucleating agent; wherein the two layers stacked to form the thickness of the liner.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: July 16, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Hiroichi Ukei, Yoshio Nakagawa, Osamu Degawa
  • Publication number: 20130115844
    Abstract: The present invention provides an electrically insulating resin composition including a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, wherein the proportion of the polyamide resin is 1 to 45% by mass. The present invention also provides a laminate sheet obtained by bonding a plurality of sheet materials with a resin composition layer interposed therebetween, wherein the resin composition layer includes a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, and the proportion of the polyamide resin is 1 to 45% by mass.
    Type: Application
    Filed: July 8, 2011
    Publication date: May 9, 2013
    Applicants: NITTO DENKO CORPORATION, NITTO SHINKO CORPORATION
    Inventors: Yasuyuki Kihara, Akira Tamai, Hiroichi Ukei, Tomoyuki Kasagi, Mizuki Yamamoto
  • Patent number: 8394478
    Abstract: A release liner formed of a highly recyclable polypropylene-based resin sheet and capable of assuring excellent operability over a wide range of environmental temperature is provided. A pressure-sensitive adhesive (PSA) sheet with release liner is also provided. A PSA sheet with release liner according to the present invention comprises a PSA sheet including a support and a PSA layer; and a release liner formed of a polypropylene-based resin sheet which is obtained by molding into a sheet a polypropylene-based resin composition containing a nucleating agent. The PSA sheet with release liner provides excellent operability even in a high temperature environment of, for example, about 35° C. The PSA sheet with release liner is preferably applicable in an attachment operation wherein the PSA sheet is attached to an adherend while the liner is released from the PSA sheet.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: March 12, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Hiroichi Ukei, Yoshio Nakagawa, Osamu Degawa
  • Patent number: 8377535
    Abstract: Provided is a release-lined pressure-sensitive adhesive sheet comprising a release liner 10 and a pressure-sensitive adhesive sheet 20. The release liner 10 has an average linear expansion coefficient of at most 7×10?5/° C. between 25° C. and 40° C. A layer 12 to constitute a surface 10A on the pressure-sensitive adhesive layer side of the release liner 10 is formed of a polyolefin-based resin composition containing none or at most 0.01 mass % of a phosphorous-based antioxidant. The surface 10A is divided into a plurality of sections 124 by a plurality of ridges 2A and 2B with each ridge having a height of 5 ?m to 50 ?m. At least one of the sections 124 inscribes a circle of a diameter greater than 500 ?m.
    Type: Grant
    Filed: April 24, 2009
    Date of Patent: February 19, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Yoshio Nakagawa, Hiroichi Ukei