Abstract: A spinning reel includes a reel body. The real body includes a lid portion having a fitting recess and a groove. An axle bearing member fits into the fitting recess. The fitting recess includes an inner surface that contacts the axle bearing member and a bottom surface that contacts the axle bearing member. The groove is formed on the inner surface.

Abstract: An oscillating mechanism includes a traverse camshaft, an engaging unit, and a slider body. The traverse camshaft includes a spiral groove. The traverse camshaft rotates in conjunction with the winding operation of a handle attached to the reel main body. The engaging unit includes an engaging claw configured to engage the spiral groove. The slider body includes a supporting hole rotatably supporting the engaging unit. A groove extends in the penetration direction of the supporting hole, and is disposed on the inner peripheral surface of the supporting hole of the slider body.

Abstract: An aspect of the present invention relates to an optical information recording medium comprising a recording layer on a surface of a support, wherein the surface of the support has pregrooves with a track pitch ranging from 50 to 500 nm, the recording layer comprises an azo metal complex dye being a complex of six azo dyes and seven transition metal ions. A further aspect of the present invention relates to a method of recording information onto the optical information recording medium and a novel azo metal complex dye.

Abstract: A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section.

Abstract: An antireflection film has excellent scratch resistance and damp-proof property in addition to having a high degree of antireflective effect, and provides an antireflection plate obtained by laminating the above film. The antireflection film has a lowly refractive layer of a refractive index of less than 1.48 and a thickness of 50 to 200 nm. An antireflection plate includes the antireflection film formed on a transparent resin substrate.

Abstract: An information processing device includes: a display unit having a touch panel on its front surface; a movement amount calculation unit that calculates the movement amount of a touch operation based on a touch point at which the touch operation is performed with respect to the touch panel and a touch release point at which the touch operation is released from the touch panel; an operation determination unit that determines whether the touch operation is a depression operation or a gesture operation depending on the calculated movement amount; and a command recognition unit that recognizes whether a received command is a command corresponding to the depression operation or the gesture operation.

Abstract: A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate.

Abstract: To provide a highly transparent and highly strong protective plate for display panel which, when mounted on a display panel, does not permit bubbles to evolve in the inner layer or does not permit the layer to peel off even in high temperature and high humidity conditions that could temporarily occur, for example, in an automobile, and a display device equipped with the protective plate.

Abstract: To provide a method of producing a reinforced antireflection glass, which reinforces the glass by a chemically reinforcing treatment based on the ion-exchange method after the antireflection film has been formed.

Abstract: A method of manufacturing a semiconductor device includes: a bonding step of bonding a first substrate with optical transparency and a second substrate having a surface on which a functional element is provided to each other such that the functional element faces the first substrate; a thinning step of thinning at least one of the first and second substrates; and a through-hole forming step of forming a cavity and a through-hole communicated with the cavity in at least part of a bonding portion between the first and second substrates. According to the present invention, it is possible to prevent irregularities or cracks caused by the presence or absence of the cavity and more regularly thin the substrate. In addition, it is possible to manufacture a semiconductor device capable of contributing to the miniaturization of devices and electronic equipment having the devices, using a more convenient process.

Abstract: A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section.

Abstract: A through wiring substrate includes a substrate including a first face and a second face, and a plurality of through-wires formed by filling, or forming a film of, an electrically-conductive substance in through-holes that penetrate between the first face and the second face. The through-wires are separated from each other, and, include at least one overlap section in a plan view of the substrate.

Abstract: A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate.

Abstract: Provided is a device mounting structure that includes: a interposer substrate including a substrate and a plurality of through-hole interconnection; a first device including a plurality of electrodes arranged so as to face the first principal surface of the substrate; and a second device including a plurality of electrodes whose arrangement is different from that of the first device, with the electrodes arranged so as to face the second principal surface of the substrate. Each through-hole interconnection includes a first conductive portion provided at a position on the first principal surface corresponding to the electrode of the first device, and a second conductive portion provided at a position on the second principal surface corresponding to the electrode of the second device. Each electrode of the first device is electrically connected with the first conductive portion. Each electrode of the second device is electrically connected with the second conductive portion.

Abstract: A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate.

Abstract: An aspect of the present invention relates to an optical information recording medium comprising a recording layer on a surface of a support, wherein the surface of the support has pregrooves with a track pitch ranging from 50 to 500 nm, the recording layer comprises an azo metal complex dye being a complex of six azo dyes and seven transition metal ions. A further aspect of the present invention relates to a method of recording information onto the optical information recording medium and a novel azo metal complex dye.

Abstract: A method of manufacturing a semiconductor device includes: a bonding step of bonding a first substrate with optical transparency and a second substrate having a surface on which a functional element is provided to each other such that the functional element faces the first substrate; a thinning step of thinning at least one of the first and second substrates; and a through-hole forming step of forming a cavity and a through-hole communicated with the cavity in at least part of a bonding portion between the first and second substrates. According to the present invention, it is possible to prevent irregularities or cracks caused by the presence or absence of the cavity and more regularly thin the substrate. In addition, it is possible to manufacture a semiconductor device capable of contributing to the miniaturization of devices and electronic equipment having the devices, using a more convenient process.

Abstract: A remote controller has a touch panel. Multiple items are shown on a display. A user draws a line on the touch panel in the direction where the item is desired to select by moving the finger, for example. The remote controller determines the direction of the drawn line, and transmits the signal indicating the direction to a control unit. The control unit determines the item disposed in the direction indicated by the signal, and executes a process associated with that determined item. The process is executed in this manner, and thus an instruction is made to given devices. The invention can be applied to a car navigation system.

Abstract: In a heat exchanger, a core portion includes a plurality of plate fins each shaped like a flat plate and a plurality of tubes in which a fluid flows and each of which is inserted into each of the plate fins to be mechanically bonded thereto. Further, an end portion in a longitudinal direction of each of the tubes is bonded to a header plate which constructs a part of a header tank. The manufacturing method for this heat exchanger includes inserting the tube into the plate fins; expanding the tube to attach the plate fins; connect the tube into the header plate; and vibrate the tube with respect to the plate while applying a load to the tube in the direction of the header plate.

Abstract: There is provided a non-resonant two-photon absorption recording material including (a) a non-resonant two-photon absorption compound; and (b) a recording component capable of changing at least either one of a refractive index and a fluorescent intensity. The non-resonant two-photon absorption compound (a) is represented by the following formula (1): In the formula (1), both of X and Y represent a substituent having a Hammett sigma para value (?p value) of 0 or more and they may be the same as or different from each other; n represents an integer of 1 to 4; R represents a substituent and each R may be the same as or different from every other R; and m represents an integer of 0 to 4.