Patents by Inventor Hirokazu Hiraoka

Hirokazu Hiraoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040224623
    Abstract: In CMP technology for planarizing an interlayer insulation film, a BPSG film, an insulation film for shallow trench isolation, or the like, in the production process of a semiconductor element, irregularities of a matter being polished, e.g. a silicon oxide film, are planarized efficiently at a high speed while suppressing the occurrence of polishing flaws on the substrate by employing a polishing pad having organic fibers exposed on the surface thereof abutting against the matter being polished.
    Type: Application
    Filed: March 30, 2004
    Publication date: November 11, 2004
    Inventors: Masaya Nishiyama, Masanobu Habiro, Yasuhito Iwatsuki, Hirokazu Hiraoka
  • Publication number: 20040033746
    Abstract: An electrically insulating non-woven fabric having a main component of poly-p-phenileneterephthalamide fibers bonded with each other by a binder of thermosetting resin and a second binder of one selected from fiber chops, fiber pulps and fibrids of thermoplastic resin having a softening point of 220° C. or higher, the poly-p-phenileneterephthalamide fibers being pulps or both of chops and pulps with a blend mass ratio of the chops to the pulps being 0/100 through 95/5 and preferably 50/50 through 90/10, a fiber length of the poly-p-phenileneterephathalamide fiber chops being preferably 3 to 6 mm, a content of the thermosetting resin binder in the non-woven fabric being 5 to 30 mass % and a content of the second binder being is 5 to 15 mass %.
    Type: Application
    Filed: March 14, 2003
    Publication date: February 19, 2004
    Inventors: Shigeru Kurumatani, Manabu Ochida, Hirokazu Hiraoka
  • Patent number: 6688545
    Abstract: First sounding mechanism, which issues sound when spool rotates relative to spool shaft, is furnished with sound-emitting member, pawl member, and plate spring. Sound-emitting member is non-rotatably mounted on spool shaft, and has multiple jags radially jutting on its outer periphery. Pawl member has body portion pivotably mounted on spool; pawl portion formed on the spool-shaft side of the swing center; and arcuate contact face formed on body portion on a side of the swing center SC opposite spool shaft. First-side radius R1 of contact face, is smaller than its second-side radius R2. Plate spring mounted on spool at an end nearer the first side of contact-face is, and contacts contact face at the other end, urging pawl portion of pawl member to collide with sound-emitting member. In a spinning-reel sounding device having a pawl member, the tone fluctuations due to spool rotational direction are controlled.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: February 10, 2004
    Assignee: Shimano Inc.
    Inventors: Keigo Kitajima, Hirokazu Hiraoka
  • Patent number: 6686023
    Abstract: A polished-piece holder is provided that does not easily stick or adsorb to a polishing pad of a polishing apparatus and reduces occurrences of production line troubles and therefore the number of failed polished pieces. A single sheet of a thermosetting resin impregnated fiber substrate or a laminated sheet formed by laminating a plurality of sheets of the thermosetting resin impregnated fiber substrate is formed under heat and pressure into a plate. The thermosetting resin impregnated fiber plate is then processed to form a polished-piece holder for holding pieces to be polished. The evaluation portion has a certain length in a direction of the average line. The thermosetting resin impregnated fiber plate has a surface roughness with a maximum wave height Ry of 10 &mgr;m or greater over an almost entire area of the surface layer.
    Type: Grant
    Filed: February 25, 2002
    Date of Patent: February 3, 2004
    Assignee: Shin-Kobe Electric Machinery Co., Ltd.
    Inventors: Katsuji Takahashi, Hirokazu Hiraoka, Masayuki Noda
  • Publication number: 20030157858
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Application
    Filed: March 5, 2003
    Publication date: August 21, 2003
    Applicant: OJI PAPER CO., LTD.
    Inventors: Hiroyoshi Ueno, Yoshihisa Koto, Isao Ichioka, Takekazu Adachi, Mamoru Murata, Hirokazu Hiraoka, Manabu Ochida, Masayuki Noda
  • Publication number: 20030136866
    Abstract: First sounding mechanism, which issues sound when spool rotates relative to spool shaft, is furnished with sound-emitting member, pawl member, and plate spring. Sound-emitting member is non-rotatably mounted on spool shaft, and has multiple jags radially jutting on its outer periphery. Pawl member has body portion pivotably mounted on spool; pawl portion formed on the spool-shaft side of the swing center; and arcuate contact face formed on body portion on a side of the swing center SC opposite spool shaft. First-side radius R1 of contact face, is smaller than its second-side radius R2. Plate spring mounted on spool at an end nearer the first side of contact-face is, and contacts contact face at the other end, urging pawl portion of pawl member to collide with sound-emitting member. In a spinning-reel sounding device having a pawl member, the tone fluctuations due to spool rotational direction are controlled.
    Type: Application
    Filed: December 10, 2002
    Publication date: July 24, 2003
    Applicant: SHIMANO, INC
    Inventors: Keigo Kitajima, Hirokazu Hiraoka
  • Patent number: 6566288
    Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.
    Type: Grant
    Filed: February 6, 2001
    Date of Patent: May 20, 2003
    Assignees: Shin-Kobe Electric Machinery Co., Ltd., Oji Paper Co., Ltd.
    Inventors: Shigeru Kurumatani, Hirokazu Hiraoka, Masayuki Noda, Tomoyuki Terao, Setsuo Toyoshima, Yoshihisa Kato, Hiroyoshi Ueno
  • Patent number: 6558512
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Grant
    Filed: November 17, 1999
    Date of Patent: May 6, 2003
    Assignees: Oji Paper Co., Ltd., Shin-Kobe Electric Machinery Co., Ltd
    Inventors: Hiroyoshi Ueno, Yoshihisa Kato, Isao Ichioka, Takekazu Adachi, Mamoru Murata, Hirokazu Hiraoka, Manabu Ochida, Masayuki Noda
  • Publication number: 20020197466
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Application
    Filed: November 17, 1999
    Publication date: December 26, 2002
    Inventors: HIROYOSHI UENO, YOSHIHISA KATO, ISAO ICHIOKA, TAKEKAZU ADACHI, MAMORU MURATA, HIROKAZU HIRAOKA, MANABU OCHIDA, MASAYUKI NODA
  • Publication number: 20020160150
    Abstract: A polished-piece holder is provided that does not easily stick or adsorb to a polishing pad of a polishing apparatus and reduces occurrences of production line troubles and therefore the number of failed polished pieces. A single sheet of a thermosetting resin impregnated fiber substrate or a laminated sheet formed by laminating a plurality of sheets of the thermosetting resin impregnated fiber substrate is formed under heat and pressure into a plate. The thermosetting resin impregnated fiber plate is then processed to form a polished-piece holder for holding pieces to be polished. The evaluation portion has a certain length in a direction of the average line. The thermosetting resin impregnated fiber plate has a surface roughness with a maximum wave height Ry of 10 &mgr;m or greater over an almost entire area of the surface layer.
    Type: Application
    Filed: February 25, 2002
    Publication date: October 31, 2002
    Applicant: Shin-Kobe Electric Machinery Co., Ltd.
    Inventors: Katsuji Takahashi, Hirokazu Hiraoka, Masayuki Noda
  • Patent number: 6426310
    Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: July 30, 2002
    Assignees: Shin-Kobe Electric Machinery Co., Ltd., Oji Paper Co., Ltd.
    Inventors: Shigeru Kurumatani, Hirokazu Hiraoka, Masayuki Noda, Tomoyuki Terao, Setsuo Toyoshima, Yoshihisa Kato, Hiroyoshi Ueno
  • Publication number: 20010006868
    Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.
    Type: Application
    Filed: February 6, 2001
    Publication date: July 5, 2001
    Inventors: Shigeru Kurumatani, Hirokazu Hiraoka, Masayuki Noda, Tomoyuki Terao, Setsuo Toyoshima, Yoshihisa Kato, Hiroyoshi Ueno
  • Patent number: 6040252
    Abstract: A laminate base material of aromatic polyamide fiber non-woven fabric which comprises a combined non-woven fabric of para-aramid fibers and meta-aramid fibers bonded with each other by a resin binder such as an epoxy resin binder and meta-aramid fibers being thermally adhered to each other and meta-aramid fibers being thermally adhered to para-aramid fibers while they are passing through a pair of thermal rolls and heated and pressed by them and the meta-aramid fibers being included preferably by 5 through 30 weight %.
    Type: Grant
    Filed: April 21, 1999
    Date of Patent: March 21, 2000
    Assignees: Shin-Kobe Electric Machinery Co., Teijin Limited, Oji Paper Co., Ltd.
    Inventors: Minoru Ootuka, Hirokazu Hiraoka, Toru Shimadu, Masayuki Noda
  • Patent number: 5948543
    Abstract: A laminate base material of aromatic polyamide fiber non-woven fabric which comprises a combined non-woven fabric of para-aramid fibers and meta-aramid fibers bonded with each other by a resin binder such as an epoxy resin binder and meta-aramid fibres being thermally adhered to each other and meta-aramid fibers being thermally adhered to para-aramid fibers while they are passing through a pair of thermal rolls and heated and pressed by them and the meta-aramid fibers being included preferably by 5 through 30 weight %.
    Type: Grant
    Filed: February 21, 1997
    Date of Patent: September 7, 1999
    Assignees: Shin-Kobe Electric Machinery Co., Ltd., Teijin Limited, Oji Paper Co., Ltd.
    Inventors: Minoru Ootuka, Hirokazu Hiraoka, Toru Shimadu, Masayuki Noda