Patents by Inventor Hirokazu Hiwatashi

Hirokazu Hiwatashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering structure between a tab of a bus bar and a printed substrate
    Patent number: 6997737
    Abstract: A soldering structure between a tab of a bus bar and a printed substrate is disclosed to provide a soldering structure between a tab of a bus bar and a printed substrate that causes no crack. An electrical conductive material is formed on a printed substrate. A tab through-hole is provide to penetrate the electrical conductive material and printed substrate. A tab formed by bending a body of the bus bar enters the tab through-hole. A periphery of the tab and the electrical conductive material are interconnected by soldering. A stress-absorbing aperture or recess is provided in an insulation plate on which the body of the bus bar is mounted. The stress-absorbing aperture or recess can absorb an axial stress caused in the tab.
    Type: Grant
    Filed: July 26, 2004
    Date of Patent: February 14, 2006
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Hirokazu Hiwatashi
  • Soldering structure between a tab of a bus bar and a printed substrate
    Publication number: 20050048825
    Abstract: A soldering structure between a tab of a bus bar and a printed substrate is disclosed to provide a soldering structure between a tab of a bus bar and a printed substrate that causes no crack. An electrical conductive material is formed on a printed substrate. A tab through-hole is provide to penetrate the electrical conductive material and printed substrate. A tab formed by bending a body of the bus bar enters the tab through-hole. A periphery of the tab and the electrical conductive material are interconnected by soldering. A stress-absorbing aperture or recess is provided in an insulation plate on which the body of the bus bar is mounted. The stress-absorbing aperture or recess can absorb an axial stress caused in the tab.
    Type: Application
    Filed: July 26, 2004
    Publication date: March 3, 2005
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Hirokazu Hiwatashi