Patents by Inventor Hirokazu Honkawa

Hirokazu Honkawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9005834
    Abstract: A polymer electrolyte fuel cell comprises a plurality of stacked cells each having an ionic conductive electrolyte membrane, an anode placed on one side of the electrolyte membrane, a cathode placed on the other side of the electrolyte membrane, and a conductive separator on which a first refrigerant channel for flow of a refrigerant is formed in center part thereof. The separator comprises penetration holes constituting a manifold which extend in a direction of stacking of the plurality of cells and through which the refrigerant flows and second refrigerant channels for communication between the penetration holes and the first refrigerant channel. A plurality of protrusions that protrude into the penetration holes from parts of wall surfaces of the penetration holes that are located peripherally in connection parts between the penetration holes and the second refrigerant channels.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: April 14, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Mitsuo Yoshimura, Hirokazu Honkawa, Kenji Arai
  • Publication number: 20130157160
    Abstract: A polymer electrolyte fuel cell comprises a plurality of stacked cells each having an ionic conductive electrolyte membrane, an anode placed on one side of the electrolyte membrane, a cathode placed on the other side of the electrolyte membrane, and a conductive separator on which a first refrigerant channel for flow of a refrigerant is formed in center part thereof. The separator comprises a penetration holes constituting a manifold which extend in a direction of stacking of the plurality of cells and through which the refrigerant flows, a second refrigerant channels for communication between the penetration holes and the first refrigerant channel, and a plurality of protrusions that protrude into the penetration holes from parts of wall surfaces of the penetration holes that located peripherally in connection parts between the penetration holes and the second refrigerant channels.
    Type: Application
    Filed: February 10, 2012
    Publication date: June 20, 2013
    Applicant: Panasonic Corporation
    Inventors: Mitsuo Yoshimura, Hirokazu Honkawa, Kenji Arai
  • Patent number: 7165318
    Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: January 23, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Youichi Nakamura, Kunio Sakurai, Kazumasa Okumura, Ken Takano, Minoru Yamamoto, Hirokazu Honkawa, Kentaro Nishiwaki, Yoshihiko Misawa
  • Patent number: 6976304
    Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.
    Type: Grant
    Filed: July 24, 2002
    Date of Patent: December 20, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Youichi Nakamura, Kunio Sakurai, Kazumasa Okumura, Ken Takano, Minoru Yamamoto, Hirokazu Honkawa, Kentaro Nishiwaki, Yoshihiko Misawa
  • Publication number: 20050144779
    Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.
    Type: Application
    Filed: March 8, 2005
    Publication date: July 7, 2005
    Inventors: Youichi Nakamura, Kunio Sakurai, Kazumasa Okumura, Ken Takano, Minoru Yamamoto, Hirokazu Honkawa, Kentaro Nishiwaki, Yoshihiko Misawa
  • Patent number: 6725532
    Abstract: A plurality of self-propelled system heads (5) are made to independently travel along a closed-loop travel track (6) in a manner that the heads do not interfere with each other by controlling respective drive devices (4). Components (2) from a component supply device (8) are held by component holding members (3) of the heads, and thereafter, the components held by the component holding members are mounted on boards (1) positioned by board positioning devices (7).
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: April 27, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Okada, Seiichi Mogi, Hiroshi Ota, Hirokazu Honkawa, Makito Seno, Kunio Sakurai, Ken Takano
  • Publication number: 20030088974
    Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL of 4L as a length with which each of two boards corresponding to a plurality of head units can be positioned at each component placement position and a board retreat position corresponding to each placement position can be secured and SL as a space for positioning a board stop mechanism at each placement position and each board retreat position, which is not less than 450 mm and not more than 1000 mm.
    Type: Application
    Filed: July 24, 2002
    Publication date: May 15, 2003
    Inventors: Youichi Nakamura, Kunio Sakurai, Kazumasa Okumura, Ken Takano, Minoru Yamamoto, Hirokazu Honkawa, Kentaro Nishiwaki, Yoshihiko Misawa
  • Patent number: 6178621
    Abstract: By lightening the impact load to an electronic component and greatly promoting the load range, the adaptability to the electronic components is enhanced and the manned manual operation is eliminated, thereby improving the productivity and realizing unmanned operation. The vacuum-clamping nozzle unit comprises an automatically detachable vacuum-clamping nozzle (2) for vacuum-clamping the electronic component, a positioning section (3) for positioning the vacuum-clamping nozzle (2) in a rotating direction and a vertical direction, a pushing section (4) for urging said vacuum-clamping nozzle (2) downward by using fluid, a fluid pressure switching section for switching the urging force, a timing switching section for switching the timing of the urging force of said vacuum-clamping nozzle, and a pressure control section for controlling the load to a desired load. Switching the timing of the urging force can be made before or at the time of mounting the electronic component on an electronic circuit board.
    Type: Grant
    Filed: April 23, 1998
    Date of Patent: January 30, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Shida, Wataru Hirai, Muneyoshi Fujiwara, Hiroshi Ohta, Hirokazu Honkawa
  • Patent number: 5850689
    Abstract: A method for supporting a printed board. Includes a first step of conveying to a specified position by a conveying a printed board having a first reference hole and a second reference hole device a for setting a position and posture thereof. A second step stops the conveyed printed board at the specified position with a stop member. A third step inserts a first reference pin provided at the specified position into the first reference hole of the stopped printed board. A fourth step inserts a second reference pin into the second reference hole of the printed board. The second reference pin is movable in parallel to a mounting surface of the printed board and in any arbitrary direction relative to the first reference pin. A fifth step pinches the printed board to hold the position and posture thereof of a holding device with the first reference pin and the second reference pin both inserted.
    Type: Grant
    Filed: January 17, 1996
    Date of Patent: December 22, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Mogi, Wataru Hirai, Muneyoshi Fujiwara, Osamu Okuda, Hirokazu Honkawa
  • Patent number: 5727311
    Abstract: A method for mounting components, includes a first step for feeding to a component feed unit a plurality of stacked-in-stages trays on which components are accommodated, a second step for taking out the components of a Top-stage tray sequentially one by one to mount them onto a board, and a third step for, when the components on the tray are exhausted, removing the empty top-stage tray, and then returning to the second step. An apparatus for mounting Components includes a component feed unit for feeding a plurality of stacked-in-stages trays on which components are accommodated, and a pickup device which can selectively hold either a component pickup nozzle or a tray transfer nozzle. The pickup device is movable between the component feed unit and a specified position of a substrate or between the component feed unit and a tray removal box. A nozzle replacement unit is provided for performing replacement of the pickup nozzle and the tray Transfer nozzle.
    Type: Grant
    Filed: January 17, 1996
    Date of Patent: March 17, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akiko Ida, Wataru Hirai, Muneyoshi Fujiwara, Osamu Okuda, Hirokazu Honkawa