Patents by Inventor Hirokazu Iizuka

Hirokazu Iizuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939492
    Abstract: The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film. More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: March 26, 2024
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Hirokazu Iizuka, Kunihiro Takei, Yuiko Maruyama, Yuki Sato
  • Publication number: 20240087916
    Abstract: A vacuum processing apparatus includes a decompressable process container; a supply port configured to supply, to the process container, an ionic liquid that absorbs an oxidizing gas; and a discharge port configured to discharge the ionic liquid supplied to the process container. A recess is provided at a joint portion between members constituting the process container. The supply port is configured to supply the ionic liquid to the recess, and the discharge port is configured to discharge the ionic liquid supplied to the recess.
    Type: Application
    Filed: November 1, 2023
    Publication date: March 14, 2024
    Inventors: Hirokazu UEDA, Yoji IIZUKA, Mitsuaki IWASHITA, Antonio ROTONDARO, Dipak ARYAL, Takeo NAKANO, Ryuichi ASAKO, Kenji SEKIGUCHI, Koji AKIYAMA, Naoki UMESHITA, Takashi HAYAKAWA
  • Patent number: 11904577
    Abstract: A hot-melt adhesive resin film includes a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer include an acid-modified polyolefin resin.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: February 20, 2024
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Kunihiro Takei, Yuiko Maruyama, Hirokazu Iizuka
  • Patent number: 11826991
    Abstract: The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: November 28, 2023
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Kunihiro Takei, Yuiko Maruyama, Hirokazu Iizuka
  • Patent number: 11710881
    Abstract: Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: July 25, 2023
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Kunihiro Takei, Hirokazu Iizuka, Shunsuke Takeyama
  • Publication number: 20220275258
    Abstract: The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film. More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.
    Type: Application
    Filed: May 13, 2022
    Publication date: September 1, 2022
    Inventors: Hirokazu IIZUKA, Kunihiro TAKEI, Yuiko MARUYAMA, Yuki SATO
  • Patent number: 11359117
    Abstract: The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: June 14, 2022
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Hirokazu Iizuka, Kunihiro Takei, Yuiko Maruyama, Yuki Sato
  • Publication number: 20220112412
    Abstract: Provided are an adhesive resin composition having high adhesiveness and high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component (A) having a weight average molecular weight of 30,000 or more and 150,000 or less, a resin component (B) having an epoxy group in a molecule, a resin component (C) having an amino group at a molecular end, and a solvent (5), in which a content of the resin component (B) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A), and a content of the resin component (C) is 0.5 parts by mass or more and 15 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A).
    Type: Application
    Filed: December 23, 2021
    Publication date: April 14, 2022
    Inventors: Hirokazu IIZUKA, Kunihiro TAKEI, Jun SUZUKI
  • Publication number: 20220049131
    Abstract: A hot-melt adhesive resin composition includes a modified polyolefin in which a functional group is introduced into a polyolefin, a solid phenol resin, and a crosslinking agent, wherein the content of the modified polyolefin is 10 parts by mass or more and 40 parts by mass or less, based on 100 parts by mass of the total of the modified polyolefin and the solid phenol resin, and the modified polyolefin and the crosslinking agent are mixed so that a functional group possessed by the crosslinking agent is more than 1.0 equivalent and 5.0 equivalents or less, based on 1.0 equivalent of a functional group possessed by the modified polyolefin.
    Type: Application
    Filed: September 10, 2019
    Publication date: February 17, 2022
    Inventors: Kunihiro TAKEI, Hirokazu IIZUKA
  • Patent number: 11242475
    Abstract: Provided are an adhesive resin composition having high adhesiveness and high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component (A) having a weight average molecular weight of 30,000 or more and 150,000 or less, a resin component (B) having an epoxy group in a molecule, a resin component (C) having an amino group at a molecular end, and a solvent (S), in which a content of the resin component (B) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A), and a content of the resin component (C) is 0.5 parts by mass or more and 15 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A).
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: February 8, 2022
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Hirokazu Iizuka, Kunihiro Takei, Jun Suzuki
  • Publication number: 20220001655
    Abstract: The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.
    Type: Application
    Filed: September 15, 2021
    Publication date: January 6, 2022
    Inventors: Kunihiro TAKEI, Yuiko MARUYAMA, Hirokazu IIZUKA
  • Patent number: 11148401
    Abstract: The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: October 19, 2021
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Kunihiro Takei, Yuiko Maruyama, Hirokazu Iizuka
  • Publication number: 20210203046
    Abstract: Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.
    Type: Application
    Filed: March 11, 2021
    Publication date: July 1, 2021
    Inventors: Kunihiro TAKEI, Hirokazu IIZUKA, Shunsuke TAKEYAMA
  • Patent number: 11007756
    Abstract: The present invention relates to a hot-melt adhesive resin film which does not cause peeling between respective layers, has an excellent adhesive force, and has strong adherability even in severe durability evaluation, to various planar or film-like adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer comprise an acid-modified polyolefin resin, and a production method thereof.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: May 18, 2021
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Kunihiro Takei, Yuiko Maruyama, Hirokazu Iizuka
  • Patent number: 10985359
    Abstract: Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: April 20, 2021
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Kunihiro Takei, Hirokazu Iizuka, Shunsuke Takeyama
  • Patent number: 10903524
    Abstract: The present invention relates to a resin coated metal laminate comprising at least a sealant layer, a barrier layer, and a substrate layer in this order, wherein the barrier layer includes stainless steel having a thickness of 50 ?m or less, the substrate layer includes a polyamide as a main component, a thickness of the substrate layer is thinner than a thickness of the barrier layer, and a maximum value of tensile strength in a tensile test of the substrate layer is 25 N/mm or more, as well as a battery package and a battery using the resin coated metal laminate.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: January 26, 2021
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Hirokazu Iizuka, Yasuhiro Kaneda, Yuki Sato
  • Patent number: 10897029
    Abstract: The present invention provides a battery package used in an assembled battery, which can miniaturize the assembled battery and can impart sufficient durability; an assembled battery which can be miniaturized and have sufficient durability by provision with the relevant battery package; and a battery device provided with the relevant assembled battery.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: January 19, 2021
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventor: Hirokazu Iizuka
  • Publication number: 20210008854
    Abstract: A hot-melt adhesive resin film includes a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer include an acid-modified polyolefin resin.
    Type: Application
    Filed: September 28, 2020
    Publication date: January 14, 2021
    Inventors: Kunihiro TAKEI, Yuiko MARUYAMA, Hirokazu IIZUKA
  • Patent number: 10669456
    Abstract: Provided are an adhesive resin composition that can be uniformly applied, has high adhesiveness, and further has high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component having a melting point of higher than 80° C. and 140° C. or lower, a crosslinking agent component, and a solvent component, in which the solvent component contains an aromatic solvent, an aliphatic solvent, and a ketone-based solvent, the aromatic solvent has a highest boiling point, and the solvent component contains the aromatic solvent in an amount of 50 parts by mass or more and 80 parts by mass or less, the aliphatic solvent in an amount of 10 parts by mass or more and 30 parts by mass or less, and the ketone-based solvent in an amount of 5 parts by mass or more and 20 parts by mass or less, based on 100 parts by mass of a total amount of the solvent component.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: June 2, 2020
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Hirokazu Iizuka, Kunihiro Takei, Jun Suzuki
  • Publication number: 20190245189
    Abstract: Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.
    Type: Application
    Filed: February 4, 2019
    Publication date: August 8, 2019
    Inventors: Kunihiro TAKEI, Hirokazu IIZUKA, Shunsuke TAKEYAMA