Patents by Inventor Hirokazu Kawamura

Hirokazu Kawamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210303964
    Abstract: An apparatus control device includes: at least one processor; and at least one first memory that stores a program executed by the processor, in which the processor acquires input data based on at least one of acceleration and angular velocity generated by application of an external force to an apparatus, classifies a plurality of the acquired input data into a plurality of clusters by an unsupervised clustering method, acquires relationship data representing relationship between the acquired input data and the plurality of classified clusters, and controls movement of the apparatus based on the acquired relationship data.
    Type: Application
    Filed: February 11, 2021
    Publication date: September 30, 2021
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Hirokazu HASEGAWA, Yoshihiro KAWAMURA, Hiroki ATSUMI, Miyuki URANO, Toshiaki KANAMURA
  • Publication number: 20210259227
    Abstract: A fishing rod according to one embodiment includes a rod body extending in a front-and-back direction along a central axis, a fitting having a mounting part, where the mounting part is mounted on an outer peripheral surface of the rod body at a first position determined in a circumferential direction around the central axis, and a fiber-reinforced resin layer surrounding the rod body so as to cover the mounting part. The fiber-reinforced resin layer has a first portion covering the rod body along an entire length thereof in the circumferential direction around the central axis and a second portion extending in the axial direction backward from an axially back end of the first portion and extending in the circumferential direction less than 180° clockwise from the first position and also less than 180° anti-clockwise from the first position.
    Type: Application
    Filed: June 28, 2019
    Publication date: August 26, 2021
    Inventors: Takuji KAWAMURA, Nobuhiro IZAKI, Takahiko TOMIOKA, Hirokazu YAMAMOTO
  • Patent number: 10605453
    Abstract: A conduit made of a synthetic resin, having an inner surface and an outer surface, having concave portions and convex portions alternately and continuously provided in the length direction. The conduit is bendable. The conduit includes outer wall parts extending with a first width in the length direction; inner wall parts positioned radially inside relative to the outer wall parts and extending with a second width in the length direction; and side wall parts joining the outer wall parts and the inner wall parts so that the outer wall parts and the inner wall parts are alternately and continuously provided in the length direction. The outer surfaces of the outer wall parts each have, at both ends in the length direction, protruding parts, which protrude in the radial direction.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: March 31, 2020
    Assignees: NORTIZ CORPORATION, TOKYO GAS LIVING ENGINEERING CO., LTD., MIRAI INDUSTRY CO., LTD.
    Inventors: Masaki Sugatani, Takanori Nagano, Hironao Matsunaga, Takahide Hasegawa, Yasuhide Sato, Kiyomi Kanamoto, Hirokazu Kawamura, Shohei Matsuda
  • Publication number: 20180209645
    Abstract: A conduit made of a synthetic resin, having an inner surface and an outer surface, having concave portions and convex portions alternately and continuously provided in the length direction. The conduit is bendable. The conduit includes outer wall parts extending with a first width in the length direction; inner wall parts positioned radially inside relative to the outer wall parts and extending with a second width in the length direction; and side wall parts joining the outer wall parts and the inner wall parts so that the outer wall parts and the inner wall parts are alternately and continuously provided in the length direction. The outer surfaces of the outer wall parts each have, at both ends in the length direction, protruding parts, which protrude in the radial direction.
    Type: Application
    Filed: January 24, 2017
    Publication date: July 26, 2018
    Inventors: Masaki SUGATANI, Takanori NAGANO, Hironao MATSUNAGA, Takahide HASEGAWA, Yasuhide SATO, Kiyomi KANAMOTO, Hirokazu KAWAMURA, Shohei MATSUDA
  • Patent number: 8414033
    Abstract: A pipe joint includes: a joint main body with a receiving opening for a pipe; an axially-movable tube-shaped body mounted to the receiving opening; and a retaining ring closely arranged to an outer surface of the pipe for preventing the pipe from detaching, wherein the joint main body includes a receiving portion for receiving the retaining ring, and a tapered portion for radially shrinking the retaining ring, wherein the tube-shaped body is arranged to move between a first position where the retaining ring is allowed to move into the tapered portion, and a second position where the retaining ring is blocked from tapered portion, and wherein the pipe joint is configured such that the pipe can be inserted into the receiving opening when the tube-shaped body is either position, that in the first position the pipe is not detachable, and that in the second position the pipe is detachable.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: April 9, 2013
    Assignees: Mirai Industry Co., Ltd., Tosetz Co., Ltd.
    Inventor: Hirokazu Kawamura
  • Publication number: 20120139234
    Abstract: A pipe joint includes: a joint main body with a receiving opening for a pipe; an axially-movable tube-shaped body mounted to the receiving opening; and a retaining ring closely arranged to an outer surface of the pipe for preventing the pipe from detaching, wherein the joint main body includes a receiving portion for receiving the retaining ring, and a tapered portion for radially shrinking the retaining ring, wherein the tube-shaped body is arranged to move between a first position where the retaining ring is allowed to move into the tapered portion, and a second position where the retaining ring is blocked from tapered portion, and wherein the pipe joint is configured such that the pipe can be inserted into the receiving opening when the tube-shaped body is either position, that in the first position the pipe is not detachable, and that in the second position the pipe is detachable.
    Type: Application
    Filed: February 16, 2012
    Publication date: June 7, 2012
    Applicants: Tosetz Co., Ltd., Mirai Industry Co., Ltd.
    Inventor: Hirokazu Kawamura
  • Publication number: 20090183901
    Abstract: A wiring board includes an insulating substrate and a wiring pattern. The wiring pattern includes a main body and an upper end portion and is embedded in the insulating substrate while exposing at least the upper end portion on a surface of the insulating substrate. The upper end portion has a cross-sectional width smaller than that of a lower end portion of the wiring pattern embedded in the insulating substrate. The upper end portion is formed of a metal that is more noble than a metal of the main body of the wiring pattern. The wiring board having this structure achieves very high adhesion of the wiring pattern to the insulating layer.
    Type: Application
    Filed: August 9, 2007
    Publication date: July 23, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tatsuo Kataoka, Hirokazu Kawamura
  • Publication number: 20090044971
    Abstract: The printed wiring board includes an insulating base and a plurality of wirings formed on the surface of the insulating base, wherein the wiring circuit has a conductive undercoat layer formed on the surface of the insulating base, a Cu nodule layer formed on the upper surface of the undercoat layer, a cover plating layer formed on the upper surface of the Cu nodule layer and a first metal plating layer formed on the upper surface of the cover plating layer, and on the upper surface of the wiring circuit, a protruded and depressed surface attributable to protrusions and depressions of the upper surface of the Cu nodule layer is formed. The printed wiring board can be produced by depositing the above metal layers such as the Cu nodule layer with regulating a sidewall surface of a pattern formed from the photosensitive resin. Ruther conductive bonding is possible by the use of an adhesive only.
    Type: Application
    Filed: November 13, 2006
    Publication date: February 19, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tatsuo Kataoka, Hirokazu Kawamura
  • Publication number: 20060220242
    Abstract: The present invention provides a method for producing a flexible printed wiring board which allows formation of a bump on a wire trace even in a high-density mounting process, and a flexible printed wiring board which realizes high-density mounting with high reliability.
    Type: Application
    Filed: March 28, 2006
    Publication date: October 5, 2006
    Applicant: Mitsui Mining & Smelting Co., Ltd.
    Inventor: Hirokazu Kawamura
  • Patent number: 6798048
    Abstract: A 2-metal layer TAB and a both-sided CSP.BGA tape having an insulating substrate and a wiring layer provided on at least both sides of the substrate, the substrate having evenly spaced sprocket holes on both width direction edges in the longitudinal direction thereof and also having through-holes formed with a punching press, and the through-holes being filled with a conductor by means of a punching press such that the conductor and the wiring layers are electrically connected, which is characterized by having round pilot holes between the sprocket holes formed in the longitudinal direction thereof; and a process of producing the same.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: September 28, 2004
    Assignees: Mitsui Mining & Smelting Company, Ltd., Suzuki Co., Ltd.
    Inventors: Akira Ichiryu, Tatsuo Kataoka, Hirokazu Kawamura, Katsuhiko Hayashi, Masahito Ishii
  • Publication number: 20040099441
    Abstract: A printed circuit board comprising an insulating substrate, a through-hole formed in the insulating substrate, an implant material filling the through-hole, and a wiring pattern formed on both faces of the insulating substrate and electrically connected with the implant material, characterized in that one face of a conductor wiring layer wherein a bump penetrates from one face to the other face and protrudes is adhered to the insulating substrate so as to be electrically connected to the implant material. This bump conductor wiring layer of this printed circuit board has a large degree of freedom in forming a wiring pattern, through-hole, and bump and is unlike conventional handled separately from the insulating substrate. Therefore, the effect arises that this circuit board is the target of commercial trading by itself.
    Type: Application
    Filed: October 24, 2003
    Publication date: May 27, 2004
    Inventors: Akira Ichiryu, Katsuhiko Hayashi, Tatsuo Karaoka, Hirokazu Kawamura, Masahito Ishii
  • Publication number: 20040026122
    Abstract: A printed circuit board comprising an insulating substrate, a via hole (16) formed in the insulating substrate, an implant material (15) filled in the via hole, and wiring patterns formed on the opposite surfaces of the substrates and electrically connected by the implant material, wherein the implant material is selected from a group consisting of acid-free copper, phosphorus-deoxidized copper and tough-pitch copper. Since the via hole comprises high-heat-resisting acid-free copper, phosphorus-deoxidized copper and tough-pitch copper, the printed circuit board is not likely to be deteriorated even when exposed, as is often the case, to a condition that heating/cooling between high temperatures and low temperatures is repeated, and can be used for an extended time while keeping an excellent heat resistance.
    Type: Application
    Filed: July 30, 2003
    Publication date: February 12, 2004
    Inventors: Katsuhiko Hayashi, Tatsuo Kataoka, Hirokazu Kawamura, Akira Ichiryu
  • Publication number: 20020187334
    Abstract: A two-metal TAB tape, double-sided CSP tape, and BGA tape in which the tape has an insulating substrate and wiring layers at least on both sides of the insulating substrate, sprocket holes are made at regular intervals in the longitudinal direction along the edges in the direction of the width, through holes are made in the substrate by punching press, the through holes are filled with conductor by punching press, and the conductor is electrically connected to the wiring layers, characterized in that pilot round holes are made among the sprocket holes made in the longitudinal direction. Methods for producing such two-metal TAB tape, double-sided CSP tape, and BGA tape are disclosed.
    Type: Application
    Filed: May 13, 2002
    Publication date: December 12, 2002
    Inventors: Akira Ichiryu, Tatsuo Kataoka, Hirokazu Kawamura, Katsuhiko Hayashi, Masahito Ishii
  • Patent number: D720056
    Type: Grant
    Filed: May 9, 2012
    Date of Patent: December 23, 2014
    Assignees: Tosetz Co., Ltd., Mirai Industry Co., Ltd.
    Inventors: Norikazu Maki, Hirokazu Kawamura
  • Patent number: D816820
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: May 1, 2018
    Assignees: LIVING ENGINEERING CO., LTD., MIRAI INDUSTRY CO., LTD.
    Inventors: Yasuhide Satoh, Kiyomi Kanamoto, Hirokazu Kawamura