Patents by Inventor Hirokazu Kawamura
Hirokazu Kawamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11944081Abstract: A fishing rod according to one embodiment includes a rod body extending in a front-and-back direction along a central axis, a fitting having a mounting part, where the mounting part is mounted on an outer peripheral surface of the rod body at a first position determined in a circumferential direction around the central axis, and a fiber-reinforced resin layer surrounding the rod body so as to cover the mounting part. The fiber-reinforced resin layer has a first portion covering the rod body along an entire length thereof in the circumferential direction around the central axis and a second portion extending in the axial direction backward from an axially back end of the first portion and extending in the circumferential direction less than 180° clockwise from the first position and also less than 180° anti-clockwise from the first position.Type: GrantFiled: June 28, 2019Date of Patent: April 2, 2024Assignee: GLOBERIDE, Inc.Inventors: Takuji Kawamura, Nobuhiro Izaki, Takahiko Tomioka, Hirokazu Yamamoto
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Patent number: 11937589Abstract: A fishing rod according to one embodiment includes a rod body extending in a front-and-back direction along a central axis, a fitting having a mounting part, where the mounting part is mounted on an outer peripheral surface of the rod body at a first position determined in a circumferential direction around the central axis, and a fiber-reinforced resin layer surrounding the rod body so as to cover the mounting part. The fiber-reinforced resin layer has a first portion covering the rod body along an entire length thereof in the circumferential direction around the central axis and a second portion extending in the axial direction backward from an axially back end of the first portion and extending in the circumferential direction less than 180° clockwise from the first position and also less than 180° anti-clockwise from the first position.Type: GrantFiled: April 26, 2022Date of Patent: March 26, 2024Assignee: GLOBERIDE, INC.Inventors: Takuji Kawamura, Nobuhiro Izaki, Takahiko Tomioka, Hirokazu Yamamoto
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Patent number: 11937590Abstract: A fishing rod according to one embodiment includes a rod body extending in a front-and-back direction along a central axis, a fitting having a mounting part, where the mounting part is mounted on an outer peripheral surface of the rod body at a first position determined in a circumferential direction around the central axis, and a fiber-reinforced resin layer surrounding the rod body so as to cover the mounting part. The fiber-reinforced resin layer has a first portion covering the rod body along an entire length thereof in the circumferential direction around the central axis and a second portion extending in the axial direction backward from an axially back end of the first portion and extending in the circumferential direction less than 180° clockwise from the first position and also less than 180° anti-clockwise from the first position.Type: GrantFiled: April 26, 2022Date of Patent: March 26, 2024Assignee: GLOBERIDE, INC.Inventors: Takuji Kawamura, Nobuhiro Izaki, Takahiko Tomioka, Hirokazu Yamamoto
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Patent number: 10605453Abstract: A conduit made of a synthetic resin, having an inner surface and an outer surface, having concave portions and convex portions alternately and continuously provided in the length direction. The conduit is bendable. The conduit includes outer wall parts extending with a first width in the length direction; inner wall parts positioned radially inside relative to the outer wall parts and extending with a second width in the length direction; and side wall parts joining the outer wall parts and the inner wall parts so that the outer wall parts and the inner wall parts are alternately and continuously provided in the length direction. The outer surfaces of the outer wall parts each have, at both ends in the length direction, protruding parts, which protrude in the radial direction.Type: GrantFiled: January 24, 2017Date of Patent: March 31, 2020Assignees: NORTIZ CORPORATION, TOKYO GAS LIVING ENGINEERING CO., LTD., MIRAI INDUSTRY CO., LTD.Inventors: Masaki Sugatani, Takanori Nagano, Hironao Matsunaga, Takahide Hasegawa, Yasuhide Sato, Kiyomi Kanamoto, Hirokazu Kawamura, Shohei Matsuda
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Publication number: 20180209645Abstract: A conduit made of a synthetic resin, having an inner surface and an outer surface, having concave portions and convex portions alternately and continuously provided in the length direction. The conduit is bendable. The conduit includes outer wall parts extending with a first width in the length direction; inner wall parts positioned radially inside relative to the outer wall parts and extending with a second width in the length direction; and side wall parts joining the outer wall parts and the inner wall parts so that the outer wall parts and the inner wall parts are alternately and continuously provided in the length direction. The outer surfaces of the outer wall parts each have, at both ends in the length direction, protruding parts, which protrude in the radial direction.Type: ApplicationFiled: January 24, 2017Publication date: July 26, 2018Inventors: Masaki SUGATANI, Takanori NAGANO, Hironao MATSUNAGA, Takahide HASEGAWA, Yasuhide SATO, Kiyomi KANAMOTO, Hirokazu KAWAMURA, Shohei MATSUDA
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Patent number: 8414033Abstract: A pipe joint includes: a joint main body with a receiving opening for a pipe; an axially-movable tube-shaped body mounted to the receiving opening; and a retaining ring closely arranged to an outer surface of the pipe for preventing the pipe from detaching, wherein the joint main body includes a receiving portion for receiving the retaining ring, and a tapered portion for radially shrinking the retaining ring, wherein the tube-shaped body is arranged to move between a first position where the retaining ring is allowed to move into the tapered portion, and a second position where the retaining ring is blocked from tapered portion, and wherein the pipe joint is configured such that the pipe can be inserted into the receiving opening when the tube-shaped body is either position, that in the first position the pipe is not detachable, and that in the second position the pipe is detachable.Type: GrantFiled: February 16, 2012Date of Patent: April 9, 2013Assignees: Mirai Industry Co., Ltd., Tosetz Co., Ltd.Inventor: Hirokazu Kawamura
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Publication number: 20120139234Abstract: A pipe joint includes: a joint main body with a receiving opening for a pipe; an axially-movable tube-shaped body mounted to the receiving opening; and a retaining ring closely arranged to an outer surface of the pipe for preventing the pipe from detaching, wherein the joint main body includes a receiving portion for receiving the retaining ring, and a tapered portion for radially shrinking the retaining ring, wherein the tube-shaped body is arranged to move between a first position where the retaining ring is allowed to move into the tapered portion, and a second position where the retaining ring is blocked from tapered portion, and wherein the pipe joint is configured such that the pipe can be inserted into the receiving opening when the tube-shaped body is either position, that in the first position the pipe is not detachable, and that in the second position the pipe is detachable.Type: ApplicationFiled: February 16, 2012Publication date: June 7, 2012Applicants: Tosetz Co., Ltd., Mirai Industry Co., Ltd.Inventor: Hirokazu Kawamura
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Publication number: 20090183901Abstract: A wiring board includes an insulating substrate and a wiring pattern. The wiring pattern includes a main body and an upper end portion and is embedded in the insulating substrate while exposing at least the upper end portion on a surface of the insulating substrate. The upper end portion has a cross-sectional width smaller than that of a lower end portion of the wiring pattern embedded in the insulating substrate. The upper end portion is formed of a metal that is more noble than a metal of the main body of the wiring pattern. The wiring board having this structure achieves very high adhesion of the wiring pattern to the insulating layer.Type: ApplicationFiled: August 9, 2007Publication date: July 23, 2009Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Tatsuo Kataoka, Hirokazu Kawamura
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Publication number: 20090044971Abstract: The printed wiring board includes an insulating base and a plurality of wirings formed on the surface of the insulating base, wherein the wiring circuit has a conductive undercoat layer formed on the surface of the insulating base, a Cu nodule layer formed on the upper surface of the undercoat layer, a cover plating layer formed on the upper surface of the Cu nodule layer and a first metal plating layer formed on the upper surface of the cover plating layer, and on the upper surface of the wiring circuit, a protruded and depressed surface attributable to protrusions and depressions of the upper surface of the Cu nodule layer is formed. The printed wiring board can be produced by depositing the above metal layers such as the Cu nodule layer with regulating a sidewall surface of a pattern formed from the photosensitive resin. Ruther conductive bonding is possible by the use of an adhesive only.Type: ApplicationFiled: November 13, 2006Publication date: February 19, 2009Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Tatsuo Kataoka, Hirokazu Kawamura
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Publication number: 20060220242Abstract: The present invention provides a method for producing a flexible printed wiring board which allows formation of a bump on a wire trace even in a high-density mounting process, and a flexible printed wiring board which realizes high-density mounting with high reliability.Type: ApplicationFiled: March 28, 2006Publication date: October 5, 2006Applicant: Mitsui Mining & Smelting Co., Ltd.Inventor: Hirokazu Kawamura
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Patent number: 6798048Abstract: A 2-metal layer TAB and a both-sided CSP.BGA tape having an insulating substrate and a wiring layer provided on at least both sides of the substrate, the substrate having evenly spaced sprocket holes on both width direction edges in the longitudinal direction thereof and also having through-holes formed with a punching press, and the through-holes being filled with a conductor by means of a punching press such that the conductor and the wiring layers are electrically connected, which is characterized by having round pilot holes between the sprocket holes formed in the longitudinal direction thereof; and a process of producing the same.Type: GrantFiled: May 13, 2002Date of Patent: September 28, 2004Assignees: Mitsui Mining & Smelting Company, Ltd., Suzuki Co., Ltd.Inventors: Akira Ichiryu, Tatsuo Kataoka, Hirokazu Kawamura, Katsuhiko Hayashi, Masahito Ishii
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Publication number: 20040099441Abstract: A printed circuit board comprising an insulating substrate, a through-hole formed in the insulating substrate, an implant material filling the through-hole, and a wiring pattern formed on both faces of the insulating substrate and electrically connected with the implant material, characterized in that one face of a conductor wiring layer wherein a bump penetrates from one face to the other face and protrudes is adhered to the insulating substrate so as to be electrically connected to the implant material. This bump conductor wiring layer of this printed circuit board has a large degree of freedom in forming a wiring pattern, through-hole, and bump and is unlike conventional handled separately from the insulating substrate. Therefore, the effect arises that this circuit board is the target of commercial trading by itself.Type: ApplicationFiled: October 24, 2003Publication date: May 27, 2004Inventors: Akira Ichiryu, Katsuhiko Hayashi, Tatsuo Karaoka, Hirokazu Kawamura, Masahito Ishii
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Publication number: 20040026122Abstract: A printed circuit board comprising an insulating substrate, a via hole (16) formed in the insulating substrate, an implant material (15) filled in the via hole, and wiring patterns formed on the opposite surfaces of the substrates and electrically connected by the implant material, wherein the implant material is selected from a group consisting of acid-free copper, phosphorus-deoxidized copper and tough-pitch copper. Since the via hole comprises high-heat-resisting acid-free copper, phosphorus-deoxidized copper and tough-pitch copper, the printed circuit board is not likely to be deteriorated even when exposed, as is often the case, to a condition that heating/cooling between high temperatures and low temperatures is repeated, and can be used for an extended time while keeping an excellent heat resistance.Type: ApplicationFiled: July 30, 2003Publication date: February 12, 2004Inventors: Katsuhiko Hayashi, Tatsuo Kataoka, Hirokazu Kawamura, Akira Ichiryu
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Publication number: 20020187334Abstract: A two-metal TAB tape, double-sided CSP tape, and BGA tape in which the tape has an insulating substrate and wiring layers at least on both sides of the insulating substrate, sprocket holes are made at regular intervals in the longitudinal direction along the edges in the direction of the width, through holes are made in the substrate by punching press, the through holes are filled with conductor by punching press, and the conductor is electrically connected to the wiring layers, characterized in that pilot round holes are made among the sprocket holes made in the longitudinal direction. Methods for producing such two-metal TAB tape, double-sided CSP tape, and BGA tape are disclosed.Type: ApplicationFiled: May 13, 2002Publication date: December 12, 2002Inventors: Akira Ichiryu, Tatsuo Kataoka, Hirokazu Kawamura, Katsuhiko Hayashi, Masahito Ishii
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Patent number: D720056Type: GrantFiled: May 9, 2012Date of Patent: December 23, 2014Assignees: Tosetz Co., Ltd., Mirai Industry Co., Ltd.Inventors: Norikazu Maki, Hirokazu Kawamura
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Patent number: D816820Type: GrantFiled: February 27, 2015Date of Patent: May 1, 2018Assignees: LIVING ENGINEERING CO., LTD., MIRAI INDUSTRY CO., LTD.Inventors: Yasuhide Satoh, Kiyomi Kanamoto, Hirokazu Kawamura