Abstract: [Problems] Provided is a novel sheet for packaging electronic parts which is excellent in transparency and suitability for thickness reduction. [Means for solving Problems] The sheet for packaging electronic parts is one obtained by biaxially drawing a styrene resin composition comprising 7 to 99.5 mass % of a polystyrene resin (A), 0.5 to 3 mass % of a high-impact polystyrene resin (B) which has a rubber content of 4 to 10 mass %, and 0 to 92.5 mass % styrene-conjugated diene block copolymer (C) wherein the molecular weight of the styrene block part is at least 10,000 and less than 130,000. This sheet has a thickness of 0.1 to 0.7 mm and an orientation release stress value as measured in conformity with ASTM D-1504 of 0.2 to 0.8 MPa.

Abstract: An electroconductive polypropylene type resin foamed sheet comprising a polypropylene type resin foamed sheet, and an electroconductive coating material layer and, preferably, a resin layer, formed on at least one side of the foamed sheet, and having a density of at least 180 kgm?3 and less than 850 kgm?3, wherein the resin layer has a surface resistance of less than 1012 ?/?. A container made of such an electroconductive polypropylene type resin foamed sheet is useful for packaging an electronic component.

Abstract: An electroconductive polypropylene type resin foamed sheet comprising a polypropylene type resin foamed sheet, and an electroconductive coating material layer and, preferably, a resin layer, formed on at least one side of the foamed sheet, and having a density of at least 180 kgm−3 and less than 850 kgm−3, wherein the resin layer has a surface resistance of less than 1012 &OHgr;/□. A container made of such an electroconductive polypropylene type resin foamed sheet is useful for packaging an electronic component.