Patents by Inventor Hirokazu Kumura

Hirokazu Kumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a conductor connection structure of crimp contact
    Patent number: 4969260
    Abstract: A crimp contact for providing a secure mechanical and electrical contact between wire conductors and a contact portion, includes a moisture-impermeable cross-linking adhesive filling the gaps between the crimp portion of the crimp contact and the wire conductors, and between adjacent wire conductors. The adhesive is cross-linked subsequent to filling the gaps, thereby hardening the adhesive.
    Type: Grant
    Filed: May 30, 1989
    Date of Patent: November 13, 1990
    Assignee: Yazaki Corporation
    Inventors: Hiroki Kondo, Hirokazu Kumura