Abstract: A reader includes: a transmission device that repeatedly transmits, at a cycle corresponding to the code length of a prescribed code string, an electromagnetic wave that is phase-adjusted with the prescribed code string; a reception device that receives the reflected wave from the object to be identified, cyclically overlaps a reception signal relating to the reflected wave at the cycle of the code length, and calculates the correlation value of the overlapped result and the prescribed code string; and a control device that controls the transmission device and varies the transmission frequency of the electromagnetic wave in a steplike manner to perform a frequency sweep within a prescribed frequency band, controls the reception device, causing the reception device to calculate the correlation value for each transmission frequency, and specifies the attributes of the object to be identified on the basis of the correlation value for each transmission frequency.

Abstract: The present technology relates to a camera module, a production method, and an electronic device that can prevent reduction of optical module positioning accuracy or heat dissipation performance. An image pickup element is joined on one face of a flexible board so that a light receiving surface of the image pickup element is exposed through an opening of the flexible board, and an optical module is joined on an other face of the flexible board. A reinforcing member is joined on the one face of the flexible board at a circumference of the image pickup element and reinforces a joining part of the flexible board where the optical module is joined. The reinforcing member is joined so as to face an area including at least a part of the joining part and is formed so that a part of the circumference of the image pickup element is kept open.

Abstract: Provided is a sensor apparatus that can suppress movement of foreign matter from a Peltier element to a sensor element. The sensor apparatus includes a package substrate, a Peltier element, a circuit substrate, and a sensor element. The package substrate has a recess portion on a side of a first surface and plural terminals on a side of a second surface located on an opposite side of the first surface. The Peltier element is arranged in the recess portion. The circuit substrate is arranged on an opposite side of a bottom surface of the recess portion with the Peltier element sandwiched therebetween. The sensor element is attached to an opposite side of a surface, the surface being opposed to the Peltier element.

Abstract: An improvement in heat radiation efficiency is achieved. A semiconductor device according to the present technology includes a substrate portion on which a semiconductor chip is mounted and in which an external connection terminal for performing electrical connection to the outside is formed on a rear surface on a side opposite to a front surface which is a surface on a side where the semiconductor chip is mounted, an outer wall portion that protrudes toward the front surface side in an outer circumferential portion of the substrate portion, a lid portion which is supported by the outer wall portion and covers the semiconductor chip, and a heat storage member which is disposed at a position further inside than the outer wall portion between the rear surface of the substrate portion and a rear surface of the lid portion.

Abstract: Provided is a display device and an electronic apparatus that prevent the occurrence of failure in the connection between a mounting substrate and an electronic component. The display device includes an interconnection layer provided on a support substrate, a plurality of insulating layers provided above the interconnection layer, an opening provided in parts of the insulating layers, and a metal layer electrically connected to the interconnection layer and filling the opening up to a height below a layer surface of the insulating layer.

Abstract: To more securely hold reliability of an electronic component. There is provided an electronic component including a base material having a main face, at least one wiring formed on the main face of the base material, at least one pad provided at each end of the at least one wiring on the main face of the base material, a resist part formed to cover the at least one wiring on the main face of the base material, and a chip flip-chip mounted on the main face of the base material and connected to the base material via a bump bonded to the at least one pad, in which the resist part has a pad opening configured to expose the at least one pad bonded with the bump, and a circulation groove formed to be connected to the pad opening at one end as a connection end to the pad opening.

Abstract: To enhance reliability of an electronic component. There is provided an electronic component including a base material having a first face and a second face, a first layer provided on the first face of the base material and including a plurality of pads connected to a plurality of bumps of a chip flip-chip mounted on the first face of the base material, respectively, and a second layer provided on the second face of the base material, in which a contacting member arranged at apart contacting with the second face of the base material at a position corresponding to each of the plurality of pads in the second layer is made of the same material.

Abstract: The present technology relates to a camera module, a production method, and an electronic device that can prevent reduction of optical module positioning accuracy or heat dissipation performance. An image pickup element is joined on one face of a flexible board so that a light receiving surface of the image pickup element is exposed through an opening of the flexible board, and an optical module is joined on an other face of the flexible board so that light enters to the image pickup element through the opening. A reinforcing member is joined on the one face of the flexible board at a circumference of the image pickup element and reinforces a joining part of the flexible board where the optical module is joined. The reinforcing member is joined so as to face an area including at least a part of the joining part and is formed so that a part of the circumference of the image pickup element is kept open.

Abstract: To enable a structure to be downsized, and to restrict a reduction in image quality. There is provided an electronic component including a circuit board having a first face, a second face opposite to the first face, and a first opening, a translucent member provide to oppose the first face of the circuit board, an imaging device flip-chip mounted on the second face of the circuit board and having a light receiving face on a side opposing the translucent member, and a light absorption member provided between the circuit board and the translucent member and formed in a region other than the first opening in plan view on the first face of the circuit board.

Abstract: The present technology relates to an imaging element package and a camera module capable of improving reliability. An imaging element package includes a flexible substrate, an imaging element connected to a first surface of the flexible substrate, and a member, bonded to a second surface of the flexible substrate opposite to the first surface with an adhesive, having a linear expansion coefficient different from the flexible substrate, in which in a portion of the adhesive, a slit is formed which intersects with a direction from the imaging element toward an end of the flexible substrate as viewed from a direction perpendicular to the flexible substrate. The present technology is applied to a camera module.

Abstract: To more securely hold reliability of an electronic component. There is provided an electronic component including a base material having a main face, at least one wiring formed on the main face of the base material, at least one pad provided at each end of the at least one wiring on the main face of the base material, a resist part formed to cover the at least one wiring on the main face of the base material, and a chip flip-chip mounted on the main face of the base material and connected to the base material via a bump bonded to the at least one pad, in which the resist part has a pad opening configured to expose the at least one pad bonded with the bump, and a circulation groove formed to be connected to the pad opening at one end as a connection end to the pad opening.

Abstract: To enable a structure to be downsized, and to restrict a reduction in image quality. There is provided an electronic component including a circuit board having a first face, a second face opposite to the first face, and a first opening, a translucent member provide to oppose the first face of the circuit board, an imaging device flip-chip mounted on the second face of the circuit board and having a light receiving face on a side opposing the translucent member, and a light absorption member provided between the circuit board and the translucent member and formed in a region other than the first opening in plan view on the first face of the circuit board.

Abstract: To enhance reliability of an electronic component. There is provided an electronic component including a base material having a first face and a second face, a first layer provided on the first face of the base material and including a plurality of pads connected to a plurality of bumps of a chip flip-chip mounted on the first face of the base material, respectively, and a second layer provided on the second face of the base material, in which a contacting member arranged at apart contacting with the second face of the base material at a position corresponding to each of the plurality of pads in the second layer is made of the same material.

Abstract: The present technology relates to an imaging element package and a camera module capable of improving reliability. An imaging element package includes a flexible substrate, an imaging element connected to a first surface of the flexible substrate, and a member, bonded to a second surface of the flexible substrate opposite to the first surface with an adhesive, having a linear expansion coefficient different from the flexible substrate, in which in a portion of the adhesive, a slit is formed which intersects with a direction from the imaging element toward an end of the flexible substrate as viewed from a direction perpendicular to the flexible substrate. The present technology is applied to a camera module.

Abstract: To provide a display device and an electronic apparatus that prevent the occurrence of failure in the connection between a mounting substrate and an electronic component. The display device includes: an interconnection layer (111) provided on a support substrate (10); a plurality of insulating layers (121 and 122) provided above the interconnection layer (111); an opening (140) provided in parts of the insulating layers (121 and 122); and a metal layer (130) electrically connected to the interconnection layer (111) and filling the opening (140) up to a height below a layer surface of the insulating layer.

Abstract: A method for detecting at a migration destination medium a change in data during media migration between write once read many (WORM) media according to one embodiment includes writing data for WORM from a migration source medium to the migration destination medium; holding an identifier (ID) of the source medium in a non-user storage area in the destination medium; and holding information indicating a feature of the data in the non-user storage area.

Abstract: In one embodiment, a method includes writing a file into a data partition of a tape medium. The method also includes storing a high resolution tape directory (HRTD) having location information of data in the data partition as part of end of data (EOD) of the index partition. The storing the HRTD as part of the EOD of the index partition includes requesting movement of the tape medium to the index partition in order to update an index file after changes have occurred to data in the data partition, and writing an updated index file into the index partition concurrent to writing an updated HRTD into the EOD of the index partition.

Abstract: In one embodiment, a method includes writing a file into a data partition of a tape medium. The method also includes storing a high resolution tape directory (HRTD) having location information of data in the data partition as part of end of data (EOD) of the index partition. The storing the HRTD as part of the EOD of the index partition includes requesting movement of the tape medium to the index partition in order to update an index file after changes have occurred to data in the data partition, and writing an updated index file into the index partition concurrent to writing an updated HRTD into the EOD of the index partition.

Abstract: In one embodiment, a method includes writing a file into a data partition of a tape medium, writing a pointer of the written file in an index partition and creating a high resolution tape directory (HRTD) including detailed location information of data in a data partition. The method also includes storing the HRTD as part of end of data (EOD) of the index partition in response to a tape cartridge housing the tape medium being unloaded. The storing the HRTD as part of the EOD of the index partition includes requesting movement of the tape medium to the index partition in order to update an index file after changes have occurred to data in the data partition, writing an updated index file into the index partition concurrent to writing an updated HRTD into the EOD of the index partition, and requesting for the tape cartridge to be unloaded.

Abstract: A first data group in an access sequence is selected. A distance from a current position of the tape medium is set to be a logical distance value, determined by a calculation function, that is substituted for the physical distance value for the data groups that are located in the specified regions as compared with other data groups located in the alternative specified regions. A second data group in the access sequence is selected. The logical distance value is then determined by multiplying a coefficient based on a physical positioning of each of the data groups in the tape medium, and a percentage of those of the plurality of data groups that have already been selected as the first data group and the second data group.