Patents by Inventor Hirokazu Ohnishi

Hirokazu Ohnishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939465
    Abstract: A prepreg having high processability and laminating performance and a method to produce such a prepreg is described, the prepreg comprising at least the components [A] to [E] shown below, and having a structure incorporating a first layer composed mainly of the component [A] and a first epoxy resin composition that contains the components [B] to [D] but which is substantially free of the component [E], and a second layer composed mainly of a second epoxy resin composition that contains the components [B] to [E], [A] carbon fiber, [B] epoxy resin, [C] curing agent, [D] thermoplastic resin, and [E] particles containing a thermoplastic resin as primary component and having a volume-average particle diameter of 5 to 50 ?m.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: March 26, 2024
    Assignee: Toray Industries, Inc.
    Inventors: Hiroshi Kobayashi, Taiki Maeyama, Daisuke Kido, Takashi Ikushima, Naofumi Hosokawa, Hirokazu Ohnishi
  • Publication number: 20210363316
    Abstract: A prepreg having high processability and laminating performance and a method to produce such a prepreg in an industrially advantageous way is described, the prepreg comprising at least the components [A] to [E] shown below, and having a structure incorporating a first layer composed mainly of the component [A] and a first epoxy resin composition that contains the components [B] to [D] but which is substantially free of the component [E], and a second layer composed mainly of a second epoxy resin composition that contains the components [B] to [E] and which is disposed adjacent to each surface of the first layer, the second epoxy resin composition being characterized in that its component [D] has a weight-average molecular weight of 2,000 to 30,000 g/mol and accounts for 5 to 15 parts by mass relative to the total quantity of its components [B] to [E], which accounts for 100 parts by mass, [A] carbon fiber, [B] epoxy resin, [C] curing agent, [D] thermoplastic resin, and [E] particles containing a thermoplasti
    Type: Application
    Filed: March 27, 2019
    Publication date: November 25, 2021
    Applicant: Toray Industries, Inc.
    Inventors: Hiroshi Kobayashi, Taiki Maeyama, Daisuke Kido, Takashi Ikushima, Naofumi Hosokawa, Hirokazu Ohnishi
  • Publication number: 20210122892
    Abstract: A prepreg having a high processability and laminating performance in an automated lay-up device and serving to produce a cured product having good physical properties is described, and also a method for the production thereof, the prepreg comprising at least the components [A] to [E] listed blow and having a structure incorporating a first layer composed mainly of the component [A] and a first epoxy resin composition that contains the components [B] to [D] but is substantially free of the component [E] and a second layer composed mainly of a second epoxy resin composition that contains the components [B] to [E] and disposed adjacent to each surface of the first layer: [A] carbon fiber, [B] epoxy resin, [C] curing agent, [D] thermoplastic resin, and [E] particles containing a thermoplastic resin as primary component and having a volume-average particle diameter of 5 to 50 ?m.
    Type: Application
    Filed: June 25, 2019
    Publication date: April 29, 2021
    Applicant: Toray Industries, Inc.
    Inventors: Hiroshi Kobayashi, Taiki Maeyama, Daisuke Kido, Takashi Ikushima, Naofumi Hosokawa, Hirokazu Ohnishi
  • Patent number: 5365521
    Abstract: A data transmission among the exchange modules in the building block type exchanger with improved efficiency, reliability and simplicity of implementation. An ATM connector is connected to the STM exchange module connector through at least one STM transmission line containing logical transmission paths provided in correspondence to the logical STM transmission path for transmission of specific data connected from each exchange module to the STM exchange module connector and fixedly switched by the STM exchange module connector to the logical transmission paths of the STM transmission line connected to the ATM connector. The specific data to be transmitted from each exchange module are transmitted in a form of ATM cells to the ATM connector, while all the specific data to be transmitted to each exchange module are multiplexed in a form of multiplexed ATM cells at the ATM connector and the multiplexed ATM cells are transmitted from the ATM connector to each exchange module.
    Type: Grant
    Filed: February 18, 1993
    Date of Patent: November 15, 1994
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Hirokazu Ohnishi, Shinji Yasuda, Kiminori Shinozaki, Kouji Kogure, Shigehiko Suzuki
  • Patent number: 5156861
    Abstract: A washing apparatus of a screw for extruder including a casing, support rollers installed in the casing so as to support a screw rotatably, a drive motor for rotating the screw, a water jet assembly having a nozzle and nozzle rotation section, a nozzle inclination motor to incline the water jet assembly relative to the axis direction of the screw. A nozzle hole of the water jet assembly is inclined to face one way relative to the axis of the screw placed on support roller assemblies. The nozzle is rotated eccentrically about the nozzle hole and moved from one end to the other of the screw, changing the nozzle hole direction to the other way relative to the screw at the other end of the screw. The screw is rotated so that an unwashed part of the screw faces the nozzle and is washed. This cycle is repeated until the entire surface of the screw is rotated.
    Type: Grant
    Filed: May 23, 1991
    Date of Patent: October 20, 1992
    Assignees: Hitachi Zosen Trading & Manufacturing Co., Ltd., San-Ai Engineering Ltd.
    Inventors: Shiro Tsuchiya, Kinichi Kaneko, Hiroshi Kasahara, Hirokazu Ohnishi, Mitsuaki Hashimoto