Abstract: In a method for manufacturing a multilayer substrate for having a BGA-type component thereon, a conductive through hole for restricting a signal interference and a resist film are formed on the multilayer substrate, an occurrence of a fault caused by a residual of a resist in the conductive through hole is reduced. In the method for manufacturing the multilayer substrate for having the BGA-type component thereon, a step of forming the resist film includes an applying step of applying a photosensitive resist to an entirety of a front surface portion of a base. The applying step is performed while restricting the resist from entering the conductive through hole by supplying a high pressure air to a rear surface of the base to pass through the conductive through hole using an air supply mechanism.

Abstract: In a method for manufacturing a multilayer substrate for having a BGA-type component thereon, a conductive through hole for restricting a signal interference and a resist film are formed on the multilayer substrate, an occurrence of a fault caused by a residual of a resist in the conductive through hole is reduced. In the method for manufacturing the multilayer substrate for having the BGA-type component thereon, a step of forming the resist film includes an applying step of applying a photosensitive resist to an entirety of a front surface portion of a base. The applying step is performed while restricting the resist from entering the conductive through hole by supplying a high pressure air to a rear surface of the base to pass through the conductive through hole using an air supply mechanism.

Abstract: An oily liquid and an aqueous liquid as prepared at a temperature of 80.degree. C. are continuously emulsified at a temperature of 50.degree. C. or higher to give an emulsion, then a liquid comprising a polyamine and a concentration adjusting water of 50.degree. C. or higher is added to the emulsion and mixed in a static mixer, the emulsion mix is continuously flown into an encapsulation device from the bottom to the top thereof, and microcapsules are obtained by overflowing after a retention time of 60 minutes on average.

Abstract: Surfaces of roads, bridges, floors, etc., are easily paved by using a mixture of at least one of granular, powdery and flaky asphalt material and a suitable paving aggregate and applying heat and press thereto at the working site.

Abstract: This invention provides a novel granular asphalt which comprises granules having the size of from about 0.074 to about 10 mm and being in the shape of a polyhedron having at least one acute angle. The granular asphalt has excellent properties. In particular, it can be melted rapidly and easily with small thermal capacity and slight heating, without causing thermal decomposition, denaturing and air pollution. The granular asphalt is useful, for example, for producing asphalt compound, cutback asphalt, rubberized asphalt, etc., for use in water-proofing, paving, sealing, etc., and for making asphalt block, asphalt tile, asphalt roofing, tarpaulin paper, flooring sheet, paint and varnish, etc.