Abstract: A biosensor includes: a flow channel through which a liquid sample flows, the liquid sample containing a specific component; a holding sheet that is disposed in the flow channel and holds a substance corresponding to the specific component; and a first temperature sensor that is disposed to correspond to the holding sheet and detects a reaction heat generated by a contact reaction between the specific component and the corresponding substance. The biosensor acquires information on the specific component based on the reaction heat.

Abstract: A pulse wave sensor unit includes a pressure sensor, and an adhesive tape to attach the pressure sensor to a measurement portion to be measured. The pressure sensor includes a diaphragm part, and an annular support part which supports the diaphragm part and has an aperture for allowing the diaphragm part to face the measurement portion, and a closed space is able to be formed between the diaphragm part and the measurement portion by attaching the pressure sensor to the measurement portion using the adhesive tape.

Abstract: A pulse wave sensor unit includes a pressure sensor, and an adhesive tape to attach the pressure sensor to a measurement portion to be measured. The pressure sensor includes a diaphragm part, and an annular support part which supports the diaphragm part and has an aperture for allowing the diaphragm part to face the measurement portion, and a closed space is able to be formed between the diaphragm part and the measurement portion by attaching the pressure sensor to the measurement portion using the adhesive tape.

Abstract: A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided on the circuit board, a lead substrate being provided substantially parallel to the circuit board, and a lead of conductive member being electrically connected to the electrode pad by being bent in a direction away from a surface of the lead substrate, one end of the lead being adhered to the lead substrate and the other end being a free end.

Abstract: There is provided a bimorph element including a silicon oxide layer, a high expansion coefficient layer that is formed on the silicon oxide layer and has a thermal expansion coefficient higher than a thermal expansion coefficient of the silicon oxide layer, and a deformation preventing film that covers a surface of the silicon oxide layer and prevents the silicon oxide layer from being deformed over time. The deformation preventing film has a transmission factor of moisture and oxygen lower than that of the silicon oxide layer. The deformation preventing film is a silicon oxide film that is formed with energy higher than that used in a case that forms the silicon oxide layer. The deformation preventing film is a silicon nitride film or a metallic film.

Abstract: A bimorph switch electrically connecting a traveling contact and a fixed contact. The switch comprises a substrate having a front face, a rear face, and a through hole penetrating from the front face to the rear face; a fixed contact extending from an edge portion of the aperture of the through hole towards the inside of the aperture; and a bimorph section holding the traveling contact at a position facing the aperture and driving the traveling contact. One end of the bimorph section may be formed on a silicon oxide layer formed on a front face of the substrate.

Abstract: A microswitch that switches a signal path of a high-frequency signal is provided. The microswitch includes a circuit board; a pair of first feedthrough lines spaced from each other on a circuit board that electrically connect the first surface and the second surface of the circuit board, respectively; a pair of first signal lines which are faced to each other with a gap therebetween on a straight line connecting the pair of first feedthrough lines on the first surface of the circuit board and electrically connected to the pair of first feedthrough lines, respectively; and a movable section which can switch between being in contact with and being spaced from the first surface of the circuit board and electrically connects the pair of signal lines with each other when the it is in contact with the first surface of the circuit board.

Abstract: There is provided a bimorph element including a silicon oxide layer, a high expansion coefficient layer that is formed on the silicon oxide layer and has a thermal expansion coefficient higher than a thermal expansion coefficient of the silicon oxide layer, and a deformation preventing film that covers a surface of the silicon oxide layer and prevents the silicon oxide layer from being deformed over time. The deformation preventing film has a transmission factor of moisture and oxygen lower than that of the silicon oxide layer. The deformation preventing film is a silicon oxide film that is formed with energy higher than that used in a case that forms the silicon oxide layer. The deformation preventing film is a silicon nitride film or a metallic film.

Abstract: A bimorph switch electrically connecting a traveling contact and a fixed contact. The switch comprises a substrate having a front face, a rear face, and a through hole penetrating from the front face to the rear face; a fixed contact extending from an edge portion of the aperture of the through hole towards the inside of the aperture; and a bimorph section holding the traveling contact at a position facing the aperture and driving the traveling contact. One end of the bimorph section may be formed on a silicon oxide layer formed on a front face of the substrate.

Abstract: A bimorph switch electrically connecting a traveling contact and a fixed contact. The switch comprises a substrate having a front face, a rear face, and a through hole penetrating from the front face to the rear face; a fixed contact extending from an edge portion of the aperture of the through hole towards the inside of the aperture; and a bimorph section holding the traveling contact at a position facing the aperture and driving the traveling contact. One end of the bimorph section may be formed on a silicon oxide layer formed on a front face of the substrate.

Abstract: A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided on the circuit board, a lead substrate being provided substantially parallel to the circuit board, and a lead of conductive member being electrically connected to the electrode pad by being bent in a direction away from a surface of the lead substrate, one end of the lead being adhered to the lead substrate and the other end being a free end.

Abstract: A bimorph switch electrically connecting a traveling contact and a fixed contact. The switch comprises a substrate having a front face, a rear face, and a through hole penetrating from the front face to the rear face; a fixed contact extending from an edge portion of the aperture of the through hole towards the inside of the aperture; and a bimorph section holding the traveling contact at a position facing the aperture and driving the traveling contact. One end of the bimorph section may be formed on a silicon oxide layer formed on a front face of the substrate.

Abstract: A switch, comprising a movable part supported at both ends and a contact installed on the movable part, the movable part characterized by further comprising a first bimetal for displacing the contact in a specified direction according to a temperature and a second bimetal for displacing the contact in the direction opposite to the specified direction according to the temperature.