Abstract: According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a wiring substrate connected to the first substrate, a cover member located on an opposite side to the first substrate so as to interpose the second substrate therebetween and a conductive layer maintained at a predetermined potential, and the first substrate includes an extension portion extending further from the second substrate, the wiring substrate is connected to the extension portion, the cover member includes a first surface opposing the extension portion, and the conductive layer overlaps the extension portion in plan view.

Abstract: An imaging apparatus according to an embodiment includes: a solid-state imaging element (11) that has a light-receiving surface on which light-receiving elements are arranged in a two-dimensional matrix manner, a glass substrate (20) that is arranged on the light-receiving surface of the solid-state imaging element, and an infrared cut filter (22) that is arranged on a second surface of the glass substrate via a cavity layer (23), where the second surface is opposite to a first surface facing the light-receiving surface.

Abstract: According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a wiring substrate connected to the first substrate, a cover member located on an opposite side to the first substrate so as to interpose the second substrate therebetween and a conductive layer maintained at a predetermined potential, and the first substrate includes an extension portion extending further from the second substrate, the wiring substrate is connected to the extension portion, the cover member includes a first surface opposing the extension portion, and the conductive layer overlaps the extension portion in plan view.

Abstract: Provided is an imaging device capable of suppressing an influence of flare. An imaging device according to the present disclosure includes: a pixel region in which a plurality of pixels that performs photoelectric conversion is arranged; an on-chip lens provided on the pixel region; a protective member provided on the on-chip lens; and a resin layer that adheres between the on-chip lens and the protective member, in which when a thickness of the resin layer and the protective member is T, a length of a diagonal line of the pixel region viewed from an incident direction of light is L, and a critical angle of the protective member is ?c, T?L/2/tan?c (Formula 2) or T?L/4/tan?c (Formula 3) is satisfied.

Abstract: According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a wiring substrate connected to the first substrate, a cover member located on an opposite side to the first substrate so as to interpose the second substrate therebetween and a conductive layer maintained at a predetermined potential, and the first substrate includes an extension portion extending further from the second substrate, the wiring substrate is connected to the extension portion, the cover member includes a first surface opposing the extension portion, and the conductive layer overlaps the extension portion in plan view.

Abstract: Provided is an imaging device that includes a first coil that moves a lens that collects light from a subject, in an optical axis direction of the light in accordance with a first magnetic field and that moves together with the lens, a second coil for moving the lens in a direction perpendicular to the optical axis in accordance with a second magnetic field, and a third coil for detecting the first magnetic field. The second coil and the third coil are arranged on a same substrate.

Abstract: According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a wiring substrate connected to the first substrate, a cover member located on an opposite side to the first substrate so as to interpose the second substrate therebetween and a conductive layer maintained at a predetermined potential, and the first substrate includes an extension portion extending further from the second substrate, the wiring substrate is connected to the extension portion, the cover member includes a first surface opposing the extension portion, and the conductive layer overlaps the extension portion in plan view.

Abstract: Provided are an imaging device having more superior optical characteristics, a method of manufacturing the imaging device, and an electronic device at a lower cost. An imaging device according to an embodiment includes: an imaging element (10) including a solid-state imaging element (100) on which a light receiving surface in which light receiving elements are arranged in a two-dimensional lattice shape is formed, and a protection member (101, 102) disposed on a side of the light receiving surface with respect to the solid-state imaging element, in which the imaging element includes a curved portion curved from the light receiving surface of the solid-state imaging element toward a surface on an opposite side of the light receiving surface.

Abstract: An inspection device according to one aspect of the present disclosure includes an image capturing unit configured to capture an image of an EUV mask provided with a pattern, a storage unit configured to store a database intermediate file including a gray image obtained by pixelating a binarized image rasterized from design data of the pattern, and a processing unit configured to inspect the EUV mask on the basis of a captured image obtained by the image capturing unit capturing an image of the EUV mask. The processing unit includes a conversion model generated by a learning machine configured to perform learning by deep learning, a reference image generation unit configured to generate a reference image from the gray image by using the conversion model, and a comparison unit configured to compare the reference image with the captured image.

Abstract: The present technology relates to a camera module, a production method, and an electronic device that can prevent reduction of optical module positioning accuracy or heat dissipation performance. An image pickup element is joined on one face of a flexible board so that a light receiving surface of the image pickup element is exposed through an opening of the flexible board, and an optical module is joined on an other face of the flexible board. A reinforcing member is joined on the one face of the flexible board at a circumference of the image pickup element and reinforces a joining part of the flexible board where the optical module is joined. The reinforcing member is joined so as to face an area including at least a part of the joining part and is formed so that a part of the circumference of the image pickup element is kept open.

Abstract: The present technology relates to an imaging device and an electronic device that enable highly accurate adjustment of a focus position and a camera shake correction position. The device includes: a lens that focuses subject light; an imaging element that photoelectrically converts the subject light from the lens; a circuit substrate including a circuit that externally outputs a signal from the imaging element; an actuator that drives the lens with a Pulse Width Modulation (PWM) waveform in at least one of an X-axis direction, a Y-axis direction, or a Z-axis direction; and a detection unit that detects a magnetic field generated by a coil included in the actuator. The actuator drives the lens to move a focus, or drives the lens to reduce an influence of camera shake. The present technology can be applied to the imaging device.

Abstract: According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a wiring substrate connected to the first substrate, a cover member located on an opposite side to the first substrate so as to interpose the second substrate therebetween and a conductive layer maintained at a predetermined potential, and the first substrate includes an extension portion extending further from the second substrate, the wiring substrate is connected to the extension portion, the cover member includes a first surface opposing the extension portion, and the conductive layer overlaps the extension portion in plan view.

Abstract: According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a wiring substrate connected to the first substrate, a cover member located on an opposite side to the first substrate so as to interpose the second substrate therebetween and a conductive layer maintained at a predetermined potential, and the first substrate includes an extension portion extending further from the second substrate, the wiring substrate is connected to the extension portion, the cover member includes a first surface opposing the extension portion, and the conductive layer overlaps the extension portion in plan view.

Abstract: An imaging device according to an embodiment includes: a first coil (12) that moves a lens (10) that collects light from a subject, in an optical axis direction of the light in accordance with a first magnetic field and that moves together with the lens; a second coil (31a, 31b, 31c, 31d) for moving the lens in a direction perpendicular to the optical axis in accordance with a second magnetic field; and a third coil (32a, 32b, 32c, 32d) for detecting the first magnetic field. The second coil and the third coil are arranged on a same substrate (30).

Abstract: An imaging apparatus according to an embodiment includes: a solid-state imaging element (11) that has a light-receiving surface on which light-receiving elements are arranged in a two-dimensional matrix manner, a glass substrate (20) that is arranged on the light-receiving surface of the solid-state imaging element, and an infrared cut filter (22) that is arranged on a second surface of the glass substrate via a cavity layer (23), where the second surface is opposite to a first surface facing the light-receiving surface.

Abstract: A size reduction of an image pickup module by using resin molding, including a reduction in height, area, or the like thereof is achieved in an actual product. Provided is a module, including a substrate; a semiconductor component in which a first surface of a semiconductor device manufactured by chip-size packaging is provided and fixed along a plate-shaped translucent member, and a second surface of the semiconductor device is fixed with the second surface caused to face the substrate; a frame portion made of resin and formed on the substrate to surround the semiconductor component; and an interposition member which is made of resin and with which a gap between the semiconductor component and the substrate is filled. The interposition member is connected and fixed to the frame portion to be integrated therewith.

Abstract: The present technology relates to a semiconductor device including: a solid-state image sensor having a pixel array unit in which a plurality of pixels each having a photoelectric conversion element is two-dimensionally arranged in a matrix; and a flexible printed circuit having wiring adapted to connect a pad portion provided on an upper surface side to be located on a light receiving surface side of the solid-state image sensor to an external terminal provided on a lower surface side opposite to the upper surface side, in which the flexible printed circuit is arranged along respective surfaces of the solid-state image sensor such that a position of an end portion located on the upper surface side becomes a position different from a position in a space above the light receiving surface.

Abstract: The present technology relates to a camera module, a production method, and an electronic device that can prevent reduction of optical module positioning accuracy or heat dissipation performance. An image pickup element is joined on one face of a flexible board so that a light receiving surface of the image pickup element is exposed through an opening of the flexible board, and an optical module is joined on an other face of the flexible board so that light enters to the image pickup element through the opening. A reinforcing member is joined on the one face of the flexible board at a circumference of the image pickup element and reinforces a joining part of the flexible board where the optical module is joined. The reinforcing member is joined so as to face an area including at least a part of the joining part and is formed so that a part of the circumference of the image pickup element is kept open.

Abstract: The present technology relates to an imaging device and an electronic device that enable highly accurate adjustment of a focus position and a camera shake correction position. The device includes: a lens that focuses subject light; an imaging element that photoelectrically converts the subject light from the lens; a circuit substrate including a circuit that externally outputs a signal from the imaging element; an actuator that drives the lens with a Pulse Width Modulation (PWM) waveform in at least one of an X-axis direction, a Y-axis direction, or a Z-axis direction; and a detection unit that detects a magnetic field generated by a coil included in the actuator. The actuator drives the lens to move a focus, or drives the lens to reduce an influence of camera shake. The present technology can be applied to the imaging device.

Abstract: The present technology relates to an imaging element package and a camera module capable of improving reliability. An imaging element package includes a flexible substrate, an imaging element connected to a first surface of the flexible substrate, and a member, bonded to a second surface of the flexible substrate opposite to the first surface with an adhesive, having a linear expansion coefficient different from the flexible substrate, in which in a portion of the adhesive, a slit is formed which intersects with a direction from the imaging element toward an end of the flexible substrate as viewed from a direction perpendicular to the flexible substrate. The present technology is applied to a camera module.