Patents by Inventor Hirokazu Shiraishi

Hirokazu Shiraishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11840963
    Abstract: An acoustic attenuator comprises a first attenuation unit, a second attenuation unit, a welded section, and a communication part. A first acoustic damper is provided on an outer surface of a first acoustic liner, which faces toward a side opposite from an object, to form a first damper space that communicates with an internal space of the object. The second attenuation unit is attached to an outer surface of the object. The welded section is provided at least between the first acoustic damper and a second acoustic damper. The welded section secures the second attenuation unit to the first acoustic liner. The communication part is disposed in a position farther from an outer surface of the object than the welded section, allowing communication between the first damper space and a second damper space.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: December 12, 2023
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Hirokazu Shiraishi, Tatsuya Nadayoshi, Kentaro Murakami
  • Publication number: 20220349346
    Abstract: An acoustic attenuator comprises a first attenuation unit, a second attenuation unit, a welded section, and a communication part. A first acoustic damper is provided on an outer surface of a first acoustic liner, which faces toward a side opposite from an object, to form a first damper space that communicates with an internal space of the object. The second attenuation unit is attached to an outer surface of the object. The welded section is provided at least between the first acoustic damper and a second acoustic damper. The welded section secures the second attenuation unit to the first acoustic liner. The communication part is disposed in a position farther from an outer surface of the object than the welded section, allowing communication between the first damper space and a second damper space.
    Type: Application
    Filed: July 28, 2020
    Publication date: November 3, 2022
    Applicant: Mitsubishi Power, Ltd.
    Inventors: Hirokazu Shiraishi, Tatsuya Nadayoshi, Kentaro Murakami
  • Patent number: 10220377
    Abstract: The present invention is a metal colloid solution comprising: colloidal particles consisting of metal particles consisting of one or two or more metal(s) and a protective agent bonding to the metal particles; and a solvent as a dispersion medium of the colloidal particles, wherein: a chloride ion concentration per a metal concentration of 1 mass % is 25 ppm or less; and a nitrate ion concentration per a metal concentration of 1 mass % is 7500 ppm or less. In the present invention, adsorption performance can be improved with adjustment of the amount of the protective agent of the colloidal particles. It is preferable to bind the protective agent of 0.2 to 2.5 times the mass of the metal particles.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: March 5, 2019
    Assignee: TANAKA KIKINZOKU KOGOY K.K.
    Inventors: Yuusuke Ohshima, Hitoshi Kubo, Tomoko Ishikawa, Noriaki Nakamura, Junichi Taniuchi, Yoshiteru Tsuchiya, Hiroaki Takahashi, Hidenori Takanezawa, Kenichi Inoue, Syunsuke Kato, Hirokazu Shiraishi
  • Publication number: 20140357470
    Abstract: The present invention is a metal colloid solution comprising: colloidal particles consisting of metal particles consisting of one or two or more metal(s) and a protective agent bonding to the metal particles; and a solvent as a dispersion medium of the colloidal particles, wherein: a chloride ion concentration per a metal concentration of 1 mass % is 25 ppm or less; and a nitrate ion concentration per a metal concentration of 1 mass % is 7500 ppm or less. In the present invention, adsorption performance can be improved with adjustment of the amount of the protective agent of the colloidal particles. It is preferable to bind the protective agent of 0.2 to 2.5 times the mass of the metal particles.
    Type: Application
    Filed: February 8, 2013
    Publication date: December 4, 2014
    Applicant: Tanaka Kikinzoku Kogyo K.K.
    Inventors: Yuusuke Ohshima, Hitoshi Kubo, Tomoko Ishikawa, Noriaki Nakamura, Junichi Taniuchi, Yoshiteru Tsuchiya, Hiroaki Takahashi, Hidenori Takanezawa, Kenichi Inoue, Syunsuke Kato, Hirokazu Shiraishi