Abstract: A coil fixing member of a rotating electrical machine, wherein the rotating electrical machine includes a ring-shaped stator core, a slot formed at inner peripheral section of the stator core, a coil arranged in the slot, and wall sections defining opening on an inner periphery of the slot in a radial direction of the stator core, and wherein the coil fixing member is inserted into the slot, the coil fixing member comprising: a pressing section that presses the coil outward in the radial direction of the stator core; and engaging sections that are adjacent to both end sections of the pressing section in a peripheral direction of the stator core, that extend from the both end sections to an inward side in the radial direction of the stator core, and that include leading end sections respectively engaged with the wall sections.

Abstract: A coil fixing member of a rotating electrical machine, wherein the rotating electrical machine includes a ring-shaped stator core, a slot formed at inner peripheral section of the stator core, a coil arranged in the slot, and wall sections defining opening on an inner periphery of the slot in a radial direction of the stator core, and wherein the coil fixing member is inserted into the slot, the coil fixing member comprising: a pressing section that presses the coil outward in the radial direction of the stator core; and engaging sections that are adjacent to both end sections of the pressing section in a peripheral direction of the stator core, that extend from the both end sections to an inward side in the radial direction of the stator core, and that include leading end sections respectively engaged with the wall sections.

Abstract: A stator includes annular segment assembly portions of phases wound on a stator core in a distributed winding manner. The annular segment assembly portion of each phase includes segment coils that are each formed in a coil shape by connecting conductor segments to each other. An annular protrusion-equipped electrical insulation sheet is inserted between two conductor segments adjacent to each other in the radial direction in a turn portion-side coil end portion that is formed of portions of the segment coils which portions are protruded to an outer side from an end surface of the stator core in the axial direction. The protrusion-equipped electrical insulation sheet has a protrusion that is provided on an end edge of an annular main body portion on the side opposite to the stator core side in the axial direction so that the protrusion is protruded in the axial direction from the end edge.

Abstract: A method for manufacturing a semiconductor device formed by fractionization and division after a plurality of semiconductor elements are formed over a semiconductor substrate, includes forming a first resist portion over the semiconductor substrate prior to its fractionization. Trenches are formed in areas for dicing the semiconductor substrate. A second resin portion different in composition from the first resin portion is formed in each of the trenches. The semiconductor substrate is diced with respect to the second resin portion with widths each narrower than the trench thereby to bring the semiconductor device into fractionization and division.

Abstract: The semiconductor device comprises a first area and a second area positioned adjacent to the outside of the first area, the semiconductor substrate having a main surface and side surfaces and disposed in such a manner that the main surface is positioned in the first area and each of the side surfaces is positioned at a boundary between the first area and the second area, a plurality of pads formed over the main surface of the semiconductor substrate and a plurality of external connecting terminals formed thereon, which are respectively electrically connected to the pads, a first resin portion which is formed over the main surface of the semiconductor substrate so as to cover the pads and has a main surface and side surfaces, and which is formed in such a manner that the external connecting terminals are exposed from the main surface and each of the side surfaces is positioned at the boundary, and a second resin portion which is positioned in the second area and formed so as to cover the side surfaces of the s

Abstract: To provide a semiconductor substrate whose columnar member for alignment is difficult to fall off and a manufacturing method thereof. An alignment mark 24 (columnar member for alignment) and protection posts 26 surrounding the alignment mark 24 to protect the alignment mark are disposed in an alignment mark forming region 14 of a semiconductor wafer 101 (semiconductor substrate). Each of the protection posts has a diameter (maximum diameter) of, for example, 0.6 ?m. The protection posts 26 are arranged such that the diameter of each of the columnar protection posts 26 is greater than a diameter (for example, 0.2 ?m) of the alignment mark 24. That is, the protection posts 26 are arranged such that the contact area between each of the protection posts 26 and an underlayer thereof (dummy wire layer 22) is greater than the contact area between the alignment mark 24 and an underlayer thereof (dummy wire layer 22).

Abstract: To provide a semiconductor substrate whose columnar member for alignment is difficult to fall off and a manufacturing method thereof. An alignment mark 24 (columnar member for alignment) and protection posts 26 surrounding the alignment mark 24 to protect the alignment mark are disposed in an alignment mark forming region 14 of a semiconductor wafer 101 (semiconductor substrate). Each of the protection posts has a diameter (maximum diameter) of, for example, 0.6 ?m. The protection posts 26 are arranged such that the diameter of each of the columnar protection posts 26 is greater than a diameter (for example, 0.2 ?m) of the alignment mark 24. That is, the protection posts 26 are arranged such that the contact area between each of the protection posts 26 and an underlayer thereof (dummy wire layer 22) is greater than the contact area between the alignment mark 24 and an underlayer thereof (dummy wire layer 22).

Abstract: The semiconductor device comprises a first area and a second area positioned adjacent to the outside of the first area, the semiconductor substrate having a main surface and side surfaces and disposed in such a manner that the main surface is positioned in the first area and each of the side surfaces is positioned at a boundary between the first area and the second area, a plurality of pads formed over the main surface of the semiconductor substrate and a plurality of external connecting terminals formed thereon, which are respectively electrically connected to the pads, a first resin portion which is formed over the main surface of the semiconductor substrate so as to cover the pads and has a main surface and side surfaces, and which is formed in such a manner that the external connecting terminals are exposed from the main surface and each of the side surfaces is positioned at the boundary, and a second resin portion which is positioned in the second area and formed so as to cover the side surfaces of the s

Abstract: A semiconductor device according to the present invention includes a semiconductor substrate, which comprises a first surface on which an electrode pad is formed, and a second surface arranged at an opposite side of the first surface; an external terminal formed on the first surface of the semiconductor substrate and is electrically connected to the electrode pad; and a sealing resin which seals the first surface so that a surface of the external terminal is exposed. An outer edge of the second surface has a chamfered portion, a surface of which is inclined by substantially 45 degrees from the second surface.

Abstract: A semiconductor device according to the present invention includes a semiconductor substrate, which comprises a first surface on which an electrode pad is formed, and a second surface arranged at an opposite side of the first surface; an external terminal formed on the first surface of the semiconductor substrate and is electrically connected to the electrode pad; and a sealing resin which seals the first surface so that a surface of the external terminal is exposed. An outer edge of the second surface has a chamfered portion, a surface of which is inclined by substantially 45 degrees from the second surface.

Abstract: A semiconductor device according to the present invention includes a semiconductor substrate, which comprises a first surface on which an electrode pad is formed, and a second surface arranged at an opposite side of the first surface; an external terminal formed on the first surface of the semiconductor substrate and is electrically connected to the electrode pad; and a sealing resin which seals the first surface so that a surface of the external terminal is exposed. An outer edge of the second surface has a chamfered portion, a surface of which is inclined by substantially 45 degrees from the second surface.