Abstract: A thin film piezoelectric element including a first structure having a sequential stack of layers, a first main electrode layer, a first opposed electrode layer and a first piezoelectric thin film having a first polarizing direction located between the first electrode layers, a second structure having as a sequential stack of layers, a second main electrode layer, a second opposed electrode layer and a second piezoelectric thin film having a second polarizing direction located between the second electrode layers, an insulating resin layer covering peripheral portions of the first and second structures, and at least one connecting electrode pad located at a side of one of the first and second structures, for connecting the main electrode layer and the opposed electrode layer of the structures to external equipment, wherein each first and second structures has a cross-sectional shape such that the piezoelectric thin film is tapered, diminishing in width, from a portion near the main electrode layer to a portion

Abstract: A method of manufacturing a thin film piezoelectric element, wherein main electrode layer, piezoelectric thin film, and opposed electrode layer respectively having specified shapes are first formed on first substrate and second substrate, and after that, the opposed electrodes are opposed and bonded to each other, and insulating resin layer is formed over the peripheral portion thereof, and then the second substrate is removed, the insulating resin layer is etched, and connecting electrode pad is formed, and finally, the first substrate is removed to obtain a completely separated thin film piezoelectric element. By this method, it is possible to improve the reproducibility of shapes and to prevent trouble such as shorting between the electrodes which hold the piezoelectric thin film, thereby making it possible to provide a thin film piezoelectric element that may assure high yield without variation in piezoelectric characteristics, and its manufacturing method.

Abstract: Two piezoelectric thin films each sandwiched between a main electrode layer and an opposite electrode layer are laminated in pairs to form a thin film piezoelectric element. An electrode leading area has a region in which the main electrode layer partially projects from the piezoelectric thin film, and another region in which only an insulating layer is formed on a part of the opposite electrode layer. At least one of a first opening formed through the insulating layer in the former region and a second opening formed through the insulating layer in the latter region is provided. Formed via the opening is a connection wiring for connecting to the opposite electrode layer or the main electrode layer and leading to the surface layer.

Abstract: A piezoelectric driving device of the present invention prevents a short circuit from occurring between electrode metallic films even if bonding-wire is performed. The piezoelectric driving device is a piezoelectric driving device in which a piezoelectric thin plate is joined to one side of a substrate, and a terminal electrode for applying a signal for expanding or contracting the piezoelectric thin plate is further formed on the plane. The terminal electrode is formed on one side of the substrate via a piezoelectric-member pedestal separated from the piezoelectric thin plate.

Abstract: A first counter electrode and a second counter electrode for electrically coupling a first piezoelectric element unit and a second piezoelectric element unit for composing a thin film piezoelectric element are common floating electrodes. A first principal electrode film and a second principal electrode film of each piezoelectric element unit are connected, and a voltage is applied between the two piezoelectric element units. As a result, by the wiring of two terminals only without using grounding electrode wiring, the first piezoelectric element unit and second piezoelectric element unit can be driven, so that the wiring process may be substantially simplified.

Abstract: A piezoelectric actuator, the manufacturing method of the same and the head suspension assembly using the same are disclosed, wherein the piezoelectric actuator can be disposed easily without any breakage in mounting and can provide a magnetic head with fine displacements efficiently. A more specifically, a first coupling portion and a second coupling portion are provided to couple the first piezoelectric element unit in parallel with the second piezoelectric element unit without being influenced each other by respective displacements.

Abstract: An actuator comprises first and second structures each with a piezoelectric layer sandwiched between a main electrode layer and an opposed electrode layer, which structures are formed on two substrates, respectively. A first main electrode layer and a first opposed electrode layer are provided with layer two projections, and a second opposed electrode layer is provided with one layer projection. Connection wiring is arranged for establishing connection, with the above two structures bonded to each other, between the layer projection of the first main electrode layer and the second main electrode layer, and between the layer projection of the first opposed electrode layer and the layer projection of the second opposed electrode layer. Thus, it is possible to provide an actuator which may assure highly accurate position control.

Abstract: A method comprises: bonding a plurality of thin film piezoelectric elements, formed on a substrate, onto a temporary fixing substrate via an adhesive layer; selectively removing the substrate to expose the thin film piezoelectric elements; fixing an element housing jig having sectional regions for individually isolating the thin film piezoelectric elements in such manner that the thin film piezoelectric elements and the sectional regions correspond to each other; and dissolving and removing the adhesive layer, and housing the thin film piezoelectric elements in the sectional regions of the element housing jig. Accordingly, it is possible to individually isolate and house the thin film piezoelectric elements removed from the substrate.

Abstract: To provide a piezoelectric driving device in which a short circuit does not occur between electrode metallic films even if performing bonding-wire joining, the piezoelectric driving device is a piezoelectric driving device in which a piezoelectric thin plate is joined to one side of a substrate and a terminal electrode for applying a signal for expanding or contracting the piezoelectric thin plate is further formed on the plane and the terminal electrode is formed on one side of the substrate through a piezoelectric-member pedestal separated from the piezoelectric thin plate.

Abstract: A method of manufacturing a thin film piezoelectric element, wherein main electrode layer, piezoelectric thin film, and opposed electrode layer respectively having specified shapes are first formed on first substrate and second substrate, and after that, the opposed electrodes are opposed and bonded to each other, and insulating resin layer is formed over the peripheral portion thereof, and then the second substrate is removed, the insulating resin layer is etched, and connecting electrode pad is formed, and finally, the first substrate is removed to obtain a completely separated thin film piezoelectric element. By this method, it is possible to improve the reproducibility of shapes and to prevent trouble such as shorting between the electrodes which hold the piezoelectric thin film, thereby making it possible to provide a thin film piezoelectric element that may assure high yield without variation in piezoelectric characteristics, and its manufacturing method.

Abstract: A plurality of thin film piezoelectric elements 8 are formed on one surface of element forming substrate 7, and element holding layer 20 made up of resin is formed over the one surface of the element forming substrate 7 including these thin film piezoelectric elements 8. After that, removing the element forming substrate 7 in the area where the thin film piezoelectric elements 8 are formed, the thin film piezoelectric elements 8 are held by the element holding layer 20. Further, the thin film piezoelectric elements 8 held by the element holding layer 20 are separated individually or every specified unit, and thereby, the thin film piezoelectric elements formed on the substrate by film forming process are held only by the element holding layer and a frame structure disposed therearound, improving the mass-productivity throughout the manufacturing process up to the mounting step.

Abstract: The present invention relates to a thin film piezoelectric element used in an actuator unit for fine positioning in particular, and its manufacturing method. In the manufacturing method, two piezoelectric thin films held between electrode layers are laminated by using adhesive, and only the second substrate is selectively removed in order to process the thin films remaining on the first substrate into a plurality of separated structures. After that, an insulating layer and external connecting electrode are formed so as to cover the exposed surface of the structure, thereby forming a plurality of thin film piezoelectric elements. Also, resin is applied to cover the thin film piezoelectric element, and a temporary fixing substrate is bonded thereto, and after selectively removing the first substrate, the temporary fixing substrate is separated, and the resin is removed from the piezoelectric element surface in order to separate the plurality of thin film piezoelectric elements.

Abstract: To provide a piezoelectric thin-film element small in leak current between electrode metal films and its manufacturing method are presented, the piezoelectric thin-film element comprises at least one unit laminated body composed of a piezoelectric thin-film having mutually facing first surface and second surface, a first electrode metal film on the first surface, and a second electrode metal film on the second surface, in which an electrode separation surface composed of a piezoelectric thin-film surface parallel to the first surface is provided between the first electrode metal film and second electrode metal film.