Patents by Inventor Hirokazu Umemura

Hirokazu Umemura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230107734
    Abstract: A connector driving structure includes an operating part, a driving part that moves in conjunction with movement of the operating part, a connector elastically supported by the driving part, a damper supported by the connector, and a battery stand. Operating the operating part changes the position of the driving part between a close position where the driving part is close to the battery stand and an away position where the driving part is away from the battery stand. The connector includes a connector terminal and a terminal holding portion holding the connector terminal. The damper is provided such that its first end is supported by the terminal holding portion and its second end abuts against the battery base.
    Type: Application
    Filed: September 16, 2022
    Publication date: April 6, 2023
    Inventors: Osamu FUKUDA, Aya GOTO, Hirokazu UMEMURA, Toshihiro MASUDA
  • Patent number: 8497166
    Abstract: An electronic device in which a metal wire (119) is bonded to an electronic component (111) contained in a case (110) by wire bonding and a bonding surface (121, 122) to which the metal wire (119) is bonded is covered with a synthetic resin (130) is manufactured by injecting an amount of synthetic resin (130) into the case (110) such that at least a portion of the metal wire (119) is exposed from a top surface of the synthetic resin (130); and leaving the case (110) to which the synthetic resin (130) is injected under reduced pressure so as to raise a liquid surface of the synthetic resin (130) due to the reduced pressure, and covering the metal wire (119) exposed from the top surface of the synthetic resin (130) with the synthetic resin (30, 130).
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: July 30, 2013
    Assignee: Honda Motor Co., Ltd.
    Inventors: Hirokazu Umemura, Kenichi Fuke
  • Publication number: 20120146232
    Abstract: An electronic device in which a metal wire (119) is bonded to an electronic component (111) contained in a case (110) by wire bonding and a bonding surface (121, 122) to which the metal wire (119) is bonded is covered with a synthetic resin (130) is manufactured by injecting an amount of synthetic resin (130) into the case (110) such that at least a portion of the metal wire (119) is exposed from a top surface of the synthetic resin (130); and leaving the case (110) to which the synthetic resin (130) is injected under reduced pressure so as to raise a liquid surface of the synthetic resin (130) due to the reduced pressure, and covering the metal wire (119) exposed from the top surface of the synthetic resin (130) with the synthetic resin (30, 130).
    Type: Application
    Filed: August 24, 2010
    Publication date: June 14, 2012
    Applicant: Honda Motor Co., Ltd.
    Inventors: Hirokazu Umemura, Kenichi Fuke