Abstract: A medium is accommodated in a container together with an electronic component body including an underlying electrode layer. The medium treats a surface of the underlying electrode layer while vibration is applied to the container. The medium is spherical or substantially spherical. The medium has a diameter not smaller than about 0.2 mm and not greater than about 2.0 mm. The medium contains tungsten.

Abstract: An electronic component includes a laminated body including first and second end surfaces, first and second side surfaces, and first and second principal surfaces, a first fired electrode layer on the first end surface, and a second fired electrode layer on the second end surface; a first external electrode on the first end surface; and a second external electrode on the second end surface. The first external electrode includes a first fired electrode layer, the second external electrode includes a second fired electrode layer, each of the first and second fired electrode layers includes a first region on the laminated body and a second region covering the first region, the first region includes voids and glass, and the second region includes less voids and glass than in the first region.

Abstract: An electronic component includes a laminated body including first and second end surfaces, first and second side surfaces, and first and second principal surfaces, a first external electrode, and a second external electrode, in which the first external electrode includes a first fired electrode layer and a first resin layer, the second external electrode includes a second fired electrode layer and a second resin layer, each of the first fired electrode layer and the second fired electrode layer is provided on the laminated body and includes a region including voids and glass, each of the first resin layer and the second resin layer includes metal particles, and a surface layer of each of the first resin layer and the second resin layer has a portion of the metal particles exposed in a ratio of about 72.6% or more and about 90.9% or less.

Abstract: An electronic component includes a laminated body including first and second end surfaces, first and second side surfaces, and first and second principal surfaces, a first fired electrode layer on the first end surface, and a second fired electrode layer on the second end surface; a first external electrode on the first end surface; and a second external electrode on the second end surface. The first external electrode includes a first fired electrode layer, the second external electrode includes a second fired electrode layer, each of the first and second fired electrode layers includes a first region on the laminated body and a second region covering the first region, the first region includes voids and glass, and the second region includes less voids and glass than in the first region.

Abstract: An electronic component includes a laminated body including first and second end surfaces, first and second side surfaces, and first and second principal surfaces, a first external electrode, and a second external electrode, in which the first external electrode includes a first fired electrode layer and a first resin layer, the second external electrode includes a second fired electrode layer and a second resin layer, each of the first fired electrode layer and the second fired electrode layer is provided on the laminated body and includes a region including voids and glass, each of the first resin layer and the second resin layer includes metal particles, and a surface layer of each of the first resin layer and the second resin layer has a portion of the metal particles exposed in a ratio of about 72.6% or more and about 90.9% or less.

Abstract: A medium is accommodated in a container together with an electronic component body including an underlying electrode layer. The medium treats a surface of the underlying electrode layer while vibration is applied to the container. The medium is spherical or substantially spherical. The medium has a diameter not smaller than about 0.2 mm and not greater than about 2.0 mm. The medium contains tungsten.