Abstract: A resin composition comprises (A) 100 parts by mass of a resin selected from the group consisting of polyamides, polylactic acids, and polyphenylene sulfides each having a melting point of 170° C. to 370° C., (B) 0.05 to 5.0 parts by mass of a triazine compound represented by the disclosed general formula (1), preferred examples of which are compounds of the formula: wherein RA, RB, RC, and RD, which may be the same or different, each represent a hydrogen atom or a C1-C4 alkyl group, (C) 0 to 3.0 parts by mass of at least one compound selected from the group consisting of 2,2?-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2-[3-hydroxy-4-(4,6-diphenyl-1,3,5-triazin-2-yl)phenoxy]ethyl 2-ethylhexanoate, and 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine, and (D) 0 to 1.0 part by mass of a light stabilizer being particulate at room temperature (25° C.). The resin composition is useful for making molded articles having improved heat resistance and weatherability.

Abstract: Provided is a polyamide resin composition comprising a polyamide resin, a PAN carbon fiber, carbon black, and a black dye, wherein the polyamide resin composition contains the PAN carbon fiber in an amount of 7.5 to 25% by weight, based on the weight of the composition, contains the carbon black in an amount of 0.01 to 0.55% by weight, based on the weight of the composition, and contains the black dye in an amount of 0.01 to 1.0% by weight, based on the weight of the composition.

Abstract: A resin composition including: (A) 100 parts by mass of a resin selected from the group consisting of polyamide, polylactic acid, and polyphenylene sulfide each having a melting point of 170° C. to 370° C.; (B) 0.05 to 5.0 parts by mass of a triazine compound represented by general formula (1); (C) 0 to 3.0 parts by mass of a specific oxidizing agent; and (D) 0 to 1.0 part by mass of a specific light stabilizer.

Abstract: The present invention relates to a polyamide resin composition, which not only demonstrates superior mechanical properties but also has favorable moldability and superior thermal conductivity, wherein the polyamide resin composition comprises (A) a polyamide resin, (B) glass fibers, (C) a thermally conductive filler, and (D) a polyamide elastomer, and the amount of the component (B) based on 100 parts by mass of the total amount of the components (A), (B), (C) and (D) is 9 parts by mass to 35 parts by mass; and, a molded article comprising the same.

Abstract: A composite body in which a resin and a metal are contact-bonded with excellent adhesive force. Also, a composite body which is suppressed in decrease of bonding strength between a resin and a metal due to water absorption of the resin even if the composite body is left in rain or water, or is left in a high humidity environment or the like for a long period of time. The composite body is obtained by contact-bonding a thermoplastic resin (A) and a metal (B), and is characterized in that the thermoplastic resin (A) is a polyamide elastomer (1A) or a thermoplastic resin composition (2A) that contains a water absorbent thermoplastic resin (2a) and a metal hydroxide (2b).

Abstract: Provided is a composite body in which a resin and a metal are contact-bonded with excellent adhesive force. Also provided is a composite body which is suppressed in decrease of bonding strength between a resin and a metal due to water absorption of the resin even if the composite body is left in rain or water, or is left in a high humidity environment or the like for a long period of time. The present invention relates to a composite body which is obtained by contact-bonding a thermoplastic resin (A) and a metal (B), and which is characterized in that the thermoplastic resin (A) is a polyamide elastomer (1A) or a thermoplastic resin composition (2A) that contains a water absorbent thermoplastic resin (2a) and a metal hydroxide (2b).

Abstract: Provided is a polyamide resin composition comprising a polyamide resin, a PAN carbon fiber, carbon black, and a black dye, wherein the polyamide resin composition contains the PAN carbon fiber in an amount of 7.5 to 25% by weight, based on the weight of the composition, contains the carbon black in an amount of 0.01 to 0.55% by weight, based on the weight of the composition, and contains the black dye in an amount of 0.01 to 1.0% by weight, based on the weight of the composition.

Abstract: The present invention relates to a polyamide resin composition, which not only demonstrates superior mechanical properties but also has favorable moldability and superior thermal conductivity, wherein the polyamide resin composition comprises (A) a polyamide resin, (B) glass fibers, (C) a thermally conductive filler, and (D) a polyamide elastomer, and the amount of the component (B) based on 100 parts by mass of the total amount of the components (A), (B), (C) and (D) is 9 parts by mass to 35 parts by mass; and, a molded article comprising the same.

Abstract: Provided is a composite body in which a resin and a metal are contact-bonded with excellent adhesive force. Also provided is a composite body which is suppressed in decrease of bonding strength between a resin and a metal due to water absorption of the resin even if the composite body is left in rain or water, or is left in a high humidity environment or the like for a long period of time. The present invention relates to a composite body which is obtained by contact-bonding a thermoplastic resin (A) and a metal (B), and which is characterized in that the thermoplastic resin (A) is a polyamide elastomer (1A) or a thermoplastic resin composition (2A) that contains a water absorbent thermoplastic resin (2a) and a metal hydroxide (2b).