Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein.

Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).

Abstract: Disclosed herein is a separator for an electrochemical element, comprising a fibrous structure, wherein the fibrous structure has a first fibrous layer part in which short fibers and/or pulp-like fibers are intertwined with each other, and a second fibrous layer part; some of the short fibers and/or the pulp-like fibers constituting the first fibrous layer part penetrates the second fibrous layer part; and a pore diameter distribution of the fibrous structure satisfies the following formula: 0 ?m<Dmax<18 ?m, and 0 ?m?(Dmax?Dave)<13 ?m, wherein Dmax is a maximum pore diameter (?m) of the fibrous structure, and Dave is an average pore diameter (?m) of the fibrous structure.

Abstract: Disclosed herein is a separator for an electrochemical element, comprising a fibrous structure, wherein the fibrous structure has a first fibrous layer part in which short fibers and/or pulp-like fibers are intertwined with each other, and a second fibrous layer part; some of the short fibers and/or the pulp-like fibers constituting the first fibrous layer part penetrates the second fibrous layer part; and a pore diameter distribution of the fibrous structure satisfies the following formula: 0 ?m<Dmax<18 ?m, and 0 ?m?(Dmax?Dave)<13 ?m, wherein Dmax is a maximum pore diameter (?m) of the fibrous structure, and Dave is an average pore diameter (?m) of the fibrous structure.

Abstract: Disclosed herein is a separator for an electrochemical element, comprising a fibrous structure, wherein the fibrous structure has a first fibrous layer part in which short fibers and/or pulp-like fibers are intertwined with each other, and a second fibrous layer part; some of the short fibers and/or the pulp-like fibers constituting the first fibrous layer part penetrates the second fibrous layer part; and a pore diameter distribution of the fibrous structure satisfies the following formula: 0 ?m<D max<18 ?m, and 0 ?m?(D max?Dave)<13 ?m, wherein D max is a maximum pore diameter (?m) of the fibrous structure, and Dave is an average pore diameter (?m) of the fibrous structure.