Abstract: A store terminal executes a process including a step S500 for determining whether or not to receive the allocation fee and a step S502 for determining whether or not there is a request for termination of use, and further including, when the allocation fee is received (YES in S500) and it is determined that there is a request for termination of use (YES in S502), a step S504 for acquiring a usage time, a step S506 for setting a discount amount, a step S508 for setting a usage fee, and a step S510 for executing a checkout process.

Abstract: A negative electrode using a binding agent excellent in binding property, the negative electrode being capable of using water as an alternative solvent to an organic solvent during production of the negative electrode. A negative electrode including: a compound obtained through condensation of polyacrylic acid and a polyaminobenzene derivative represented by general formula (1) below and/or a self-condensation product of the polyaminobenzene derivative; a cellulose derivative; and a negative electrode active material.

Abstract: Sense amplifiers for memory devices may include threshold voltage compensation circuitry configured to compensate a threshold voltage offset of a portion of the sense amplifier. Additionally, the sense amplifiers also perform pre-sensing of the portion of the sense amplifier. Moreover, the sense amplifier is configured to perform main sensing and latching in a phase after pre-sensing the portion of the sense amplifier.

Abstract: A microelectronic device includes memory array regions of memory cells each including a vertical stack structure comprising conductive structures vertically spaced from one another and horizontally extending through a vertical stack of memory cells. A staircase region is horizontally between two of the memory array regions horizontally neighboring one another and includes a first staircase structure horizontally extending from the vertical stack structure of a first of the two of the memory array regions and a second staircase structure horizontally extending from the vertical stack structure of a second of the two of the memory array regions. Lateral conductive contacts provide a conductive path between the first steps of the first staircase structure and the second steps of the second staircase structure. Related microelectronic devices, memory devices, and electronic systems are also described.

Abstract: An apparatus that includes a plurality of first memory mats each including a plurality of normal column sections each storing user data, and a second memory mat including a plurality of first redundant column sections each substituting a defective one of column sections included in the plurality of first memory mats and a plurality of first BCC column sections each storing an error correction code.

Abstract: Systems, apparatuses, and methods using wire bonds and direct chip attachment (DCA) features in stacked die packages are described. A stacked die package includes a substrate and at least a first semiconductor die and a second semiconductor die that are vertically stacked above the substrate. An active surface of the first semiconductor die faces an upper surface of the substrate and the first semiconductor die is operably coupled to the substrate by direct chip attachment DCA features. A back side surface of the second semiconductor die faces a back side surface of the first semiconductor die. The second semiconductor die is operably coupled to the substrate by wire bonds extending between an active surface thereof and the upper surface of the substrate.

Abstract: Systems and methods related to memory devices that may perform error check and correct (ECC) functionality. The systems and methods may employ ECC logic that may be shared between two or more banks. The ECC logic may be used to perform memory operations such as read, write, and masked-write operations, and may increase reliability of storage data.

Abstract: Some embodiments include an integrated assembly having a base comprising sense-amplifier-circuitry, a first deck over the base, and a second deck over the first deck. The first deck includes a first portion of a first array of first memory cells, and includes a first portion of a second array of second memory cells. The second deck includes a second portion of the first array of the first memory cells, and includes a second portion of the second array of the second memory cells. A first digit line is associated with the first array, and a second digit line is associated with the second array. The first and second digit lines are comparatively coupled with one another through the sense-amplifier-circuitry.

Abstract: A Schwann cell differentiation promoting agent, a peripheral nerve regeneration promoting agent, or the like contain an extract from inflamed tissues inoculated with vaccinia virus. The extract from inflamed tissues inoculated with vaccinia virus promotes differentiation of Schwann cells and regeneration of a peripheral nerve. Therefore, a preparation containing the extract from inflamed tissues inoculated with vaccinia virus is useful as a Schwann cell differentiation promoting agent, a peripheral nerve regeneration promoting agent, or the like.

Abstract: Systems, apparatuses, and methods using wire bonds and direct chip attachment (DCA) features in stacked die packages are described. A stacked die package includes a substrate and at least a first semiconductor die and a second semiconductor die that are vertically stacked above the substrate. An active surface of the first semiconductor die faces an upper surface of the substrate and the first semiconductor die is operably coupled to the substrate by direct chip attachment DCA features. A back side surface of the second semiconductor die faces a back side surface of the first semiconductor die. The second semiconductor die is operably coupled to the substrate by wire bonds extending between an active surface thereof and the upper surface of the substrate.

Abstract: A negative electrode using a binding agent excellent in binding property, the negative electrode being capable of using water as an alternative solvent to an organic solvent during production of the negative electrode. A negative electrode including: a compound obtained through condensation of polyacrylic acid and a polyaminobenzene derivative represented by general formula (1) below and/or a self-condensation product of the polyaminobenzene derivative; a cellulose derivative; and a negative electrode active material.

Abstract: Systems, apparatuses, and methods using wire bonds and direct chip attachment (DCA) features in stacked die packages are described. A stacked die package includes a substrate and at least a first semiconductor die and a second semiconductor die that are vertically stacked above the substrate. An active surface of the first semiconductor die faces an upper surface of the substrate and the first semiconductor die is operably coupled to the substrate by direct chip attachment DCA features. A back side surface of the second semiconductor die faces a back side surface of the first semiconductor die. The second semiconductor die is operably coupled to the substrate by wire bonds extending between an active surface thereof and the upper surface of the substrate.

Abstract: Systems and methods related to memory devices that may perform error check and correct (ECC) functionality. The systems and methods may employ ECC logic that may be shared between two or more banks. The ECC logic may be used to perform memory operations such as read, write, and masked-write operations, and may increase reliability of storage data.

Abstract: Some embodiments include an integrated assembly having a base comprising sense-amplifier-circuitry, a first deck over the base, and a second deck over the first deck. The first deck includes a first portion of a first array of first memory cells, and includes a first portion of a second array of second memory cells. The second deck includes a second portion of the first array of the first memory cells, and includes a second portion of the second array of the second memory cells. A first digit line is associated with the first array, and a second digit line is associated with the second array. The first and second digit lines are comparatively coupled with one another through the sense-amplifier-circuitry.

Abstract: Systems and methods related to memory devices that may perform error check and correct (ECC) functionality. The systems and methods may employ ECC logic that may be shared between two or more banks. The ECC logic may be used to perform memory operations such as read, write, and masked-write operations, and may increase reliability of storage data.

Abstract: Some embodiments include an integrated assembly having a base comprising sense-amplifier-circuitry, a first deck over the base, and a second deck over the first deck. The first deck includes a first portion of a first array of first memory cells, and includes a first portion of a second array of second memory cells. The second deck includes a second portion of the first array of the first memory cells, and includes a second portion of the second array of the second memory cells. A first digit line is associated with the first array, and a second digit line is associated with the second array. The first and second digit lines are comparatively coupled with one another through the sense-amplifier-circuitry.

Abstract: Systems, apparatuses, and methods using wire bonds and direct chip attachment (DCA) features in stacked die packages are described. A stacked die package includes a substrate and at least a first semiconductor die and a second semiconductor die that are vertically stacked above the substrate. An active surface of the first semiconductor die faces an upper surface of the substrate and the first semiconductor die is operably coupled to the substrate by direct chip attachment DCA features. A back side surface of the second semiconductor die faces a back side surface of the first semiconductor die. The second semiconductor die is operably coupled to the substrate by wire bonds extending between an active surface thereof and the upper surface of the substrate.

Abstract: Some embodiments include an integrated assembly having a base comprising sense-amplifier-circuitry, a first deck over the base, and a second deck over the first deck. The first deck includes a first portion of a first array of first memory cells, and includes a first portion of a second array of second memory cells. The second deck includes a second portion of the first array of the first memory cells, and includes a second portion of the second array of the second memory cells. A first digit line is associated with the first array, and a second digit line is associated with the second array. The first and second digit lines are comparatively coupled with one another through the sense-amplifier-circuitry.

Abstract: Apparatuses for controlling latencies on input signal paths in semiconductor devices are disclosed. An example apparatus includes: a clock input buffer that provides a reference clock signal and a system clock signal based on an external clock signal; a command decoder that latches command signals with the system clock signal and further provides a signal based on the command signals; and a command delay adjustment circuit including: a clock synchronizing circuit that receives the signal, latches the signal with the system clock signal and provides a clock-synchronized read signal responsive to a shift cycle parameter.

Abstract: Systems and methods related to memory devices that may perform error check and correct (ECC) functionality. The systems and methods may employ ECC logic that may be shared between two or more banks. The ECC logic may be used to perform memory operations such as read, write, and masked-write operations, and may increase reliability of storage data.