Patents by Inventor Hiroki Furushou

Hiroki Furushou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11118258
    Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: September 14, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Yo Shimazaki, Kentarou Seki, Hiroki Furushou, Chiaki Hatsuta
  • Publication number: 20200404781
    Abstract: A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.
    Type: Application
    Filed: September 3, 2020
    Publication date: December 24, 2020
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Hiroki FURUSHOU, Atsuko CHIGIRA, Toshio SASAO, Hiroshi MAWATARI
  • Patent number: 10541387
    Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisfies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: January 21, 2020
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Yo Shimazaki, Kentarou Seki, Hiroki Furushou, Chiaki Hatsuta
  • Patent number: 10538838
    Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisifies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: January 21, 2020
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Yo Shimazaki, Kentarou Seki, Hiroki Furushou, Chiaki Hatsuta
  • Publication number: 20190169733
    Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).
    Type: Application
    Filed: February 5, 2019
    Publication date: June 6, 2019
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao IKENAGA, Yo SHIMAZAKI, Kentarou SEKI, Hiroki FURUSHOU, Chiaki HATSUTA
  • Publication number: 20180334740
    Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).
    Type: Application
    Filed: September 29, 2016
    Publication date: November 22, 2018
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao IKENAGA, Yo SHIMAZAKI, Kentarou SEKI, Hiroki FURUSHOU, Chiaki HATSUTA
  • Publication number: 20180277799
    Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).
    Type: Application
    Filed: May 23, 2018
    Publication date: September 27, 2018
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Yo Shimazaki, Kentarou Seki, Hiroki Furushou, Chiaki Hatsuta
  • Patent number: 8810969
    Abstract: A suspension substrate includes a metal substrate, a first insulating layer provided on the metal substrate, a first wiring line layer provided on the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring line layer, and a second wiring line layer provided on the second insulating layer. When a total of a thickness of the first wiring line layer and a thickness of the second insulating layer on the first wiring line layer is T1 and a thickness of the second insulating layer at a position where a surface of the second insulating layer is flat and which is away from the first wiring line layer by a predetermined distance is T2, T1?T2<4.5 ?m is satisfied.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: August 19, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Jin Nishiyama, Yuji Narita, Hiroki Furushou
  • Publication number: 20130201581
    Abstract: A suspension substrate includes a metal substrate, a first insulating layer provided on the metal substrate, a first wiring line layer provided on the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring line layer, and a second wiring line layer provided on the second insulating layer. When a total of a thickness of the first wiring line layer and a thickness of the second insulating layer on the first wiring line layer is T1 and a thickness of the second insulating layer at a position where a surface of the second insulating layer is flat and which is away from the first wiring line layer by a predetermined distance is T2, T1?T2<4.5 ?m is satisfied.
    Type: Application
    Filed: November 2, 2011
    Publication date: August 8, 2013
    Inventors: Jin Nishiyama, Yuji Narita, Hiroki Furushou