Abstract: A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.

Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

Abstract: A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.

Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisifies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.

Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisfies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.

Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

Abstract: A suspension substrate includes a metal substrate, a first insulating layer provided on the metal substrate, a first wiring line layer provided on the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring line layer, and a second wiring line layer provided on the second insulating layer. When a total of a thickness of the first wiring line layer and a thickness of the second insulating layer on the first wiring line layer is T1 and a thickness of the second insulating layer at a position where a surface of the second insulating layer is flat and which is away from the first wiring line layer by a predetermined distance is T2, T1?T2<4.5 ?m is satisfied.

Abstract: A suspension substrate includes a metal substrate, a first insulating layer provided on the metal substrate, a first wiring line layer provided on the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring line layer, and a second wiring line layer provided on the second insulating layer. When a total of a thickness of the first wiring line layer and a thickness of the second insulating layer on the first wiring line layer is T1 and a thickness of the second insulating layer at a position where a surface of the second insulating layer is flat and which is away from the first wiring line layer by a predetermined distance is T2, T1?T2<4.5 ?m is satisfied.