Patents by Inventor Hiroki Haraguchi

Hiroki Haraguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260147236
    Abstract: A display device includes a frame member; a glass cover plate configured to be fixed to the frame member; an adhesive layer configured to be disposed on an inner surface of the cover plate located within a window surrounded by the frame member; and a display cell configured to be fixed to the inner surface of the cover plate via the adhesive layer. The frame member has an inner side surface surrounding the window, a weir portion protruding from the inner side surface toward the window, and a weir end surface serving as part of the weir portion and extending continuously around an entire periphery of the window at a boundary portion with the inner surface of the cover plate. The adhesive layer is formed of an optically clear adhesive applied to the inner surface of the cover plate and is in contact with the weir end surface.
    Type: Application
    Filed: November 20, 2025
    Publication date: May 28, 2026
    Inventors: Masanori KOMATSU, Kazuyoshi YAMAGATA, Hiroki HARAGUCHI, Daichi YAMASHITA, Keiichiro SUZUKI
  • Publication number: 20250199352
    Abstract: There is provided a display device that includes rear supports, a cover plate that is translucent and is fastened to a front of the rear supports, display panels disposed between the rear supports and the cover plate, and a resin connector. The rear supports are connected with one another via the resin connector. The cover plate covers the front of the rear supports, and is fastened to each of the rear supports. The display panels are disposed corresponding to the rear supports, respectively.
    Type: Application
    Filed: November 22, 2024
    Publication date: June 19, 2025
    Inventors: Masanori KOMATSU, Kazuyoshi YAMAGATA, Daichi YAMASHITA, Keiichiro SUZUKI, Hiroki HARAGUCHI
  • Patent number: 10957490
    Abstract: An electronic unit includes an electrolytic capacitor, a covering resin layer, and electronic components. The electrolytic capacitor is on an upper surface of an insulating substrate. The covering resin layer covers the upper surface of the insulating substrate and the electronic components. Part of the covering resin layer serves as an electrolytic capacitor covering portion. The electrolytic capacitor covering portion includes an outer peripheral covering portion that covers an outer peripheral surface of the electrolytic capacitor and a top covering portion that covers a top portion of the electrolytic capacitor. A thin wall groove is formed in the top covering portion. The outer peripheral covering portion extends upward beyond the top covering portion by a height h. The top covering portion easily breaks at the thin wall groove so that an explosion-proof valve easily operates. A region corresponding to the height h creates an operating space of the explosion-proof valve.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: March 23, 2021
    Assignee: ALPINE ELECTRONICS, INC.
    Inventors: Makoto Sato, Hiroki Haraguchi
  • Patent number: 10595393
    Abstract: A digital amplifier integrated circuit (“IC”), which is a heat-generating electronic component, is mounted on an upper surface of an insulating substrate. The digital amplifier IC is disposed inside a recess of a heat sink. The heat sink includes a peripheral wall having an end face placed on the upper surface of the insulating substrate. A hot-melt resin layer, molded by hot-melt molding, covers the upper surface of the insulating substrate. The hot-melt resin layer is in contact with a side face of the peripheral wall and retains the heat sink on the insulating substrate. The recess of the heat sink has no hot-melt resin therein.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: March 17, 2020
    Assignee: ALPINE ELECTRONICS, INC.
    Inventors: Makoto Sato, Hiroki Haraguchi
  • Publication number: 20200008292
    Abstract: A digital amplifier integrated circuit (“IC”), which is a heat-generating electronic component, is mounted on an upper surface of an insulating substrate. The digital amplifier IC is disposed inside a recess of a heat sink. The heat sink includes a peripheral wall having an end face placed on the upper surface of the insulating substrate. A hot-melt resin layer, molded by hot-melt molding, covers the upper surface of the insulating substrate. The hot-melt resin layer is in contact with a side face of the peripheral wall and retains the heat sink on the insulating substrate. The recess of the heat sink has no hot-melt resin therein.
    Type: Application
    Filed: May 14, 2019
    Publication date: January 2, 2020
    Applicant: ALPINE ELECTRONICS, INC.
    Inventors: Makoto Sato, Hiroki Haraguchi
  • Publication number: 20190392993
    Abstract: An electronic unit includes an electrolytic capacitor, a covering resin layer, and electronic components. The electrolytic capacitor is on an upper surface of an insulating substrate. The covering resin layer covers the upper surface of the insulating substrate and the electronic components. Part of the covering resin layer serves as an electrolytic capacitor covering portion. The electrolytic capacitor covering portion includes an outer peripheral covering portion that covers an outer peripheral surface of the electrolytic capacitor and a top covering portion that covers a top portion of the electrolytic capacitor. A thin wall groove is formed in the top covering portion. The outer peripheral covering portion extends upward beyond the top covering portion by a height h. The top covering portion easily breaks at the thin wall groove so that an explosion-proof valve easily operates. A region corresponding to the height h creates an operating space of the explosion-proof valve.
    Type: Application
    Filed: May 14, 2019
    Publication date: December 26, 2019
    Applicant: ALPINE ELECTRONICS, INC.
    Inventors: Makoto Sato, Hiroki Haraguchi