Patents by Inventor Hiroki Hashiba

Hiroki Hashiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing multilayer printed wiring board
    Patent number: 7886438
    Abstract: At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.
    Type: Grant
    Filed: May 11, 2009
    Date of Patent: February 15, 2011
    Assignee: Fujikura Ltd.
    Inventors: Shoji Ito, Ryoichi Kishihara, Osamu Nakao, Hiroki Hashiba, Masahiro Okamoto
  • PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
    Publication number: 20090217522
    Abstract: At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.
    Type: Application
    Filed: May 11, 2009
    Publication date: September 3, 2009
    Applicant: Fujikura Ltd.
    Inventors: Shoji ITO, Ryoichi Kishihara, Osamu Nakao, Hiroki Hashiba, Masahiro Okamoto
  • Multilayer printed wiring board and process for producing the same
    Publication number: 20060180344
    Abstract: At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.
    Type: Application
    Filed: December 19, 2003
    Publication date: August 17, 2006
    Inventors: Shoji Ito, Ryoichi Kishihara, Osamu Nakao, Hiroki Hashiba, Masahiro Okamoto