Patents by Inventor Hiroki HATAZAWA

Hiroki HATAZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Layered body with support substrate, method for fabricating same, and method for fabricating multi-layer wiring substrate
    Patent number: 9554456
    Abstract: A layered body with a support substrate, the layered body being on the support substrate and comprising: metal foil B which is arranged on the support substrate and on which a wiring pattern is not formed; an insulating layer B which is arranged on the metal foil B; metal foil C which is arranged on the insulating layer B and on which a wiring pattern is not formed; non-through holes for a product and non-through holes for an alignment mark that penetrate the metal foil C and the insulating layer B and reach the metal foil B; and the alignment mark of a dot pattern in which the non-through holes for the alignment mark are filled by plating and gathered and arranged in an individually independent state.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: January 24, 2017
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventor: Hiroki Hatazawa
  • LAYERED BODY WITH SUPPORT SUBSTRATE, METHOD FOR FABRICATING SAME, AND METHOD FOR FABRICATING MULTI-LAYER WIRING SUBSTRATE
    Publication number: 20160198564
    Abstract: A layered body with a support substrate, the layered body being on the support substrate and comprising: metal foil B which is arranged on the support substrate and on which a wiring pattern is not formed; an insulating layer B which is arranged on the metal foil B; metal foil C which is arranged on the insulating layer B and on which a wiring pattern is not formed; non-through holes for a product and non-through holes for an alignment mark that penetrate the metal foil C and the insulating layer B and reach the metal foil B; and the alignment mark of a dot pattern in which the non-through holes for the alignment mark are filled by plating and gathered and arranged in an individually independent state.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 7, 2016
    Inventor: Hiroki HATAZAWA