Patents by Inventor Hiroki Higashiyama

Hiroki Higashiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968173
    Abstract: A communication system includes a first device, second devices, and a communication line providing a serial connection from the first device to the second devices to establish a communication connection. An address setting device of the communication system is configured to set addresses of the second devices. The address setting device includes a communication controller. The communication controller is configured to transmit a transmission signal toward the second devices through the communication line and change at least one of an amplitude or a frequency of the transmission signal, and associate the addresses of the second devices with connection precedence of the second devices to the first device based on a reception signal received through the communication line.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: April 23, 2024
    Assignee: Daikin Industries, Ltd.
    Inventors: Hiroshi Doumae, Shin Higashiyama, Hiroki Ueda
  • Patent number: 10020568
    Abstract: The present invention provides an RFID inlet antenna comprising a resin base film and a metallic circuit formed via an adhesive layer on the surface of the resin base film. The RFID inlet antenna is prevented from removal of the metallic circuit by unauthorized detachment after the RFID inlet antenna is bonded to an item by a bonding material disposed in such a manner as to cover the metallic circuit.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: July 10, 2018
    Assignee: TOYO ALUMINIUM KABUSHIKI KAISHA
    Inventors: Kengo Den, Masateru Watanabe, Hiroki Higashiyama, Masataka Saruwatari
  • Patent number: 9053406
    Abstract: Provided are an antenna circuit constituent body for an IC card/tag capable of reducing environmental load in a manufacturing process for joining both end portions of an antenna circuit pattern layer and capable of enhancing reliability of joined portions of the both end portions of the antenna circuit pattern layer: and a method for manufacturing the antenna circuit constituent body for an IC card/tag. In the antenna circuit constituent body for an IC card/tag, an insulating layer (107) is formed so as to extend from an upper part of a first circuit pattern layer part (103), via an upper part of a third circuit pattern layer part (101), and to an upper part of a second circuit pattern layer part (104). A conductive layer (108) is formed on the insulating layer (107) so as to bring the first circuit pattern layer part (103) and the second circuit pattern layer part (104) into conduction.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: June 9, 2015
    Assignee: TOYO ALUMINIUM KABUSHIKI KAISHA
    Inventor: Hiroki Higashiyama
  • Publication number: 20140159963
    Abstract: The present invention provides an RFID inlet antenna comprising a resin base film and a metallic circuit formed via an adhesive layer on the surface of the resin base film. The RFID inlet antenna is prevented from removal of the metallic circuit by unauthorized detachment after the RFID inlet antenna is bonded to an item by a bonding material disposed in such a manner as to cover the metallic circuit.
    Type: Application
    Filed: June 22, 2012
    Publication date: June 12, 2014
    Applicant: TOYO ALUMINIUM KABUSHIKI KAISHA
    Inventors: Kengo Den, Masateru Watanabe, Hiroki Higashiyama, Masataka Saruwatari
  • Publication number: 20130082882
    Abstract: Provided are an antenna circuit constituent body for an IC card/tag capable of reducing environmental load in a manufacturing process for joining both end portions of an antenna circuit pattern layer and capable of enhancing reliability of joined portions of the both end portions of the antenna circuit pattern layer: and a method for manufacturing the antenna circuit constituent body for an IC card/tag. In the antenna circuit constituent body for an IC card/tag, an insulating layer (107) is formed so as to extend from an upper part of a first circuit pattern layer part (103), via an upper part of a third circuit pattern layer part (101), and to an upper part of a second circuit pattern layer part (104). A conductive layer (108) is formed on the insulating layer (107) so as to bring the first circuit pattern layer part (103) and the second circuit pattern layer part (104) into conduction.
    Type: Application
    Filed: June 6, 2011
    Publication date: April 4, 2013
    Applicant: TOYO ALUMINIUM KABUSHIKI KAISHA
    Inventor: Hiroki Higashiyama