Patents by Inventor Hiroki Hirai
Hiroki Hirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12128836Abstract: An object is to provide a technique capable of fixing a plurality of wiring members to the attachment surface as close as possible. A wiring module includes: a base member having an attachment surface; a plurality of wiring members disposed on the attachment surface; and a holding member holding the plurality of wiring members in an arranged state on the attachment surface. The holding member includes at least one sheet portion in which at least one hole is formed. The plurality of wiring members are passed through the at least one hole and held in the arranged state. The sheet portion is joined to the attachment surface.Type: GrantFiled: March 4, 2021Date of Patent: October 29, 2024Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Koji Yamaguchi, Hiroki Hirai, Makoto Higashikozono, Housei Mizuno, Koichiro Goto, Junichi Shirakawa
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Publication number: 20240355503Abstract: A wiring member includes a sheet material including a first layer formed into a sheet-like shape and a second layer provided on a main surface of the first layer, and a wire-like transmission member fixed on the sheet material. The second layer is a layer mediating a bonding of the first layer and the wire-like transmission member, and includes a plurality of partial second layers provided to be separated from each other along an extension direction of the wire-like transmission member.Type: ApplicationFiled: July 1, 2024Publication date: October 24, 2024Applicants: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Daichi FUKUSHIMA, Hiroki HIRAI, Housei MIZUNO, Miyu ARAMAKI, Tetsuya NISHIMURA, Junichi SHIRAKAWA
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Patent number: 12126156Abstract: A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a joint member including an adhesive layer, a heat generation layer, and a joint layer; and an adherend to which the wiring member is fixed, wherein the heat generation layer is a layer which can generate heat by induction heating and is provided between the adhesive layer and the joint layer, the joint layer is a layer having bond properties when heat is transmitted from the heat generation layer at a time of induction heating, the adhesive layer is fixed to one of the wiring member and the adherend, and the joint layer is fixed to another one of the wiring member and the adherend.Type: GrantFiled: August 21, 2020Date of Patent: October 22, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hirotaka Kato, Hiroki Hirai, Makoto Higashikozono, Kosuke Sone, Hirokazu Komori
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Publication number: 20240327701Abstract: An objective of the invention is to provide a high molecular weight material having excellent hole injectability and transportability, electron blockability, and high stability in a thin-film state. An objective of the invention is to provide an organic EL device including an organic layer (thin film) formed by the high molecular weight material and having high luminous efficiency and long lifetime. The invention relates to a high molecular weight compound including, as a repeating unit, a triarylamine structure represented by general formula (1) below. (In the formula, R1 and R2 each independently represent a substituted or unsubstituted alkyl group having 1 to 40 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 40 carbon atoms, a substituted or unsubstituted alkyloxy group having 1 to 40 carbon atoms, a substituted or unsubstituted cycloalkyloxy group having 3 to 40 carbon atoms, or a substituted or unsubstituted polyether group having 1 to 40 carbon atoms.Type: ApplicationFiled: March 7, 2022Publication date: October 3, 2024Applicant: HODOGAYA CHEMICAL CO., LTD.Inventors: Hiroki HIRAI, Kazunori TOGASHI, Yuta SAEGUSA, Mika SHINODA, Hideyoshi KITAHARA
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Patent number: 12062468Abstract: A wiring member includes: a flat wiring body including a plurality of wire-like transmission members, and a base member that holds the plurality of wire-like transmission members to be flat; and a pattern provided on the flat wiring body, and making a three-dimensional posture of the flat wiring body recognizable.Type: GrantFiled: March 29, 2019Date of Patent: August 13, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Suguru Yasuda, Motohiro Yokoi, Kenta Ito, Hiroki Hirai, Makoto Higashikozono, Koichiro Goto, Junichi Shirakawa, Yoshitaka Kami, Yasushi Nomura, Sofia Barillaro
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Patent number: 12057714Abstract: An on-vehicle device that is to be mounted in a vehicle includes: an electrical component including a sensor; a power supply module including a power receiving antenna and a power supply circuit configured to convert radio waves for power feeding received by the power receiving antenna into electric power and supply the electric power to the electrical component; and a line member having flexibility and electrically connecting the electrical component to the power supply module.Type: GrantFiled: July 8, 2021Date of Patent: August 6, 2024Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Yasuyuki Yamamoto, Kosuke Sone, Hiroki Hirai, Ichiro Kuwayama, Suguru Yamagishi, Toyohisa Takano
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Publication number: 20240260288Abstract: An objective of the invention is to provide a high molecular weight material having excellent hole injectability and transportability, electron blockability, and high stability in a thin-film state. Another objective is to provide an organic EL device including an organic layer (thin film) formed by the high molecular weight material and having high luminous efficiency and long lifetime. The invention relates to a high molecular weight compound including a repeating unit represented by general formula (1) and a repeating unit represented by general formula (2), and having a weight-average molecular weight of 10,000 or greater to less than 1,000,000 in terms of polystyrene.Type: ApplicationFiled: May 18, 2022Publication date: August 1, 2024Applicant: HODOGAYA CHEMICAL CO., LTD.Inventors: Kazunori TOGASHI, Yuta SAEGUSA, Mika SHINODA, Hideyoshi KITAHARA, Hiroki HIRAI
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Patent number: 12049177Abstract: A door wiring module includes: a door planar member incorporated into a door panel of a vehicle; a wiring member disposed on a main surface of the door planar member; and a holding member covering the main surface of the door planar member and the wiring member and directly joined to at least the main surface of the door planar member to hold the wiring member in a state of being disposed on the main surface of the door planar member.Type: GrantFiled: January 20, 2020Date of Patent: July 30, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Koji Yamaguchi, Hiroki Hirai, Makoto Higashikozono, Housei Mizuno
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Patent number: 12051526Abstract: A wiring member includes: a plurality of wire-like transmission members; and a sheet to which the plurality of wire-like transmission members arranged side by side are fixed, wherein the sheet includes a first sheet covering the plurality of wire-like transmission members from one side and a second sheet covering the plurality of wire-like transmission members from another side, and a planar surface region part is provided on an outer side of the second sheet.Type: GrantFiled: May 8, 2020Date of Patent: July 30, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Shintaro Sumida, Motohiro Yokoi, Kenta Ito, Suguru Yasuda, Tetsuya Nishimura, Hitomi Harada, Haruka Nakano, Ryusuke Kudo, Hiroki Hirai, Housei Mizuno, Hidetoshi Ishida
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Patent number: 12040106Abstract: A wiring member includes: a plurality of wire-like transmission members; a sheet to which the plurality of wire-like transmission members are fixed to be arranged side by side; and a level difference absorption member provided on an outer side of the sheet, wherein the sheet includes a first sheet covering the plurality of wire-like transmission members from one side and a second sheet covering the plurality of wire-like transmission members from another side, the level difference absorption member is provided on an outer side of the second sheet, and the level difference absorption member is provided to be able to absorb a level difference caused by a level difference formed on an outer surface of the second sheet when an outer surface side of the level difference absorption member is vacuum-sucked.Type: GrantFiled: May 12, 2020Date of Patent: July 16, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Shintaro Sumida, Motohiro Yokoi, Kenta Ito, Suguru Yasuda, Tetsuya Nishimura, Hitomi Harada, Haruka Nakano, Ryusuke Kudo, Hiroki Hirai, Housei Mizuno, Hidetoshi Ishida
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Patent number: 12009124Abstract: A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a heat generation layer provided to surround a periphery of the wiring member; an adherend to which the wiring member is fixed; and a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein the heat generation layer is a layer which can generate heat by induction heating, the joint layer is a layer having bond properties by heat transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member.Type: GrantFiled: August 21, 2020Date of Patent: June 11, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hirotaka Kato, Hiroki Hirai, Makoto Higashikozono, Kosuke Sone
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Patent number: 11999818Abstract: It is an object of the present invention to provide a high molecular weight compound that has excellent hole injection and transport performance, is capable of blocking electrons, and is highly stable as a thin film. It is another object of the present invention to provide an organic EL element that includes an organic layer (thin film) made of the above-described high molecular weight compound, wherein the organic EL element has high light emission efficiency and a long lifespan. The high molecular weight compound according to the present invention includes a repeating unit represented by a general formula (3), that is constituted by a specific triarylamine structural unit and a specific bonding structural unit, and has a weight average molecular weight of 10,000 or more and less than 1,000,000 on a polystyrene basis.Type: GrantFiled: July 1, 2019Date of Patent: June 4, 2024Assignee: HODOGAYA CHEMICAL CO., LTD.Inventors: Kazunori Togashi, Hideyoshi Kitahara, Junichi Izumida, Hiroki Hirai, Mika Shinoda
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Publication number: 20240141277Abstract: A culture apparatus includes a box and a light emitting diode (LED) module detachably attached to the box and configured to emit an ultraviolet ray inside the box.Type: ApplicationFiled: January 10, 2024Publication date: May 2, 2024Inventors: Hiroki HIRAI, Nobuo HORIMOTO, Kenichi HORIUCHI, Kousuke HONDA, Taiki OSHIMOTO, Yuta SAKAI, Kaori YOSHIDA
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Publication number: 20240141267Abstract: A light emitting diode (LED) module includes: an LED that emits an ultraviolet ray; an information holding apparatus; and a module-side connector electrically connected to the LED and the information holding apparatus.Type: ApplicationFiled: January 10, 2024Publication date: May 2, 2024Inventors: Kenichi HORIUCHI, Kousuke HONDA, Nobuo HORIMOTO, Hiroki HIRAI, Taiki OSHIMOTO, Yuta SAKAI, Kaori YOSHIDA
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Publication number: 20240141276Abstract: A light emitting diode (LED) module includes: an LED that emits an ultraviolet ray; a metallic cylindrical body in which the LED is accommodated; and a metallic coupling for fixing the metallic cylindrical body to a culture apparatus by being engaged with an engaged portion fixed to the culture apparatus, in which the metallic cylindrical body and the metallic coupling dissipate heat generated by the LED to the engaged portion.Type: ApplicationFiled: January 10, 2024Publication date: May 2, 2024Inventors: Hiroki HIRAI, Nobuo HORIMOTO, Kenichi HORIUCHI, Kousuke HONDA, Taiki OSHIMOTO, Yuta SAKAI, Kaori YOSHIDA
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Patent number: 11965796Abstract: An ultrasonic wave propagation member, which is able to improve durability while ensuring measurement performance, is provided with an ultrasonic wave propagator including a first contact surface coming into contact with an measurement target, and a second contact surface provided opposite to the first contact surface and coming into contact with a fore end surface of an ultrasonic probe; and a holder holding the ultrasonic wave propagator and including a third contact surface coming into contact with the measurement target on a radially outer position than the first contact surface, wherein the ultrasonic wave propagator is softer than the holder.Type: GrantFiled: August 29, 2022Date of Patent: April 23, 2024Assignee: HONDA MOTOR CO., LTD.Inventors: Kazuhiro Tsuzaki, Toshitsugu Sakakibara, Hiroki Hirai
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Patent number: 11968882Abstract: A high-molecular-weight compound having at least one substituted triarylamine structural unit represented by the following general formula (1), further including a structural unit having at least one aromatic hydrocarbon ring or a structural unit having a triarylamine skeleton in addition to the at least one substituted triarylamine structural unit, and having a weight average molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene and no a crosslinker, wherein the high-molecular-weight compound is used in an organic EL device as a constituent material of at least one organic layer. A polymer material having excellent hole injection/transport performance, electron blocking capability, high heat resistance, and high stability in a thin-film state for use in a polymer organic EL device, and an organic EL device having a low drive voltage, high light emission efficiency, and a long lifetime using this polymer material.Type: GrantFiled: May 29, 2020Date of Patent: April 23, 2024Assignee: HODOGAYA CHEMICAL CO., LTD.Inventors: Kazunori Togashi, Mika Shinoda, Hideyoshi Kitahara, Shunji Mochizuki, Hiroki Hirai, Yuta Saegusa
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Patent number: 11942242Abstract: A wiring member includes a wiring body and a pattern. The wiring body includes a plurality of wire-like transmission members and a base material. The plurality of wire-like transmission members are fixed to the base material in an aligned state, and the pattern is provided on the wiring body. The pattern makes a two-dimensional position of at least a part of a portion related to the base material recognizable in the wiring body.Type: GrantFiled: March 29, 2019Date of Patent: March 26, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Suguru Yasuda, Haruka Nakano, Motohiro Yokoi, Kenta Ito, Hiroki Hirai, Makoto Higashikozono, Koichiro Goto, Junichi Shirakawa, Yoshitaka Kami, Yasushi Nomura, Sofia Barillaro
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Patent number: 11916296Abstract: An antenna device, for a mobile body, of this disclosure includes an antenna configured to be installed in the mobile body, and a reflector having a reflection surface configured to change a beam direction of the antenna.Type: GrantFiled: January 29, 2020Date of Patent: February 27, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Yutaro Miki, Suguru Yamagishi, Takanori Fukunaga, Ichiro Kuwayama, Toyohisa Takano, Hiroki Hirai, Norichika Oomi, Kosuke Sone, Yasuyuki Yamamoto
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Patent number: 11897323Abstract: A vehicle mounting structure including: a vehicle frame having a floor panel mounted thereabove; and a power storage device assembled under the vehicle frame, wherein: a protrusion is arranged in the power storage device that can be vertically fitted into a recess in the vehicle frame, and a plurality of electrical wires are arranged inside the protrusion arranged in the power storage device.Type: GrantFiled: December 13, 2019Date of Patent: February 13, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Koji Yamaguchi, Hiroki Hirai, Ryoya Okamoto, Taiji Yanagida