Abstract: Provided is a pressure-sensitive adhesive tape excellent in unevenness followability. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material layer, wherein the pressure-sensitive adhesive tape has a dimensional change ratio at 23° C. and 50% RH of from ?0.39 to ?0.20, provided that the dimensional change ratio at 23° C. and 50% RH is calculated in accordance with a predetermined equation by: cutting the pressure-sensitive adhesive tape into a belt shape having a width of 20 mm to produce a measurement sample; and tensioning the measurement sample under an environment at 23° C. and 50% RH with a tensile tester at an initial chuck-to-chuck distance set to 20 mm and a tensile rate of 300 mm/min in a longitudinal direction of the measurement sample so that a deformation amount thereof becomes 100%.

Abstract: Provided is a laminate sheet in which a first sheet, a PSA layer and a second sheet are laminated in this order. Of the first and second sheets, at least one is a release liner having a release face on the side facing the PSA layer. The PSA layer has a thickness of 200 ?m or greater. The first sheet has a tensile modulus of 1000 MPa or greater and the second sheet has a tensile modulus of 500 MPa or less.

Abstract: Provided is a thermally conductive PSA sheet that comprises a PSA layer comprising a thermally conductive filler. The PSA sheet has a thermal resistance less than 6.0 cm2·K/W, and also has an adhesive strength N1 at 30 minutes of standing at 23° C. after applied to a stainless steel plate and an adhesive strength N2 at 23° C. after subjected to 5 minutes of heating at 80° C. after applied to a stainless steel plate, satisfying N2/N1?2.

Abstract: Provided are a PSA layer having a high refractive index and high adhesive strength and a PSA sheet having the PSA layer. The PSA layer comprises a PSA obtained using a PSA composition comprising a base polymer. Here, the PSA layer has a refractive index of 1.54 or higher and the base polymer has a glass transition temperature of 5° C. or lower.

Abstract: Provided is an electronic device capable of bringing about excellent airtightness. The electronic device provided by this invention comprises a housing that forms an internal space to house components, and a cover seal. The housing has an opening and/or gap through which gases can move between the internal space and outside of the housing. The cover seal is bonded to the housing, covering the opening and/or gap. The cover seal is formed of at least one PSA sheet having a gas barrier layer and a PSA layer provided at least on one face of the gas barrier layer. The bonding interface between the housing and the cover seal has, along its surface, a first bonding area, a non-bonding area and a second bonding area in this order from the opening and/or gap towards the outside.

Abstract: Provided is a PSA sheet that achieves both bonding reliability at a high temperature and reduction of outgassing. The PSA sheet provided by this invention comprises a substrate layer and a PSA layer provided to one face of the substrate layer. The PSA sheet exhibits a 180° peel strength of 1 N/20 mm or greater to stainless steel at 60° C. It has an amount of thermally released gas of 10 ?g/cm2 or less, determined at 130° C. for 30 minutes by GC-MS.

Abstract: Provided is a thermally conductive sheet with greater optical transmission. The thermally conductive sheet provided by this invention has a resin layer that comprises a resin and a thermally conductive filler. The resin has a refractive index np and the thermally conductive filler has a refractive index nf, satisfying the next relational expression ?0.04?(np?nf)?0.04. According to a preferable embodiment, the thermally conductive filler content is 50 parts by weight or more and 250 parts by weight or less to 100 parts by weight of the resin.

Abstract: Provided is a PSA sheet for use in electronic devices suitable for their downsizing and densification. The PSA sheet for electronic devices provided by this invention comprises a substrate and a PSA layer provided to at least one face of the substrate. The PSA sheet has a laser absorbance of 20% or higher in a wavelength range of 1000 nm to 1100 nm; has a thermal shrinkage SMD in its machine direction and a thermal shrinkage STD in its transverse direction (direction perpendicular to the machine direction) of both ?2 % or greater and 2% or less; and has an amount of thermally released gas of 1300 ng/cm2 or less when determined at 80° C. for 3 hours by GC/MS.

Abstract: Provided is a laminate sheet in which a first sheet, a PSA layer and a second sheet are laminated in this order. Of the first and second sheets, at least one is a release liner having a release face on the side facing the PSA layer. The PSA layer has a thickness of 200 ?m or greater. The first sheet has a tensile modulus of 1000 MPa or greater and the second sheet has a tensile modulus of 500 MPa or less.

Abstract: Provided is a PSA sheet that achieves both bonding reliability at a high temperature and reduction of outgassing. The PSA sheet provided by this invention comprises a substrate layer and a PSA layer provided to one face of the substrate layer. The PSA sheet exhibits a 180° peel strength of 1 N/20 mm or greater to stainless steel at 60° C. It has an amount of thermally released gas of 10 ?g/cm2 or less, determined at 130° C. for 30 minutes by GC-MS.

Abstract: Provided is a thermally conductive PSA sheet that comprises a PSA layer comprising a thermally conductive filler. The PSA sheet has a thermal resistance less than 6.0 cm2·K/W, and also has an adhesive strength N1 at 30 minutes of standing at 23° C. after applied to a stainless steel plate and an adhesive strength N2 at 23° C. after subjected to 5 minutes of heating at 80° C. after applied to a stainless steel plate, satisfying N2/N1?2.

Abstract: Provided is a PSA sheet having first and second faces. The first face is an adhesive face formed of one surface of a PSA layer. The first face has a maximum static friction force of 4.0 N/cm2 or less and an adhesive strength N2 of 8 N/20mm or greater at 23° C. after subjected to 5 minutes of heating at 80 ° C. after the first face is applied to a stainless steel plate.

Abstract: The present invention provides a pressure-sensitive adhesive (PSA) sheet that achieves both low initial adhesiveness and strong adhesiveness upon use and has excellent transparency of the PSA layer. The PSA sheet provided herein includes a PSA layer having a haze value of 1.0% or less. The PSA sheet is configured so that a pressure-sensitive adhesive strength N1, after the PSA layer is attached to a stainless steel plate and left at 23° C. for 30 minutes, is 1.5 N/20 mm or less, and a pressure-sensitive adhesive strength N2, after the PSA layer is attached to a stainless steel plate and heated at 80° C. for 5 minutes, is 10.0 N/20 mm or more.

Abstract: The present invention provides a pressure-sensitive adhesive (PSA) sheet that achieves, in the form having a support substrate, both low initial adhesiveness and strong adhesiveness during use. The PSA sheet provided in this application includes a support substrate and a PSA layer laminated on at least one side of the support substrate. The PSA layer has a thickness of 3 ?m or more but less than 100 ?m. The support substrate has a thickness of 30 ?m or more. The PSA sheet is configured so that a relationship between an elastic modulus Et? [MPa] of the PSA sheet and a thickness Ts [mm] of the support substrate fulfils the following formula: 0.1 [N·mm]<Et?×(Ts)3. The adhesive strength N2 after the PSA layer is attached to a stainless steel plate (SUS304BA plate) and heated at 80° C. for 5 minutes is 20 times or more of an adhesive strength N1 after the PSA layer is attached to a stainless steel plate (SUS304BA plate) and left at 23° C. for 30 minutes.