Patents by Inventor Hiroki IKESHO

Hiroki IKESHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor device utilizing adhesives and manufacturing method thereof
    Patent number: 10962434
    Abstract: A sensor device including: a sensor portion; a casing portion housing the sensor portion; a first adhesive that is provided between the casing portion and the sensor portion; and a second adhesive that is provided between the first adhesive and the sensor portion and has an interface between the first adhesive and the second adhesive is provided. A manufacturing method that is a manufacturing method of the sensor device, the manufacturing method including: providing the first adhesive that is cured or semi-cured, and the second adhesive that is not cured on the first adhesive; mounting the sensor portion on the upper surface of the second adhesive; and curing the second adhesive is provided.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: March 30, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Hiroki Ikesho
  • SENSOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20190285499
    Abstract: A sensor device including: a sensor portion; a casing portion housing the sensor portion; a first adhesive that is provided between the casing portion and the sensor portion; and a second adhesive that is provided between the first adhesive and the sensor portion and has an interface between the first adhesive and the second adhesive is provided. A manufacturing method that is a manufacturing method of the sensor device, the manufacturing method including: providing the first adhesive that is cured or semi-cured, and the second adhesive that is not cured on the first adhesive; mounting the sensor portion on the upper surface of the second adhesive; and curing the second adhesive is provided.
    Type: Application
    Filed: January 25, 2019
    Publication date: September 19, 2019
    Inventor: Hiroki IKESHO