Abstract: A fault recovery support apparatus according to an embodiment includes: a fault insertion unit configured to insert a fault into a target system; a behavior execution unit configured to execute a behavior related to recovery from the fault for the target system; a first construction unit configured to construct an automaton representing a recovery process from the fault by using observation data acquired from the target system as a result of the behavior by the behavior execution unit; and a second construction unit configured to construct a workflow representing a behavior for separating each fault included in a plurality of faults and a recovery process of each fault by using a plurality of the automatons related to the plurality of faults.

Abstract: A robot hand including: a first finger member; an intermediate member that is rotatably connected to the first finger member; a second finger member that is rotatably connected to the intermediate member; and a guide member that is rotatably connected to the second finger member and includes a first guider. The first finger member includes a first guide follower that is rotatably and movably disposed in the first guider.

Abstract: A computer executes a collection procedure of collecting first measurement information measured by passive measurement, a communication status estimation procedure of estimating an estimation map representing a communication status of each position using the first measurement information, and a design procedure of designing a measurement route of active measurement using the estimation map.

Abstract: A holding device includes: a spatula member having a front surface that is a surface that supports an object, a back surface, and a tip located between the front surface and the back surface; a mobile device that causes the tip to relatively approach the object; a belt having one end and another end and covering the front surface, the back surface, and the tip; a belt connection part connected to the one end; and a pulling member that is connected to the other end and pulls a portion of the belt covering the back surface in a direction away from the tip.

Abstract: A fault recovery support apparatus according to an embodiment includes: a fault insertion unit configured to insert a fault into a target system; a behavior execution unit configured to execute a behavior related to recovery from the fault for the target system; a first construction unit configured to construct an automaton representing a recovery process from the fault by using observation data acquired from the target system as a result of the behavior by the behavior execution unit; and a second construction unit configured to construct a workflow representing a behavior for separating each fault included in a plurality of faults and a recovery process of each fault by using a plurality of the automatons related to the plurality of faults.

Abstract: A recovery support apparatus includes an index value calculation means which calculates a predetermined index value with respect to a recovery work sequence on the basis of the recovery work sequence indicating a work procedure for recovery from an abnormality that has occurred in an apparatus group constituting a communication network, and an output means which outputs the index value calculated by the index value calculation means to a predetermined output destination.

Abstract: A command generation device includes a relationship learning unit configured to learn a model showing an interactive relationship between a response of a computer system and a command executed for the computer system in response to the response, and a command generation unit configured to input, when a response newly output from the computer system is input, the response to the relationship to generate a command for a new response, so that a command for a response of the system can be generated.

Abstract: A recovery support apparatus includes an index value calculation means which calculates a predetermined index value with respect to a recovery work sequence on the basis of the recovery work sequence indicating a work procedure for recovery from an abnormality that has occurred in an apparatus group constituting a communication network, and an output means which outputs the index value calculated by the index value calculation means to a predetermined output destination.

Abstract: A summary sentence calculation apparatus, including: input means which inputs a set of sentences; and summary sentence calculating means which calculates a summary sentence set from the set of sentences, wherein the summary sentence calculating means repetitively executes processing, until the processing ends, of selecting a predetermined sentence from the set of sentences, calculating, when the predetermined sentence is added to a new summary sentence set, an amount of increase of coverage by the summary sentence set after the addition relative to coverage by the summary sentence set prior to the addition, outputting the summary sentence set prior to the addition and ending the processing when the amount of increase is smaller than a first threshold, and adopting the summary sentence set after the addition as a new summary sentence set when the amount of increase is equal to or larger than the first threshold.

Abstract: A system state estimation apparatus to estimate a system state in a system that outputs log data upon executing a user action, includes a model generation unit configured to use log data accumulated in advance, to generate a stochastic model in which a system state and a user action are associated with log data when the user action is executed in the system state; and an action determination unit configured to determine a user action that contributes to identification of the system state in the system, based on a probability distribution of the system state and the stochastic model.

Abstract: A thermoelectric conversion module includes: a thermoelectric element group including an array of first semiconductor elements and second semiconductor elements; a first substrate joined to an upper side of the thermoelectric element group; a second substrate joined to a lower side of the thermoelectric element group; and an extended portion that extends out from an end of at least one of the first substrate or the second substrate. The extended portion includes a first region and a second region, and a first width of the first region is wider than a second width of the second region, the first region being close to the first substrate or the second substrate, the second region being farther from the first substrate or the second substrate than the first region, the first width and the second width each being a width in a direction perpendicular to a longitudinal direction of the extended portion.

Abstract: An operation sequence generating apparatus of the present invention includes: a learning unit configured to learn a relationship between information indicating states of a computer system and word strings indicating the content of operations performed on the computer system in the states; and a generation unit configured to, upon receiving information indicating a new state of the computer system, generate a word string for the new state by inputting the received information to the relationship. This therefore mitigates the operation burden required for operation of the computer system.

Abstract: The semiconductor apparatus includes: the first lead frame; the second lead frame; the second insulation resin which is disposed between the first lead frame and the second lead frame; the sealing resin which seals the semiconductor elements, the first lead frame and the second lead frame; the electric wiring part which electrically connects the semiconductor elements and the first lead frame; and the interlayer connecting part which electrically connects the first lead frame and the second lead frame.

Abstract: A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.

Abstract: A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure 10 includes a substrate 1 having electrodes 2a and 2b, an electronic component 3 having electrodes 21a and 21b, joints 15a and 15b that electrically connect the electrodes 2a and 2b of the substrate 1 and the electrodes 21a and 21b of the electronic component 3 and also fix the electronic component 3 to the surface of the substrate 1, and a convex portion 4 that abuts against the electrode 2a of the substrate 1 and the electrode 21a of the electronic component 3 and is used as a spacer.

Abstract: A manufacturing method of white-light emitting elements that is one example of the present invention is a manufacturing method of a white-light emitting element with the light emitting diode chip covered with the fluorescent-body-containing resin member that has been formed with the fluorescent-body-containing resin material containing a resin and fluorescent bodies, and includes: an irradiating step of irradiating the fluorescent-body-containing resin material with the blue laser beam; a measuring step of measuring the fluorescence strength of the fluorescence light emission from the fluorescent bodies that have been excited by the blue laser beam with which the irradiation has been carried out; and an applying step of applying, to the light emitting diode chip, a quantity of the fluorescent-body-containing resin material, the quantity being based on the fluorescence strength that has been measured.

Abstract: The semiconductor apparatus includes: the first lead frame; the second lead frame; the second insulation resin which is disposed between the first lead frame and the second lead frame; the sealing resin which seals the semiconductor elements, the first lead frame and the second lead frame; the electric wiring part which electrically connects the semiconductor elements and the first lead frame; and the interlayer connecting part which electrically connects the first lead frame and the second lead frame.