Abstract: A non-contact power supply apparatus includes a first coil, a second coil opposed to the first coil, and a sensor. The sensor includes an insulator, transmitting main antenna parts, transmitting sub antenna parts, a transmitting circuit, receiving main antenna parts, receiving sub antenna parts, and a receiving circuit.

Abstract: A non-contact power supply apparatus includes a first coil, a second coil opposed to the first coil, and a sensor. The sensor includes an insulator, transmitting main antenna parts, transmitting sub antenna parts, a transmitting circuit, receiving main antenna parts, receiving sub antenna parts, and a receiving circuit.

Abstract: A power transmission coil is unsusceptible to a dimensional error between individual coils or a displacement between primary and secondary coils. The power transmission coil includes a first planar coil having an inner diameter (Di) and a second planar coil having an outer diameter (Do) and being disposed opposite to the first planar coil. The quotient of the outer diameter (Do) of the second planar coil and the inner diameter (Di) of the first planar coil is defined as an inner/outer diameter ratio (Do/Di). The rate of change in the coupling coefficient between the first planar coil and the second planar coil is defined as a coupling coefficient change rate (?k).

Abstract: In a communication device, a ground plane disposed on the upper or lower surface of a board or inside the board includes a first ground region disposed on a semiconductor circuit and connected thereto, and a second ground region disposed under an amplifier and connected thereto. The first ground region and the second ground region do not overlap with each other.

Abstract: In a communication device, a ground plane disposed on the upper or lower surface of a board or inside the board includes a first ground region disposed on a semiconductor circuit and connected thereto, and a second ground region disposed under an amplifier-and connected thereto. The first ground region and the second ground region do not overlap with each other.

Abstract: A transmitter includes a board, an electronic circuit provided on the board for outputting a transmission signal, an amplifier provided on the board for amplifying the transmission signal, an antenna terminal provided on the board and arranged to be connected to an antenna, and a transmission path arranged along a border of the board. The transmission path is connected to an output port of the amplifier and the antenna terminal. The transmission path supplies the amplified transmission signal to the antenna terminal. This transmitter prevents the transmitting signal from entering into other circuits, and thus, has preferable transmission characteristics.

Abstract: A transmitting device includes (a) an amplifier mounted on the top face or the internal layer of a substrate, (b) a semiconductor integrated circuit mounted on the bottom face of the substrate and connected to the amplifier, and (c) a spacer substrate disposed on the bottom face of the substrate. The spacer substrate is disposed at least under the amplifier. This structure allows the heat generated from the amplifier to be efficiently dissipated through the spacer substrate, thus inhibiting deterioration of the characteristics of the amplifier caused by the heat.

Abstract: According to a transmitting output control circuit, one end of a coupling capacitor and one end of main line of a directional coupler are coupled with an output terminal of a power amplifier. A switch for coupling the other end of the coupling capacitor and one end of a sub line of the directional coupler with an anode of a first diode or a second terminating resistor is formed in a power amplifying apparatus. Any one of the coupling capacitor and the directional coupler is coupled by switching the switch. By using this structure, the stable transmitting power control circuit, which can be used in a wide dynamic range necessary for detecting a transmitting output signal level, can be provided.

Abstract: The high-frequency module of the present invention is formed of two sections: first high-frequency circuit 5 having a first filter circuit; and second high-frequency circuit 6 having a second filter circuit. At least any one of the two high-frequency circuits has a conductive case. The structure is highly effective in attenuating a spurious signal, thereby solving the problem that the output level of the spurious signal fed from the high-frequency module is undesirably increased.

Abstract: The high-frequency module of the present invention is formed of two sections: first high-frequency circuit 5 having a first filter circuit; and second high-frequency circuit 6 having a second filter circuit. At least any one of the two high-frequency circuits has a conductive case. The structure is highly effective in attenuating a spurious signal, thereby solving the problem that the output level of the spurious signal fed from the high-frequency module is undesirably increased.