Patents by Inventor Hiroki KAKUDO

Hiroki KAKUDO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing copper nano-ink and copper nano-ink
    Patent number: 11465208
    Abstract: A method of manufacturing a copper nano-ink includes: a step of preparing a copper nanoparticle aqueous dispersion liquid including copper nanoparticles and anions; and a step of storing the copper nanoparticle aqueous dispersion liquid at 5° C. or less after the step of preparing, wherein in the step of storing, a copper ion concentration of the copper nanoparticle aqueous dispersion liquid is controlled to be greater than or equal to 0.1 g/L and less than or equal to 1.0 g/L and an anion concentration is controlled to be greater than or equal to 0.5 g/L and less than or equal to 8.0 g/L.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: October 11, 2022
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Issei Okada, Motohiko Sugiura, Hiroki Kakudo
  • METHOD OF MANUFACTURING COPPER NANO-INK AND COPPER NANO-INK
    Publication number: 20210291271
    Abstract: A method of manufacturing a copper nano-ink includes: a step of preparing a copper nanoparticle aqueous dispersion liquid including copper nanoparticles and anions; and a step of storing the copper nanoparticle aqueous dispersion liquid at 5° C. or less after the step of preparing, wherein in the step of storing, a copper ion concentration of the copper nanoparticle aqueous dispersion liquid is controlled to be greater than or equal to 0.1 g/L and less than or equal to 1.0 g/L and an anion concentration is controlled to be greater than or equal to 0.5 g/L and less than or equal to 8.0 g/L.
    Type: Application
    Filed: October 4, 2018
    Publication date: September 23, 2021
    Inventors: Issei OKADA, Motohiko SUGIURA, Hiroki KAKUDO