Abstract: On a plane orthogonal to the rotation shaft, an upper muffler chamber has a plurality of flared portions that are flared from a center of a rotation shaft toward between penetrating bolts and a plurality of small-diameter portions that connect between the flared portions, are apart from penetrating bolts, and are formed on a center side of the rotation shaft from the penetrating bolts. A muffler outlet is provided in each flared portion. A second outlet and a refrigerant path hole of an upper end plate are positioned on an inside of one of a plurality of flared portions, and an opening area of the muffler outlet of one flared portion is greater than an opening area of the muffler outlet of each of the other flared portions.

Abstract: A method of manufacturing a tempered glass sheet includes: an arrangement step of arranging a plurality of glass sheets to be tempered, each having a substantially rectangular shape and a sheet thickness of 1.0 mm or less, in a support in an upright posture in a thickness direction at an interval of 10 mm or less, to thereby obtain an arrangement of glass sheets to be tempered; a tempering step of immersing the arrangement of glass sheets to be tempered in an ion exchange solution so as to subject the arrangement of glass sheets to be tempered to ion exchange treatment, to thereby obtain an arrangement of tempered glass sheets; an annealing step of annealing the arrangement of tempered glass sheets; and a removal step of removing each of tempered glass sheets forming the arrangement of tempered glass sheets from the support.

Abstract: An optical active cable includes an optical cable, optical modules disposed at both ends of the optical cable and each including a transmission part including a light emitting element and a reception part including a light receiving element, a light intensity detection part disposed in each of the optical modules to detect an intensity of a light received by the light receiving element, a communication means to transmit and receive a data of the light intensity detected by the light intensity detection part between the optical modules, and a light intensity transmission reception part disposed in each of the optical modules to transmit the data of the light intensity detected by the light intensity detection part to an opposite one of the optical modules via the communication means, and to receive the data of the light intensity transmitted from an opposite one of the optical modules via the communication means.

Abstract: Provided is a tempered glass substrate formed by a float method, comprising a bottom surface and a top surface, wherein a compression stress value of the bottom surface is larger than a compression stress value of the top surface.

Abstract: Provided is a tempered glass substrate formed by a float method, comprising a bottom surface and a top surface, wherein a compression stress value of the bottom surface is larger than a compression stress value of the top surface.

Abstract: A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one member by a rigid/flexible substrate. Circuit board main bodies 2a, 2b, and an optical reception subassembly fixation region 4 are formed by rigid regions 5A, 5b, and 5P. An area provided between the circuit board main body 2a and the optical reception subassembly 4 is composed of a flexible region 6P. A part of the circuit board main body 2 is composed of a flexible region 6.

Abstract: There is provided a filter assembly for combining a wavelength multiplexed optical signal by multiplexing optical signals of different wavelength emitted from respective optical devices, and/or for dividing a wavelength multiplexed optical signal into optical signals of different wavelength and causing the optical signals of different wavelength to enter respective optical devices. This filter assembly comprises: a light transmitting member within which each optical signal propagates; plural optical filters disposed on an upper face of the light transmitting member at a predetermined spacing wherein each optical signal passes through the optical filters; upper reflective layers respectively provided between adjacent ones of the optical filters; and a lower reflective layer provided on a lower face of the light transmitting member, and wherein the wavelength multiplexed optical signal propagates along the same optical path within the light transmitting member.

Abstract: A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one member by a rigid/flexible substrate. Circuit board main bodies 2a, 2b, and an optical reception subassembly fixation region 4 are formed by rigid regions 5A, 5b, and 5P. An area provided between the circuit board main body 2a and the optical reception subassembly 4 is composed of a flexible region 6P. A part of the circuit board main body 2 is composed of a flexible region 6.

Abstract: A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one member by a rigid/flexible substrate. Circuit board main bodies 2a, 2b, and an optical reception subassembly fixation region 4 are formed by rigid regions 5A, 5b, and 5P. An area provided between the circuit board main body 2a and the optical reception subassembly 4 is composed of a flexible region 6P. A part of the circuit board main body 2 is composed of a flexible region 6.

Abstract: An electronic component mounted structure has: a circuit board; two semiconductor elements that are mounted on the circuit board; and an AC coupling capacitor that is operable to cut off signals with a predetermined frequency or less and is provided between the two semiconductor elements. The AC coupling capacitor is mounted on the circuit board such that a part or a whole of the AC coupling capacitor is away from the surface of the circuit board.

Abstract: A stator coil 24 is installed in a stator core 11, and an insulating resin is impregnated into slot portions 22 and hardened. The stator coil 24 is constituted by enameled wires in which a polyamideimide resin layer has been applied radially outside a copper wire and hardened, and the insulating resin contains as a major component a THEIC-modified polyester resin that has been modified by a fatty acid.

Abstract: A stator coil 24 is installed in a stator core 11, and an insulating resin is impregnated into slot portions 22 and hardened. The stator coil 24 is constituted by enameled wires in which a polyamideimide resin layer has been applied radially outside a copper wire and hardened, and the insulating resin contains as a major component a THEIC-modified polyester resin that has been modified by a fatty acid.

Abstract: There is provided a filter assembly for combining a wavelength multiplexed optical signal by multiplexing optical signals of different wavelength emitted from respective optical devices, and/or for dividing a wavelength multiplexed optical signal into optical signals of different wavelength and causing the optical signals of different wavelength to enter respective optical devices. This filter assembly comprises: a light transmitting member within which each optical signal propagates; plural optical filters disposed on an upper face of the light transmitting member at a predetermined spacing wherein each optical signal passes through the optical filters; upper reflective layers respectively provided between adjacent ones of the optical filters; and a lower reflective layer provided on a lower face of the light transmitting member, and wherein the wavelength multiplexed optical signal propagates along the same optical path within the light transmitting member.

Abstract: An optical transmission module has: an optical module having an optical element and a receptacle portion; a circuit board that is electrically connected to the optical module through an electrical connection member; and a housing in which the optical module and the circuit board are placed. The optical module is in surface-contact with and fixed onto the housing. The receptacle portion and the circuit board are not in contact with the housing. The receptacle portion is restricted in position while having a positional degree of freedom at least in a direction perpendicular to an optical axis of light emitted from the optical element. The circuit board is restricted in position while having a positional degree of freedom at least in a direction of the optical axis.

Abstract: An optical transceiver has: an optical subassembly that has a built-in chip portion and a receptacle portion; a board electrically connected to one end of the built-in chip portion; a housing that houses the optical subassembly and the board; and a holding member to hold the optical subassembly.

Abstract: A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step portion is formed by perforating a region on one surface of the circuit board, and then peeling a part of the circuit board corresponding to the perforated region so as to reduce the thickness of the circuit board at the region.

Abstract: An optical transceiver has: an optical subassembly that has a built-in chip portion and a receptacle portion; a board electrically connected to one end of the built-in chip portion; a housing that houses the optical subassembly and the board; and a holding member to hold the optical subassembly.

Abstract: An optical transmission module has: an optical module having an optical element and a receptacle portion; a circuit board that is electrically connected to the optical module through an electrical connection member; and a housing in which the optical module and the circuit board are placed. The optical module is in surface-contact with and fixed onto the housing. The receptacle portion and the circuit board are not in contact with the housing. The receptacle portion is restricted in position while having a positional degree of freedom at least in a direction perpendicular to an optical axis of light emitted from the optical element. The circuit board is restricted in position while having a positional degree of freedom at least in a direction of the optical axis.

Abstract: A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step portion is formed by perforating a region on one surface of the circuit board, and then peeling a part of the circuit board corresponding to the perforated region so as to reduce the thickness of the circuit board at the region.

Abstract: An electronic component mounted structure has: a circuit board; two semiconductor elements that are mounted on the circuit board; and an AC coupling capacitor that is operable to cut off signals with a predetermined frequency or less and is provided between the two semiconductor elements. The AC coupling capacitor is mounted on the circuit board such that a part or a whole of the AC coupling capacitor is away from the surface of the circuit board.