Abstract: An image forming method and a charged particle beam apparatus suitable for suppressing the inclination of charging when scanning a two-dimensional area with a charged particle beam. A third scanning line located between a first scanning line and a second scanning line is scanned. After the first, second and third scanning lines have been scanned, a plurality of scanning lines are scanned between the first and third scanning lines and between the second and third scanning lines.

Abstract: The present invention relates to a CDSEM (scanning electron microscope) capable of evaluating and presenting the measurement repeatability as a tool with a high degree of accuracy without being influenced by fluctuations in micro-minute shape that tend to increase with the microminiaturization of semiconductor patterns, and to a method for evaluating accuracy of repeated measurement using the scanning electron microscope. There is provided a function whereby when measuring a plurality of times the same part to be measured, by making use of a micro-minute pattern shape such as the roughness included in the pattern, pattern matching with a roughness template image is performed to correct two-dimensional deviation in position of the part to be measured on an enlarged measurement image acquired, and then an enlarged measurement area image is extracted and acquired. This makes it possible to eliminate variation in measurements caused by the micro-minute pattern shape.

Abstract: According to the invention, to achieve the above objective, there is provided a charged particle beam apparatus that creates a first image by irradiating a charged particle beam on a sample to scan a first pattern of the sample, controls on the basis of the first image the focus of the charged particle beam and the brightness and/or contrast of the image, and irradiates the charged particle beam to correctly scan a second pattern different from the first pattern by using the control conditions used to control the focus of the charged particle beam and the brightness and/or contrast of the image.

Abstract: A scanning method for a scanning electron microscope is provided which minimizes a degradation in dimension measuring accuracy caused by a shrink of a specimen. A time between the first and the second scan over the same location on the specimen is shortened by changing the scanning order of scan lines to enable the scanning to be performed successively while the shrink is small.

Abstract: A quantity (or dispersion value) of a distribution of edge position due to random noise is expected to be reduced statistically to 1/N when N edge position data items are averaged. Using this property, the single page image is averaged in a vertical direction with various values of parameter S, and then the edge roughness index is calculated. The S-dependence of the edge roughness index is analyzed and a term of a dispersion value directly proportional to 1/S is determined as being due to noise.

Abstract: In a scanning electron microscope, slimming is reduced by reducing a frame count. As the frame count is reduced, the amount of detected secondary electrons decreases, so that a probe current amount is increased to emit an increased amount of detected secondary electrons. A primary electron beam is scanned on a sample, a histogram is created, and the histogram is second-order differentiated to calculate a level of halftone at which a sample image changes in contrast, and to calculate the probe current amount. By adjusting the frame count suitable for the calculated probe current amount, and the contrast suitable for the sample image, the slimming of the sample is limited, and a highly visible sample image is generated for length measurement.

Abstract: The present invention may include a pattern inspection method of extracting a pattern edge shape from an image obtained by a scanning microscope and inspecting the pattern. A control section and a computer of the scanning microscope process the intensity distribution of reflected electrons or secondary electrons, find the distribution of gate lengths in a single gate from data about edge positions, estimate the transistor performance by assuming a finally fabricated transistor to be a parallel connection of a plurality of transistors having various gate lengths, and determine the pattern quality and grade based on an estimated result. In this manner, it is possible to highly, accurately and quickly estimate an effect of edge roughness on the device performance and highly accurately and efficiently inspect patterns in accordance with device specifications.

Abstract: A scanning method for a scanning electron microscope is provided which minimizes a degradation in dimension measuring accuracy caused by a shrink of a specimen. A time between the first and the second scan over the same location on the specimen is shortened by changing the scanning order of scan lines to enable the scanning to be performed successively while the shrink is small.

Abstract: As measurement accuracy required for the scanning electron microscope (SEM) for measuring a pattern width becomes stringent, a technique of reducing the difference in a measured dimension between the SEM's is desired. However, the conventional technique of evaluating the difference in a measured dimension between the SEM's cannot separate the difference in a measured dimension between the SEM's themselves and a dimensional change resulting from deformation of the pattern itself. Moreover, the technique of reducing the difference in a measured dimension between the SEM's needs an operator for reducing the difference in a measured dimension between the SEM's for each measurement pattern shape.

Abstract: A method for measuring a dimension of a pattern formed on a sample using a secondary electron image obtained by picking up an image of the sample using a scanning electron microscope includes: obtaining a secondary electron image of a sample by picking up an image of the sample using a scanning electron microscope; creating, using the secondary electron image, an image profile of a pattern whose dimension is to be measured, within the obtained secondary electron image; retrieving a model profile that matches best with the created image profile from a plurality of model profiles prestored that are obtained from respective secondary electron images of a plurality of patterns, the cross sections of the plurality of patterns being of known shapes and dimensions and being different in shape; and obtaining a dimension of the pattern using information of the retrieved model profile.

Abstract: Equipment extracts components of spatial frequency that need to be evaluated in manufacturing a device or in analyzing a material or process out of edge roughness on fine line patterns and displays them as indexes. The equipment acquires data of edge roughness over a sufficiently long area, integrates a components corresponding to a spatial frequency region being set on a power spectrum by the operator, and displays them on a length measuring SEM. Alternatively, the equipment divides the edge roughness data of the sufficiently long area, computes long-period roughness and short-period roughness that correspond to an arbitrary inspection area by performing statistical processing and fitting based on theoretical calculation, and displays them on the length measuring SEM.

Abstract: In a scanning electron microscope, slimming is reduced by reducing a frame count. As the frame count is reduced, the amount of detected secondary electrons decreases, so that a probe current amount is increased to emit an increased amount of detected secondary electrons. A primary electron beam is scanned on a sample, a histogram is created, and the histogram is second-order differentiated to calculate a level of halftone at which a sample image changes in contrast, and to calculate the probe current amount. By adjusting the frame count suitable for the calculated probe current amount, and the contrast suitable for the sample image, the slimming of the sample is limited, and a highly visible sample image is generated for length measurement.

Abstract: A calibration standard specimen is provided to have formed therein calibrating patterns of a lattice shape discontinuously arrayed, and particular alignment patterns respectively disposed near the calibrating patterns so that the positioning of the specimen can be made to match the calibrating patterns to the measurement points.

Abstract: According to the invention, to achieve the above objective, there is provided a charged particle beam apparatus that creates a first image by irradiating a charged particle beam on a sample to scan a first pattern of the sample, controls on the basis of the first image the focus of the charged particle beam and the brightness and/or contrast of the image, and irradiates the charged particle beam to correctly scan a second pattern different from the first pattern by using the control conditions used to control the focus of the charged particle beam and the brightness and/or contrast of the image.

Abstract: The present invention relates to an electron microscope which reduces a difference in measured values that occur due to a difference in resolution that cannot be fully adjusted which exists among electron microscopes, or occurs as time elapses, and a method for measuring dimensions. An operator adapted to compensate for changes of an electron image to be generated due to a difference in probe diameter is obtained in advance from electron images of one reference sample created by electron microscopes having different resolution (probe diameter). Then a compensation-measurement electron image which is equivalent to an electron image created under the same probe diameter by applying the operator for compensation, and the compensation-measurement electron image is used for measuring the dimensions.

Abstract: An object of the present invention is to suppress measurement errors caused by the fact that the shrink amount due to scan of an electron beam differs pattern by pattern. To accomplish this object, according to the invention, functions indicative of a process of change of pattern dimension when the electron beam is irradiated on a sample are prepared in respect of the kinds of sample patterns, and dimension values of a particular pattern measured by scanning the electron beam on the particular pattern are fitted to a function prepared for the particular pattern to calculate a dimension of the particular pattern before it changes.

Abstract: The present invention relates to a CDSEM (scanning electron microscope) capable of evaluating and presenting the measurement repeatability as a tool with a high degree of accuracy without being influenced by fluctuations in micro-minute shape that tend to increase with the microminiaturization of semiconductor patterns, and to a method for evaluating accuracy of repeated measurement using the scanning electron microscope. There is provided a function whereby when measuring a plurality of times the same part to be measured, by making use of a micro-minute pattern shape such as the roughness included in the pattern, pattern matching with a roughness template image is performed to correct two-dimensional deviation in position of the part to be measured on an enlarged measurement image acquired, and then an enlarged measurement area image is extracted and acquired. This makes it possible to eliminate variation in measurements caused by the micro-minute pattern shape.

Abstract: A scanning method for a scanning electron microscope is provided which minimizes a degradation in dimension measuring accuracy caused by a shrink of a specimen. A time between the first and the second scan over the same location on the specimen is shortened by changing the scanning order of scan lines to enable the scanning to be performed successively while the shrink is small.

Abstract: In a scanning electron microscope, slimming is reduced by reducing a frame count. As the frame count is reduced, the amount of detected secondary electrons decreases, so that a probe current amount is increased to emit an increased amount of detected secondary electrons. A primary electron beam is scanned on a sample, a histogram is created, and the histogram is second-order differentiated to calculate a level of halftone at which a sample image changes in contrast, and to calculate the probe current amount. By adjusting the frame count suitable for the calculated probe current amount, and the contrast suitable for the sample image, the slimming of the sample is limited, and a highly visible sample image is generated for length measurement.

Abstract: The present invention may include a pattern inspection method of extracting a pattern edge shape from an image obtained by a scanning microscope and inspecting the pattern. A control section and a computer of the scanning microscope process the intensity distribution of reflected electrons or secondary electrons, find the distribution of gate lengths in a single gate from data about edge positions, estimate the transistor performance by assuming a finally fabricated transistor to be a parallel connection of a plurality of transistors having various gate lengths, and determine the pattern quality and grade based on an estimated result. In this manner, it is possible to highly, accurately and quickly estimate an effect of edge roughness on the device performance and highly accurately and efficiently inspect patterns in accordance with device specifications.