Abstract: To provide a light-emitting element with an improved reliability, a light-emitting element with a high current efficiency (or a high quantum efficiency), and a novel dibenzo[f,h]quinoxaline derivative that is favorably used in a light-emitting element which is one embodiment of the present invention. A light-emitting element includes an EL layer between an anode and a cathode. The EL layer includes a light-emitting layer; the light-emitting layer contains a first organic compound having an electron-transport property and a hole-transport property, a second organic compound having a hole-transport property, and a light-emitting substance; the combination of the first organic compound and the second organic compound forms an exciplex; the HOMO level of the first organic compound is lower than the HOMO level of the second organic compound; and a difference between the HOMO level of the first organic compound and the HOMO level of the second organic compound is less than or equal to 0.4 eV.

Abstract: A reverse osmosis membrane of the present invention includes a porous support substrate (2) and a separation active layer (3) formed on a surface of the porous support substrate (2) and formed of a carbon film containing organized carbon.

Abstract: A reverse osmosis membrane of the present invention includes a porous support substrate (2) and a separation active layer (3) formed on a surface of the porous support substrate (2) and formed of a carbon film containing organized carbon.

Abstract: Provided is a water treatment flow channel member in which the occurrence of fouling is suppressed. A water treatment flow channel member 1 of the present invention is formed from a molded product containing a synthetic resin and a nanocarbon material.

Abstract: A method of forming a reverse osmosis membrane 1 of the present invention includes a coating membrane forming step of forming a coating membrane which is soluble in a predetermined solvent on a surface of a porous support substrate 2 that is insoluble in the solvent, a carbon membrane forming step of forming a carbon membrane 3 on the coating membrane by a physical vapor deposition which deposits carbon as a target material under an atmosphere where rare gas and nitrogen gas are contained, and a removing-by-dissolving step of removing the coating membrane by dissolving the same in the solvent after formation of the carbon membrane 3.

Abstract: A method of forming a reverse osmosis membrane 1 of the present invention includes a coating membrane forming step of forming a coating membrane which is soluble in a predetermined solvent on a surface of a porous support substrate 2 that is insoluble in the solvent, a carbon membrane forming step of forming a carbon membrane 3 on the coating membrane by a physical vapor deposition which deposits carbon as a target material under an atmosphere where rare gas and nitrogen gas are contained, and a removing-by-dissolving step of removing the coating membrane by dissolving the same in the solvent after formation of the carbon membrane 3.

Abstract: In a thermoelectric conversion module, each of a p-type element and an n-type element is configured by aligning a plurality of particles in series and connecting the particles to each other. Around a connection part in which the particles are connected to each other, a protrusion is protruded. The protrusion has a shape of continuously extending around the entire periphery of the connection part. The protrusion may be partly interrupted, but in such a case, a circumferential length of one interrupted portion is less than one half of the periphery of the connection part.

Abstract: A conductive member includes a metal part and an elastomer part. The conductive member is configured such that, when the conductive member is interposed between a first member and a second member, the elastomer part is elastically deformed so that a top end portion of at least one upper surface-side convex part in the metal part is pressed toward a side of the second member, and a top end portion of at least one under surface-side convex part in the metal part is pressed toward a side of the first member.

Abstract: A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board. A pair of support parts are connected to the solder joint part and, when the solder joint part is soldered and connected to the printed circuit board, are supported in a position above the printed circuit board at an interval between the pair of support parts. The interval allows a conductive member, other than the printed circuit board, to be inserted therein. A resilient contact part, that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.

Abstract: A thermoelectric conversion module according to one aspect of embodiments of the present invention as disclosed herein includes a plurality of layered planar bodies. Each of the plurality of layered planar bodies includes a base material having a planar shape, a plurality of p-type granular bodies made of a p-type thermoelectric material, and a plurality of n-type granular bodies made of an n-type thermoelectric material. The plurality of p-type granular bodies and the plurality of n-type granular bodies are held by the base material in such a manner as to be spaced apart from each other in a direction along a face of the base material crossing a layered direction of the plurality of layered planar bodies.

Abstract: A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.

Abstract: A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.

Abstract: A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.

Abstract: A conductive member includes a metal part and an elastomer part. The conductive member is configured such that, when the conductive member is interposed between a first member and a second member, the elastomer part is elastically deformed so that a top end portion of at least one upper surface-side convex part in the metal part is pressed toward a side of the second member, and a top end portion of at least one under surface-side convex part in the metal part is pressed toward a side of the first member.

Abstract: A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board; a pair of support parts connected to the solder joint part, and, when the solder joint part is soldered and connected to the printed circuit board, supported in a position above the printed circuit board at an interval between the pair of support parts, the interval allowing a conductive member other than the printed circuit board to be inserted therein; and a resilient contact part that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.

Abstract: In a thermoelectric conversion module, each of a p-type element and an n-type element is configured by aligning a plurality of particles in series and connecting the particles to each other. Around a connection part in which the particles are connected to each other, a protrusion is protruded. The protrusion has a shape of continuously extending around the entire periphery of the connection part. The protrusion may be partly interrupted, but in such a case, a circumferential length of one interrupted portion is less than one half of the periphery of the connection part.

Abstract: A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.

Abstract: A swingable connecting device includes an oscillation supporting mechanism for swingably supporting a shackle to a supporting body. A mounting bolt of the supporting body has a first male threaded portion and a second male threaded portion formed separately at opposite ends thereof with different diameters. A bolt shaft portion whose diameter varies continuously from the first male threaded portion to the second male threaded portion is formed between the first male threaded portion and the second male threaded portion. The supporting body is provided with a bolt hole for allowing the bolt shaft portion to fit into and engage with the bolt bore, through which the small-diameter second male threaded portion extends. The bolt bore has an inner surface profile, in which an inner diameter thereof continuously varies with an outer circumferential surface of the bolt shaft portion. A nut integrally connects the mounting bolt with the supporting body.

Abstract: A frequency control apparatus including a shielding board that is provided with a window for exposing some or all of a plurality of electrodes disposed on a piezoelectric substrate, and a shutter for opening and closing the window. An aperture pattern board is provided between the shielding board and a piezoelectric resonator. On the aperture pattern board, combinations of apertures are provided which correspond to the A electrodes exposed through the window on the shielding board at one time. After measuring the frequencies for respective elements and measuring the variations from the target frequency, the suitable pattern of apertures is selected from the aperture pattern board according to the amount of variations, and then the frequency control is carried out only on the elements selected through the apertures.