Patents by Inventor Hiroki Kobayashi
Hiroki Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11862689Abstract: Group-III element nitride semiconductor substrate including a first surface and a second surface that are easy to visually distinguish from each other. An end portion is easily detected with an optical sensor, a large effective area (area that can be used in device production) can be secured, and warping of the entirety of the substrate is reduced. A Group-III element nitride semiconductor substrate includes a first surface; and a second surface, wherein the first surface is a mirror surface, the second surface has a second-surface central region and a second-surface outer peripheral region, the second-surface central region is a mirror surface, and the second-surface outer peripheral region is a non-mirror surface.Type: GrantFiled: February 17, 2023Date of Patent: January 2, 2024Assignee: NGK INSULATORS, LTD.Inventors: Katsuhiro Imai, Masahiro Sakai, Hiroki Kobayashi
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Patent number: 11848519Abstract: It is aimed to reduce cost. A female connector (F) includes a female housing (30) to be connected to a male housing (10), a lock functioning portion (57) provided on the female housing (30) and configured to lock the female housing (30) and the male housing (10) in a connected state by being locked to the male housing (10), and a releasing member (63) attachable to and detachable to the female housing (30), the releasing member being a component separate from the female housing (30). The releasing member (63) can displace the lock functioning portion (57) to disengage the lock functioning portion (57) from the male housing (10) while being mounted on the female housing (30).Type: GrantFiled: July 17, 2020Date of Patent: December 19, 2023Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Tetsuya Miyamura, Yutaka Kobayashi, Hiroki Kobayashi, Pipatthana Phatiwuttipat, Teruo Hara
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Publication number: 20230395373Abstract: A Group-III element nitride semiconductor substrate includes: a first surface; and a second surface, wherein warping of a crystal plane of the first surface has a plurality of extremes.Type: ApplicationFiled: August 18, 2023Publication date: December 7, 2023Inventors: Masahiro SAKAI, Katsuhiro IMAI, Hiroki KOBAYASHI
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Publication number: 20230382122Abstract: An inkjet printing method including: discharging ink contained in an ink storage unit, from a nozzle of a nozzle forming surface of a discharging unit; and supplying the ink from the ink storage unit to the discharging unit. The ink includes specific components and satisfies a specific relation between dynamic surface tension and time. The supplying includes: forming a closed space by covering the nozzle forming surface with a lid member, and freely controlling a pressure between the discharging unit and the ink storage unit; and forming an open space by opening the lid member on the nozzle forming surface, and setting the pressure to be the same as atmospheric pressure. A negative pressure difference between the ink storage unit and the discharging unit is 70-120 mmAq before discharge of the ink, 30-80 mmAq during the discharging, and the former is equal to or greater than the latter.Type: ApplicationFiled: May 25, 2023Publication date: November 30, 2023Applicant: Ricoh Company, Ltd.Inventors: Kenta Hagiwara, Shunsuke Horie, Hiroki Kobayashi
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Patent number: 11799224Abstract: It is aimed to provide a connector capable of suppressing the generation of an excessive stress in a connecting part of a flat cable and a terminal. A connector is provided with a flat cable (60) including a hole (64) serving as a receiving portion, a housing (10) including an installation surface (19) on which the flat cable (60) is arranged and a protrusion (21) projecting from the installation surface (19) and to be inserted into the hole (64), and a terminal (90) to be connected to a conductor (70) of the flat cable (60) and locked to the housing (10). The flat cable (60) includes an extra length portion (66) providing an extra length as compared to flat arrangement on the installation surface (19) in a part surrounding the protrusion (21) or a part arranged between the terminal (90) and the protrusion (21) in an assembled state.Type: GrantFiled: October 7, 2019Date of Patent: October 24, 2023Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hiroki Kobayashi, Yasuo Omori
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Publication number: 20230331413Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.Type: ApplicationFiled: June 22, 2023Publication date: October 19, 2023Inventors: HIROKI KOBAYASHI, NAOKI AZUMA, CHIKARA TAKATA, YUZO ASANO, TORU CHIKUMA, HIROSHI SATOH
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Publication number: 20230327362Abstract: A surface mount connector 10 is to be mounted on a circuit board 5 having a plate thickness direction oriented in a vertical direction, and provided with a plurality of terminals 11, a plurality of inner housings 20 for holding the plurality of terminals 11, and an outer housing 30 for accommodating the plurality of inner housings 20 in parallel. Leads 13 to be connected to the circuit board 5 are provided on lower end parts of the plurality of terminals 11. Each of the plurality of inner housings 20 is supported independently movably in the vertical direction in the outer housing 30.Type: ApplicationFiled: July 29, 2021Publication date: October 12, 2023Inventors: Hiroki KOBAYASHI, Shinji NOZAKI
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Patent number: 11780243Abstract: A liquid ejecting head includes: a plurality of head chips having nozzles; a holder holding the plurality of head chips; and a planar heater disposed on the holder and heating the holder, in which the heater includes an outer peripheral region along an outer edge of the holder and a middle region positioned inside the outer peripheral region in a plan view, and a heat generation amount per unit time of the outer peripheral region is larger than a heat generation amount per unit time of the middle region.Type: GrantFiled: May 17, 2022Date of Patent: October 10, 2023Assignee: Seiko Epson CorporationInventors: Haruhisa Uezawa, Hiroki Kobayashi, Katsuhiro Okubo, Kentaro Murakami, Takahiro Kanegae, Shingo Tomimatsu
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Publication number: 20230299535Abstract: A connector 10 of the present disclosure is provided with a plurality of terminals 30, a plurality of wires 20, a plurality of sub-housings 60, 70 and a lock member 80. The terminal 30 includes a locked portion. The sub-housings 60, 70 include cavities 61, 71 for accommodating the terminals 30 and locking portions for retaining the terminals 30 by locking the locked portions from behind. The plurality of wires 20 are respectively pulled out rearward from the plurality of terminals 30. The plurality of sub-housings 60, 70 are assembled with each other with the locked portions of the terminals 30 facing in the same direction, and held in an assembled state by the lock member 80.Type: ApplicationFiled: May 18, 2021Publication date: September 21, 2023Inventors: Hiroki KOBAYASHI, Hajime MATSUI
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Publication number: 20230282711Abstract: Group-III element nitride semiconductor substrate including a first surface and a second surface that are easy to visually distinguish from each other. An end portion is easily detected with an optical sensor, a large effective area (area that can be used in device production) can be secured, and warping of the entirety of the substrate is reduced. A Group-III element nitride semiconductor substrate includes a first surface; and a second surface, wherein the first surface is a mirror surface, the second surface has a second-surface central region and a second-surface outer peripheral region, the second-surface central region is a mirror surface, and the second-surface outer peripheral region is a non-mirror surface.Type: ApplicationFiled: February 17, 2023Publication date: September 7, 2023Inventors: Katsuhiro IMAI, Masahiro SAKAI, Hiroki KOBAYASHI
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Patent number: 11749933Abstract: A joint connector 10 to be connected to wires 11 includes a lower housing 30 and an upper cover 60. The lower housing 30 accommodates terminals 12 to be respectively connected to front end parts in an extending direction of the wires 11. The upper cover 60 is assembled to close an upper surface of the lower housing 30. The lower housing 30 or the upper cover 60 includes a lower guide portion 36 or an upper guide portion 69 for bending the wires 11 by contacting the wires 11 with the lower housing 30 and the upper cover 60 assembled.Type: GrantFiled: April 9, 2020Date of Patent: September 5, 2023Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hiroki Kobayashi, Hajime Kawase, Masaaki Tabata, Teruo Hara, Hajime Matsui
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Publication number: 20230267794Abstract: An article supply apparatus capable of supplying an article, comprises an accommodation unit in which articles are accommodated; a supply unit which supplies at least one of the articles accommodated in the accommodation unit; an operation unit capable of performing an operation in order to supply the at least one of the articles from the supply unit; a lock unit which locks the operation unit so as to make the operation to the operation unit unavailable; a control unit which releases a lock of the lock unit; and a notification control unit, capable of notifying a first state where the lock of the lock unit and a second state where the operation of the operation unit is completed, wherein a way of notification of the first state is different from that of the second state.Type: ApplicationFiled: February 21, 2023Publication date: August 24, 2023Inventors: Hajime KONDO, Hiroki KOBAYASHI, Akira MIZUSHINA
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Mounting substrate manufacturing system, component mounting system, and housing body transfer method
Patent number: 11729959Abstract: Disclosed is a mounting substrate manufacturing system including: a component mounting system including: a component mounting device; a housing body stocker that stores a housing body; a component supply device that pulls out a carrier tape from the housing body stored in the housing body stocker and transports the carrier tape to the component mounting device; and a replacement device that includes an end effector for holding the housing body, and replaces the housing body stored in the housing body stocker, wherein the housing body stocker includes at least a pair of partition members that partition a storage space for storing the housing body, at least one of the partition members adjacent to each other includes an assist portion that assists a replacement operation of replacing the housing body, and the replacement device recognizes a position for a replacement operation by bringing the end effector or the housing body held thereby into contact with the assist portion.Type: GrantFiled: April 5, 2021Date of Patent: August 15, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroki Kobayashi, Ryouji Eguchi -
Patent number: 11724842Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.Type: GrantFiled: January 6, 2023Date of Patent: August 15, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroki Kobayashi, Naoki Azuma, Chikara Takata, Yuzo Asano, Toru Chikuma, Hiroshi Satoh
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Publication number: 20230231340Abstract: A wire cover is to be mounted on a rear side in a connecting direction of a connector to be connected to a mating connector. The connector includes a plurality of female terminals disposed apart from each other in a lateral direction and a plurality of wires connected to the respective female terminals and pulled out from the rear side in the connecting direction. The wire cover includes a housing having an insertion opening through which the plurality of wires are inserted and a draw-out opening through which the plurality of wires inserted through the insertion opening are drawn out rightward, and an assisting member for assisting three-dimensional bending of the respective wires inside the housing. The respective wires are three-dimensionally bent inside the housing and drawn out through the draw-out opening by being assisted by the assisting member.Type: ApplicationFiled: May 27, 2021Publication date: July 20, 2023Inventors: Hiroki KOBAYASHI, Shunya TAKEUCHI, Teruo HARA, Hajime MATSUI, Nungna WI, Masaaki TABATA
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Patent number: 11697159Abstract: A three-dimensional shaping device includes: a discharge unit configured to discharge a shaping material; a weight measuring unit configured to measure a weight of the shaping material discharged from the discharge unit; and a control unit configured to control the discharge unit and the weight measuring unit to shape a three-dimensional shaped object by stacking layers of the shaping material in a shaping region of a stage, in which the control unit is configured to control the weight measuring unit to measure the weight of the shaping material discharged from the discharge unit, determine whether a predetermined amount of the shaping material is discharged from the discharge unit based on the weight measured by the weight measuring unit, and when it is determined that the predetermined amount of the shaping material is not discharged, control the discharge unit so that the predetermined amount of the shaping material is discharged from the discharge unit.Type: GrantFiled: November 25, 2020Date of Patent: July 11, 2023Inventors: Hiroki Kobayashi, Kazuhide Nakamura, Koichi Saito
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Publication number: 20230202185Abstract: A liquid ejecting head includes: a nozzle row configured by arranging nozzles ejecting a liquid in a first-direction in a second-direction orthogonal to the first-direction; a drive element; and stacked components defining a common liquid chamber communicating with the nozzle row, in which the stacked components include a filter partitioning the common liquid chamber into an upstream common liquid chamber and a downstream common liquid chamber, a first-case defining a first-common-liquid-chamber-portion as a part of the upstream common liquid chamber and stacked on the filter, and a second-case defining a second-common-liquid-chamber-portion as a part of the upstream common liquid chamber and stacked on the first-case, the second-common liquid-chamber-portion is positioned in a direction opposite to the first-direction from the drive element, and a width of the second-common-liquid-chamber-portion in a third-direction orthogonal to the first-direction and the second-direction is longer than a width of the firType: ApplicationFiled: December 27, 2022Publication date: June 29, 2023Inventors: Kentaro MURAKAMI, Katsuhiro OKUBO, Takahiro KANEGAE, Haruhisa UEZAWA, Hiroki KOBAYASHI
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Publication number: 20230187877Abstract: A connector is provided with a first housing, a second housing connectable to and separable from the first housing, a spring member, a first pressing portion and a second pressing portion arranged at positions to accumulate a resilient force in the spring member according to connection of the first housing and the second housing, a first pressure receiving portion and a second pressure receiving portion arranged to receive a resilient restoring force in a direction to connect the first housing and the second housing from the spring member having the resilient force accumulated therein, and a first holding portion and a second holding portion for holding the spring member in a resilient force accumulating state of accumulating the resilient force by the first pressing portion and the second pressing portion only from start to a halfway state of the connection of the first housing and the second housing.Type: ApplicationFiled: May 17, 2021Publication date: June 15, 2023Inventors: Hiroki KOBAYASHI, Tetsuya MIYAMURA, Yutaka KOBAYASHI
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Publication number: 20230187867Abstract: A connector is provided with first and second housings connectable to each other, a slider to be supported on the first housing, and a biasing member to be arranged between the slider and the first housing. The second housing includes a stopper portion for stopping a connecting operation of the first and second housings by coming into contact with a contact portion of the first housing and a slider lock receiving portion to be locked by a slider lock portion of a slider. The biasing member has a biasing force for pushing the first housing toward a connection position to the second housing when the slider lock receiving portion is locked by the slider lock portion and contact between the stopper portion and the contact portion is released.Type: ApplicationFiled: May 17, 2021Publication date: June 15, 2023Inventors: Hiroki KOBAYASHI, Tetsuya MIYAMURA, Yutaka KOBAYASHI, Teruo HARA
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Patent number: D1000397Type: GrantFiled: June 7, 2021Date of Patent: October 3, 2023Assignee: Molex, LLCInventors: Ayako Matsumoto, Hiroki Kobayashi, Kensuke Yamada