Patents by Inventor Hiroki Kudoh
Hiroki Kudoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230365766Abstract: The present invention is a thermally conductive sheet comprising: a matrix comprising an organic polymer, and a carbon fiber X, the carbon fiber X being oriented in a thickness direction of the sheet, wherein a proportion of a carbon fiber (A) having a fiber length of 100 µm or less is 40% or more and a proportion of a carbon fiber (B) having a fiber length of 200 µm or more is 3 to 13% of the carbon fiber X. According to the present invention, a thermally conductive sheet in which the thermal resistance value is effectively reduced by polishing the surface, resulting in a sheet having a low thermal resistance value can be provided.Type: ApplicationFiled: August 24, 2021Publication date: November 16, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiromichi IWAZAKI, Kentaro KIUCHI, Kenta KUROO, Hiroki KUDOH
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Publication number: 20230323181Abstract: Provided is a heat-conductive sheet including: a binder component that is a mixture of a silicone matrix (A) and a hydrocarbon compound (B); and a heat-conductive filler (C) dispersed in the binder component, wherein the heat-conductive sheet has a compression ratio at 80° C. and 0.276 MPa of 15% or more and a shape retention.Type: ApplicationFiled: July 21, 2021Publication date: October 12, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Kazuhiro NAMIKI, Hiromichi IWAZAKI, Kenta KUROO, Hiroki KUDOH
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Patent number: 11702579Abstract: A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.Type: GrantFiled: May 3, 2021Date of Patent: July 18, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki Kudoh, Tomonari Yamada
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Publication number: 20230173793Abstract: The method for producing a thermally conductive sheet according to the present invention comprises: a step (1) of obtaining a liquid composition comprising a curable silicone composition including an alkenyl group-containing organopolysiloxane and a hydrogen organopolysiloxane, a thermally conductive filler, and a volatile compound; a step (2) of sandwiching the liquid composition between two resin sheets at least one of which is a gas-permeable film and pressurizing these to obtain a sheet-shaped formed product; and a step (3) of heating the sheet-shaped formed product to volatilize at least a part of the volatile compound. According to the present invention, it is possible to provide a method for producing a thermally conductive sheet having a good sheet condition and a low thermal resistance value.Type: ApplicationFiled: May 27, 2021Publication date: June 8, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroshi UMETANI, Hiroki KUDOH
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Publication number: 20230144307Abstract: The present invention is a thermally conductive sheet comprising a plurality of unit layers, each comprising a silicone resin and a thermally conductive filler, the plurality of unit layers being laminated such that the plurality of unit layers are adhered to each other, wherein a volume content of the silicone resin is 32% by volume or less, and a compressive load at a sheet area of 25.4 mm×25.4 mm when the thermally conductive sheet is 30% compressed from a direction perpendicular to an adhesion plane on which the plurality of unit layers are adhered to each other is 7.0 kgf or less. According to the present invention, it is possible to improve the thermal conductivity and enhance the softness of a thermally conductive sheet using a silicone resin as a matrix component and composed of a large number of unit layers laminated as compared with the conventional one.Type: ApplicationFiled: May 27, 2021Publication date: May 11, 2023Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki KUDOH, Miho ISHIHARA
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Patent number: 11618247Abstract: Provided is a thermally conductive sheet having high thermal conductivity not only in a thickness direction of the sheet but also in one direction along a plane direction of the sheet. The thermally conductive sheet is a thermally conductive sheet containing a scaly filler 12 in a polymer matrix 11, wherein the scaly filler 12 is oriented such that a long axis direction of a scale surface is along one of a first direction that is a thickness direction of the thermally conductive sheet and a second direction that is perpendicular to the first direction, and a transverse axis direction that is perpendicular to the long axis direction in the scale surface is along the other of the first direction and the second direction.Type: GrantFiled: October 26, 2020Date of Patent: April 4, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki Kudoh, Miho Ishihara
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Publication number: 20220410448Abstract: An object is to provide a heat conductive sheet having good handleability when mounting between the heating element and the heat dissipator, and softness that enables the distortion of the heating element, the heat dissipator, and the like to be suppressed in use. The heat conductive sheet contains: a matrix comprising a cured product of organopolysiloxane; and heat conductive fillers comprising anisotropic fillers with their major axes oriented in the thickness direction, and has a load property P represented b formula (1) below of 0.1 to 0.7: Load property P=(F30?F20)/F10 (1) wherein F10 is a load of the heat conductive sheet at 10% compression, F20 is a load of the heat conductive sheet at 20% compression, and F30 is a load of the heat conductive sheet at 30% compression.Type: ApplicationFiled: December 2, 2020Publication date: December 29, 2022Applicant: SEKISUI POLYMATECH CO., LTD.Inventor: Hiroki KUDOH
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Publication number: 20220347996Abstract: Provided is a thermally conductive sheet having high thermal conductivity not only in a thickness direction of the sheet but also in one direction along a plane direction of the sheet. The thermally conductive sheet is a thermally conductive sheet containing a scaly filler 12 in a polymer matrix 11, wherein the scaly filler 12 is oriented such that a long axis direction of a scale surface is along one of a first direction that is a thickness direction of the thermally conductive sheet and a second direction that is perpendicular to the first direction, and a transverse axis direction that is perpendicular to the long axis direction in the scale surface is along the other of the first direction and the second direction.Type: ApplicationFiled: October 26, 2020Publication date: November 3, 2022Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki KUDOH, Miho ISHIHARA
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Publication number: 20220289932Abstract: A thermally conductive sheet comprising a scaly filler and a fibrous filler in a polymer matrix, wherein a long axis direction of a scale surface of the scaly filler and a fiber axis direction of the fibrous filler are oriented in the same direction, and a mass ratio of the scaly filler to the fibrous filler (scaly filler/fibrous filler) is 55/45 or more.Type: ApplicationFiled: September 16, 2020Publication date: September 15, 2022Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki KUDOH, Miho ISHIHARA
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Publication number: 20220018617Abstract: A heat-conducting sheet (10) has a plurality of unit layers (13) each containing a silicone resin (11) wherein the plurality of unit layers (13) are laminated so as to be adhered with each other, wherein among the plurality of unit layers (13), at least one thereof contains a heat-conducting filler, and the compression ratio of the heat-conducting sheet when being compressed at 0.276 MPa is 20 to 65%.Type: ApplicationFiled: November 18, 2019Publication date: January 20, 2022Applicant: SEKISUI POLYMATECH CO., LTD.Inventor: Hiroki KUDOH
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Publication number: 20210324255Abstract: The present invention is a thermally conductive sheet comprising a heat-conducting layer comprising a polymer matrix and an anisotropic material, the anisotropic material oriented in a thickness direction and exposed on a surface, and a heat-softening layer provided on at least one surface of the heat-conducting layer, wherein the heat-softening layer covers the anisotropic material exposed on the surface of the heat-conducting layer. According to the present invention, a thermally conductive sheet capable of preventing falling of the anisotropic material can be provided.Type: ApplicationFiled: September 4, 2019Publication date: October 21, 2021Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki KUDOH, Chien-chiao LI
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Publication number: 20210269695Abstract: A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.Type: ApplicationFiled: May 3, 2021Publication date: September 2, 2021Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki Kudoh, Tomonari Yamada
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Publication number: 20210261737Abstract: A thermally conductive sheet 10 of the present invention comprises a polymer matrix 12 and an anisotropic filler 13, and the anisotropic filler 13 is oriented in a thickness direction. The anisotropic filler 13 is disposed in such a way as to fall down in a proportion of 1 to 45% in the vicinity of surfaces 10A, 10B of the thermally conductive sheet 10. According to the present invention, a thermally conductive sheet capable of sufficiently improving the thermal conductive properties in the thickness direction can be provided.Type: ApplicationFiled: June 18, 2019Publication date: August 26, 2021Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki KUDOH, Taku SASAKI, Kana HATTORI, Kazuyuki YAHARA, Yasunari KUSAKA
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Patent number: 11084965Abstract: To provide a thermally conductive sheet that has high thermal conductivity. A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.Type: GrantFiled: April 7, 2017Date of Patent: August 10, 2021Assignee: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki Kudoh, Tomonari Yamada
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Publication number: 20210147739Abstract: The heat-dissipating composition according to the present invention comprises a polymer matrix and diamond particles. The present invention provides the heat-dissipating composition compatibly satisfying both electric insulativity and heat dissipativity.Type: ApplicationFiled: May 31, 2019Publication date: May 20, 2021Applicant: Sekisui Chemical Co., Ltd.Inventors: Masataka SUGIMOTO, Abison SCARIA, Taku SASAKI, Hidehito NISHIZAWA, Masafumi YOSHIDA, Takaaki MIZUNO, Motoki OZAWA, Tsukasa ISHIGAKI, Hiroki KUDOH
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Patent number: 11008462Abstract: A thermally conductive sheet contains a matrix composed of an organopolysiloxane having a crosslinked structure, a thermally conductive filler dispersed in the matrix, and a silicon compound. The silicon compound is at least one selected from the group consisting of alkoxysilane compounds and alkoxysiloxane compounds.Type: GrantFiled: June 25, 2018Date of Patent: May 18, 2021Assignee: SEKISUI POLYMATECH CO., LTD.Inventor: Hiroki Kudoh
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Publication number: 20210130570Abstract: A thermally conductive sheet 10 comprises a polymer matrix 12 and an anisotropic filler 13, and the anisotropic filler 13 is oriented in a thickness direction. The anisotropic filler 13 is exposed on the surfaces 10A, 10B of the thermally conductive sheet 10, and the anisotropic filler 13 which is exposed is disposed in such a way as to fall down in a proportion of 3.5 to 45%.Type: ApplicationFiled: June 18, 2019Publication date: May 6, 2021Applicant: SEKISUI POLYMATECH CO., LTD.Inventors: Hiroki KUDOH, Taku SASAKI, Kana HATTORI, Kazuyuki YAHARA, Yasunari KUSAKA
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Patent number: 10964620Abstract: To provide a thermally conductive sheet that has high thermal conductivity. A thermally conductive sheet contains carbon fibers and a flake graphite powder that are dispersed in a polymer matrix. The flake graphite powder is disposed between the carbon fibers, the fiber axis directions of the carbon fibers are oriented in a sheet thickness direction Z, long axis directions of flake surfaces of the flake graphite powder are oriented in the sheet thickness direction Z, and normal directions to the flake surfaces are randomly oriented in a surface direction of the sheet. A mass ratio of the carbon fibers to the flake graphite powder is in a range of 120:10 to 60:70. According to this thermally conductive sheet, the thermal conductivity can be increased compared to when carbon fibers are used alone or a flake graphite powder is used alone.Type: GrantFiled: February 27, 2017Date of Patent: March 30, 2021Assignee: SEKISUI POLYMATECH CO., LTD.Inventor: Hiroki Kudoh
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Publication number: 20200385577Abstract: A thermally conductive sheet contains a matrix composed of an organopolysiloxane having a crosslinked structure, a thermally conductive filler dispersed in the matrix, and a silicon compound. The silicon compound is at least one selected from the group consisting of alkoxysilane compounds and alkoxysiloxane compounds.Type: ApplicationFiled: June 25, 2018Publication date: December 10, 2020Applicant: SEKISUI POLYMATECH CO., LTD.Inventor: Hiroki KUDOH
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Publication number: 20200243414Abstract: To provide a thermally conductive sheet that has high thermal conductivity. A thermally conductive sheet contains carbon fibers and a flake graphite powder that are dispersed in a polymer matrix. The flake graphite powder is disposed between the carbon fibers, the fiber axis directions of the carbon fibers are oriented in a sheet thickness direction Z, long axis directions of flake surfaces of the flake graphite powder are oriented in the sheet thickness direction Z, and normal directions to the flake surfaces are randomly oriented in a surface direction of the sheet. A mass ratio of the carbon fibers to the flake graphite powder is in a range of 120:10 to 60:70. According to this thermally conductive sheet, the thermal conductivity can be increased compared to when carbon fibers are used alone or a flake graphite powder is used alone.Type: ApplicationFiled: February 27, 2017Publication date: July 30, 2020Applicant: SEKISUI POLYMATECH CO., LTD.Inventor: Hiroki KUDOH