Patents by Inventor Hiroki Kuriu

Hiroki Kuriu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8187683
    Abstract: An object of the present invention is to provide a multilayered polyamide-based tube for food packaging that is free from blocking in a Layer (C), and that has an excellent adherence to processed meat or like packaged food. The present invention provides a multilayered polyamide-based tube for food packaging comprising a Layer (A), a Layer (B) and a Layer (C); the multilayered polyamide-based tube having a low-temperature shrinkage ratio of 2 to 10%, and exhibiting heat shrinkage properties and gas barrier properties; the Layer (A) containing a polyamide-based resin; the Layer (B) containing a polyolefin-based resin; and the Layer (C) that comes in contact with the packaged food, the Layer (C) being a Layer (C-1) that contains a polypropylene-based resin having a heat distortion temperature (ISO 75B-1 or ISO 75B-2) of not less than 60° C. and a Vicat softening point of not less than 120° C.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: May 29, 2012
    Assignee: Gunze Limited
    Inventors: Hiroki Kuriu, Hiroyuki Yabuta
  • Publication number: 20110027511
    Abstract: An object of the present invention is to provide a multilayered polyamide-based tube for food packaging that is free from blocking in a Layer (C), and that has an excellent adherence to processed meat or like packaged food. The present invention provides a multilayered polyamide-based tube for food packaging comprising a Layer (A), a Layer (B) and a Layer (C); the multilayered polyamide-based tube having a low-temperature shrinkage ratio of 2 to 10%, and exhibiting heat shrinkage properties and gas barrier properties; the Layer (A) containing a polyamide-based resin; the Layer (B) containing a polyolefin-based resin; and the Layer (C) that comes in contact with the packaged food, the Layer (C) being a Layer (C-1) that contains a polypropylene-based resin having a heat distortion temperature (ISO 75B-1 or ISO 75B-2) of not less than 60° C. and a Vicat softening point of not less than 120° C.
    Type: Application
    Filed: March 26, 2009
    Publication date: February 3, 2011
    Applicant: GUNZE LIMITED
    Inventors: Hiroki Kuriu, Hiroyuki Yabuta
  • Patent number: 7014920
    Abstract: An anti-fogging, stretched, multilayer film comprising a layer having an anti-fogging agent incorporated therein, the film having evaluated values for anti-fogging property of 28 mm2 or more at temperatures of ?5° C. and 15° C., respectively.
    Type: Grant
    Filed: April 16, 2001
    Date of Patent: March 21, 2006
    Assignee: Gunze Limited
    Inventor: Hiroki Kuriu
  • Patent number: 6645640
    Abstract: The present invention provides a multilayered polyamide film having at least two polyamide resin layers, which develops less than 10 pinholes when evaluated for pinhole resistance by flexing it 1,000-times at 25° C. and which has an elongation of 6 mm or less at 120° C. in vertical pitch evaluation. This film has excellent resistance to pinholes and is well suited for lamination.
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: November 11, 2003
    Assignee: Gunze Limited
    Inventor: Hiroki Kuriu
  • Publication number: 20030049471
    Abstract: An anti-fogging, stretched, multilayer film comprising a layer having an anti-fogging agent incorporated therein, the film having evaluated values for anti-fogging property of 28 mm2 or more at temperatures of −5° C. and 15° C., respectively.
    Type: Application
    Filed: October 17, 2002
    Publication date: March 13, 2003
    Inventor: Hiroki Kuriu
  • Patent number: 6270866
    Abstract: The present invention provides a low temperature heat shrinkable film for labeling comprising at least one layer of a thermoplastic resin, in whose correlation diagram showing the relation between the heat shrinkage percentage Y at 80° C. in one direction and the heat shrinkage time t (1≦t≦5), the gradient Y′ is in an area between the gradients satisfying Equations 1 and 2 and the heat shrinkage percentage Y is in an area between the heat shrinkage percentages satisfying Equations 3 and 4: Y′=−1.05t2+12.05t  (Equation 1) Y′=−0.30t2+2.90t  (Equation 2) Y=−1.05t2+12.05t+40  (Equation 3) Y=−0.30t2+2.
    Type: Grant
    Filed: August 3, 1999
    Date of Patent: August 7, 2001
    Assignee: Gunze Limited
    Inventors: Tomohisa Okuda, Fusazo Wada, Hiroyuki Tanaka, Hiroki Kuriu
  • Patent number: 5688456
    Abstract: A process for preparing a multilayer film having at least one polyamide layer include the steps of forcing out from a T-die by co-extrusion a multi-layer film having a layer containing about 50 to about 95% by weight of a crystalline polyamide and about 50 to about 5% by weight of an amorphous polyamide, and stretching the film at least in the lateral direction.
    Type: Grant
    Filed: July 16, 1996
    Date of Patent: November 18, 1997
    Assignee: Gunze Limited
    Inventors: Hiroki Kuriu, Akira Mita, Kazufumi Ueno, Yoshinori Matsumoto, Yoshihiro Wada, Masaaki Iwami
  • Patent number: 5562996
    Abstract: The invention provides a multi-layer film having 1 to 4 polyamide layers, characterized in that at least one polyamide layer comprises about 50 to about 95% by weight of a crystalline polyamide and about 50 to about 5% by weight of an amorphous polyamide and that the multi-layer film is produced by stretching a flat film at least in the lateral direction; and a process for preparing the multi-layer film.
    Type: Grant
    Filed: March 30, 1995
    Date of Patent: October 8, 1996
    Assignee: Gunze Limited
    Inventors: Hiroki Kuriu, Akira Mita, Kazufumi Ueno, Yoshinori Matsumoto, Yoshihiro Wada, Masaaki Iwami