Patents by Inventor Hiroki Makagawa

Hiroki Makagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • UPPER LAYER-FORMING COMPOSITION AND PHOTORESIST PATTERNING METHOD
    Publication number: 20100003615
    Abstract: An upper layer-forming composition formed on a photoresist while causing almost no intermixing with the photoresist film and a photoresist patterning method are provided. The upper layer-forming composition is stably maintained without being eluted in a medium such as water during liquid immersion lithography and is easily dissolved in an alkaline developer. The upper layer-forming composition covers a photoresist film for forming a pattern by exposure to radiation. The composition comprises a resin dissolvable in a developer for the photoresist film and a solvent in which the resin is dissolved. The solvent has a viscosity of less than 5.2×10?3 Pa·s at 20° C. In addition, the solvent does not cause intermixing of the photoresist film and the upper layer-forming composition. The solvent contains an ether or a hydrocarbon.
    Type: Application
    Filed: October 25, 2006
    Publication date: January 7, 2010
    Applicant: JSR CORPORATION
    Inventors: Atsushi Nakamura, Hiroki Makagawa, Hiromitsu Nakashima, Takayuki Tsuji, Hiroshi Dougauchi, Daita Kouno, Yukio Nishimura