Abstract: A congestion prediction device, a congestion prediction method, and a storage medium are provided. A mapping outputs an output variable when input variables are input to the mapping. The output variable indicates a degree of congestion in a predetermined specific area. The mapping is learned in advance by machine learning. The input variables include congestion variables. Each of the congestion variables indicates a degree of congestion in the specific area at regular time intervals within a specific period. The output variable indicates a degree of congestion after a lapse of the regular time interval from an end time of the specific period.

Abstract: An isolated signal transmission device includes a resistor element and a heat flow sensor. The resistor element generates heat as a result of a current based on an inputted signal being applied to the resistor element. The heat flow sensor is provided such as to be electrically isolated from the resistor element. The heat flow sensor detects an amount of heat flowing to the heat flow sensor itself when the resistor element generates heat. The heat flow sensor outputs a signal based on the detected amount of heat.

Abstract: An isolated signal transmission device includes a resistor element and a heat flow sensor. The resistor element generates heat as a result of a current based on an inputted signal being applied to the resistor element. The heat flow sensor is provided such as to be electrically isolated from the resistor element. The heat flow sensor detects an amount of heat flowing to the heat flow sensor itself when the resistor element generates heat. The heat flow sensor outputs a signal based on the detected amount of heat.

Abstract: A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.

Abstract: A liquid crystal display provided with a liquid crystal display unit with pixels disposed on a board in a shape of matrix, a driver for supplying a signal to the respective pixels based on the display data so to display an image, and a control unit for controlling the driver, comprises switches provided in each signal line for supplying a signal from the driver to the respective pixels, and a liquid crystal display state judging unit for judging the display state on the liquid crystal display unit, thereby to on-off control the switches based on the result judged by the liquid crystal display state judging unit.

Abstract: A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.