Patents by Inventor Hiroki Miyagawa

Hiroki Miyagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180073939
    Abstract: An isolated signal transmission device includes a resistor element and a heat flow sensor. The resistor element generates heat as a result of a current based on an inputted signal being applied to the resistor element. The heat flow sensor is provided such as to be electrically isolated from the resistor element. The heat flow sensor detects an amount of heat flowing to the heat flow sensor itself when the resistor element generates heat. The heat flow sensor outputs a signal based on the detected amount of heat.
    Type: Application
    Filed: September 6, 2017
    Publication date: March 15, 2018
    Applicant: DENSO WAVE INCORPORATED
    Inventors: Hiroki MIYAGAWA, Masahiro KAMIYA
  • Patent number: 7080445
    Abstract: A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: July 25, 2006
    Assignee: Denso Corporation
    Inventors: Toshihiro Miyake, Kazuyuki Deguchi, Yoshitaro Yazaki, Hiroaki Maeda, Mitsutoshi Miyazaki, Makoto Totani, Akinari Higashida, Hiroki Miyagawa
  • Patent number: 6600484
    Abstract: A liquid crystal display provided with a liquid crystal display unit with pixels disposed on a board in a shape of matrix, a driver for supplying a signal to the respective pixels based on the display data so to display an image, and a control unit for controlling the driver, comprises switches provided in each signal line for supplying a signal from the driver to the respective pixels, and a liquid crystal display state judging unit for judging the display state on the liquid crystal display unit, thereby to on-off control the switches based on the result judged by the liquid crystal display state judging unit.
    Type: Grant
    Filed: October 19, 2000
    Date of Patent: July 29, 2003
    Assignee: NEC Corporation
    Inventor: Hiroki Miyagawa
  • Publication number: 20030079341
    Abstract: A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.
    Type: Application
    Filed: October 31, 2002
    Publication date: May 1, 2003
    Inventors: Toshihiro Miyake, Kazuyuki Deguchi, Yoshitaro Yazaki, Hiroaki Maeda, Mitsutoshi Miyazaki, Makoto Totani, Akinari Higashida, Hiroki Miyagawa